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91. 发明授权

US5297897A Single-strip molding apparatus 失效
标题翻译：单条成型设备
公开(公告)号：US5297897A
公开(公告)日：1994-03-29
申请号：US858979
申请日：1992-05-20
申请人： Johannes L. G. M. Venrooij , Wouter B. Verwoerd , Wilhelmus H. J. Harmsen
发明人： Johannes L. G. M. Venrooij , Wouter B. Verwoerd , Wilhelmus H. J. Harmsen
IPC分类号： B22D17/26 , B29C31/06 , B29C31/08 , B29C33/72 , B29C37/00 , B29C43/02 , B29C43/18 , B29C43/34 , B29C43/36 , B29C43/50 , B29C45/02 , B29C45/14 , B29C45/17 , B29C45/42 , B29C45/66 , B29C45/67 , B29L31/34 , B30B1/10 , B30B1/32 , B30B15/00 , B30B15/14 , H01C17/00 , H01C17/28 , H01G13/00 , H01L21/00 , B29C45/76
CPC分类号： H01L21/67126 , B29C31/066 , B29C33/72 , B29C37/0007 , B29C43/02 , B29C43/34 , B29C45/021 , B29C45/14655 , B29C45/1753 , B29C45/42 , B29C45/661 , B29C45/6707 , B30B1/103 , B30B1/323 , B30B15/0082 , B30B15/148 , B29C2043/3283 , B29C2043/3444 , B29C2043/5833 , B29C2045/662 , B29C31/08 , B29C33/20 , B29C43/32 , B29C70/72 , B29K2105/251 , Y10S425/228
摘要： An apparatus for molding electronic components. The single-strip molding apparatus has a mold die formed from two mold halves which are movable relative to each other and can be closed upon one another. A leadframe for the component to be molded is placed into a recess in one of the mold halves. Molding material is heated and forced under pressure into the recess containing the leadframe. After the component is molded the mold is opened and the upper half of the mold is cleaned by a combined cleaning-discharge unit. Upon the return stroke of the cleaning-discharge unit, the molded component is removed and the lower half of the mold is cleaned.
摘要翻译： PCT No.PCT / EP90 / 02032 Sec。 371日期：1992年5月20日 102（e）日期1992年5月20日PCT提交1990年11月23日PCT公布。出版物WO91 / 08095 日期1991年6月13日。一种用于模制电子元件的设备。单条带成型装置具有由两个半模形成的模具，它们可相对于彼此移动并且可以相互封闭。将要成型的部件的引线框架放置在其中一个半模中的凹部中。将成型材料加热并在压力下被压入含有引线框架的凹槽中。在模制成型之后，模具打开，并且模具的上半部分通过组合的清洁 - 排出单元来清洁。在清洁排放单元的返回行程时，去除模制部件并清洁模具的下半部分。

92. 发明授权

US5084694A Detection elements and production process therefor 失效
标题翻译：检测要素及其生产工艺
公开(公告)号：US5084694A
公开(公告)日：1992-01-28
申请号：US542929
申请日：1990-06-25
申请人： Toru Kikuchi , Yasuhito Yajima
发明人： Toru Kikuchi , Yasuhito Yajima
IPC分类号： G01P5/12 , F02D35/00 , G01F1/68 , G01F1/692 , H01C1/142 , H01C1/146 , H01C17/28
CPC分类号： H01C1/142 , H01C1/146 , H01C17/281 , Y10T29/49082 , Y10T29/49083 , Y10T29/49085 , Y10T29/49099
摘要： A detection element including a cylindrical base body, an electric resistor formed on an outer peripheral surface of the base body, and lead wires attached to ends of the base body. The lead wires are electrically connected to the electric resistor. An electrically thick film is provided over end faces of the base body, an inner peripheral surface and an outer peripheral surface of the base body near each of the opposite ends of the base body, and the lead wires are electrically connected to the resistor at least through the electrically conductive thick film. A process for producing such a detecting element including forming an electric resistor on an outer periphery of a cylindrical base body; coating a paste onto end faces of the base body and inner and outer peripheral surfaces of the base body near each of the end faces; forming the electrically conductive thick film electrically connected to the electrical resistor by firing the electrically conductive thick film-forming paste; and fixing the lead wires to the end portions of the base body and forming electrically conductive portions where the lead wire is electrically connected to the electrically conductive thick film.
摘要翻译：一种检测元件，包括圆筒形基体，形成在基体的外周表面上的电阻器和连接到基体端部的引线。引线与电阻电连接。在基体的端面，基体的内周面和外周面之间，在基体的各个相对端附近设置有电厚膜，并且引线至少与电阻器电连接通过导电厚膜。一种用于制造这种检测元件的方法，包括在圆柱形基体的外周上形成电阻器; 在每个端面附近在基体的端面和基体的内周表面和外周表面上涂覆糊状物; 通过烧制所述导电厚膜形成膏形成与所述电阻器电连接的所述导电厚膜; 并且将引线固定到基体的端部并且形成导线与导电厚膜电连接的导电部分。

93. 发明授权

US4910492A Electric laminar resistor and method of making same 失效
标题翻译：电层流电阻及其制作方法
公开(公告)号：US4910492A
公开(公告)日：1990-03-20
申请号：US335960
申请日：1989-04-10
申请人： Kristian Iversen , Per G. Zacho
发明人： Kristian Iversen , Per G. Zacho
IPC分类号： H01C17/242 , H01C1/14 , H01C7/00 , H01C17/06 , H01C17/12 , H01C17/28
CPC分类号： H01C7/006 , H01C17/12 , H01C17/281 , H01C17/283 , Y10T29/49082
摘要： An electric laminar resistor and the method of making same wherein a thin metal film is applied to a ceramic substrate. Metal film material is removed to form a resistance track and recessed connecting zones at opposite ends of the track. A burnt-in thick layer paste is extended through the connecting zone recesses and solidified to form connecting elements that are adhered to the substrate. A glass frit coating is applied over the resistance track, but not over the connecting elements. The resistance of the resistor may be adjusted by separating a part of the track.

94. 发明授权

US4884053A Surface mount wirewound resistor and method of making the same 失效
标题翻译：表面贴装线绕电阻及其制作方法
公开(公告)号：US4884053A
公开(公告)日：1989-11-28
申请号：US236718
申请日：1988-08-26
申请人： Gary E. Bougger
发明人： Gary E. Bougger
IPC分类号： H01C1/14 , H01C1/148 , H01C3/00 , H01C3/14 , H01C17/00 , H01C17/28
CPC分类号： H01C3/00 , H01C1/148 , H01C17/006
摘要： A surface mount wirewound resistor having a conventional wirewound resistor embedded in a plastic body member with terminal axial leads of the resistor being severed at the opposite ends of the body member. A U-shaped metallic terminal pad or clip is secured to the ends of the body member and is in electrical contact with the severed ends of the axial leads. The upper and lower portions of the terminal pad are in coplanar relationship with the upper and lower surfaces of the body member. An alternate surface mount wirewound resistor has metallic tabs that extend from the resistance element embedded in the plastic body member, with the tabs being bent upwardly from the ends thereof and into coplanar relationship with the upper surface of the body member. The method of making a surface mount wirewound resistor entails embodying the resistor having axial leads within a plastic body member, severing the axial leads at the opposite ends of the body member, and then placing terminal pads on the ends of the body member in contact with the severed axial leads. An alternate method suspends the resistor without axial leads between opposite sides of a metallic lead frame by securing the end caps of the resistance element to protruding terminal tabs. The resistance element is then embedded in a plastic body member, the terminal tabs are then severed from the lead frame and bent into coplanar relationship with the upper surface of the body member.
摘要翻译：一种表面安装线绕电阻器，其具有嵌入在塑料本体构件中的常规绕线电阻器，其中电阻器的端子轴向引线在主体构件的相对端处被切断。 U形金属端子垫或夹子固定到本体构件的端部并与轴向引线的切断端电接触。端子垫的上部和下部与本体构件的上表面和下表面共面关系。替代的表面安装线绕电阻器具有从嵌入在塑料本体构件中的电阻元件延伸的金属突片，其中突片从其端部向上弯曲并且与主体构件的上表面成共面关系。制造表面安装线绕电阻器的方法需要体现在塑料本体构件内具有轴向引线的电阻器，在主体构件的相对端处切断轴向引线，然后将端子焊盘放置在与本体构件的端部接触的端部切断的轴向引线。一种替代方法是通过将电阻元件的端盖固定到突出的端子接头上，将电阻器悬挂在金属引线框架的相对侧之间没有轴向引线。然后将电阻元件嵌入塑料本体构件中，然后将端子突片从引线框架切断并弯曲成与主体构件的上表面共面关系。

95. 发明授权

US4797993A Method of making electroweldable sockets 失效
标题翻译：制造电焊插座的方法
公开(公告)号：US4797993A
公开(公告)日：1989-01-17
申请号：US74949
申请日：1987-07-17
申请人： David M. A. Kenworthy , Eric Bridgstock , Edwin A. W. Dunkey
发明人： David M. A. Kenworthy , Eric Bridgstock , Edwin A. W. Dunkey
IPC分类号： H01R43/00 , B29C45/14 , B29C47/02 , B29C47/32 , B29C70/72 , B29D23/00 , H01C17/02 , B23P19/04 , H01C17/04 , H01C17/28
CPC分类号： B29D23/005 , B29C45/14 , B29C47/02 , B29C47/025 , B29C47/028 , B29C47/32 , B29C70/72 , B29C47/0016 , B29C47/0023 , B29C47/0066 , B29L2031/24 , Y10T29/49087 , Y10T29/49096 , Y10T29/49101 , Y10T29/49888 , Y10T403/477
摘要： The invention relates to electroweldable sockets. Previously the predominant method of manufacture has been by injection molding which while producing a socket of acceptable quality it is expensive and relatively slow. The objective of the invention is to provide an alternative method of manufacture that is relatively inexpensive and relatively quick and yet does not sacrifice quality, which objective is met by a method comprising winding a length of electrical resistance wire (10) on to a transversely-split bobbin-type mandrel (2), leaving the ends (11) of the wire upstanding from the body part of the mandrel, passing the mandrel through the head (6) of an extrusion plastic processing machine to deposit plastic material (17) around the body part of the mandrel between the flanged ends, and to leave exposed the ends of the wire passing through the wall of the socket exposed, and removing the split mandrel from within the socket after it has emerged from the extrusion head, leaving the winding of resistance wire embedded in the surface of the bore of the socket.
摘要翻译：本发明涉及电焊接插座。以前，主要的制造方法是通过注塑成型，而在生产可接受质量的插座时，它是昂贵的并且相对较慢。本发明的目的是提供一种替代的制造方法，其相对便宜且相对快速且不牺牲质量，该目的通过包括将一段电阻线（10）缠绕到横向上的方法来实现，分离的筒管型心轴（2），使线材的端部（11）从心轴的主体部分直立，使心轴穿过挤出塑料加工机的头部（6）以将塑料材料（17）周围在法兰端部之间的心轴的主体部分，并且暴露出穿过插座的壁的电线的端部暴露出来，并且在从挤压头出来之后将插芯从插座中移出，离开绕组的电阻线嵌入插座孔的表面。

96. 发明授权

US4788524A Thick film material system 失效
标题翻译：厚膜材料系统
公开(公告)号：US4788524A
公开(公告)日：1988-11-29
申请号：US090192
申请日：1987-08-27
申请人： Thomas Ozaki
发明人： Thomas Ozaki
IPC分类号： H01C17/02 , H01C17/065 , H01C17/24 , H01C17/28 , H01C1/012
CPC分类号： H01C17/283 , H01C17/02 , H01C17/0654 , H01C17/24 , H01C17/281
摘要： A material system for manufacturing thick film resistors on a ceramic dielectric substrate is disclosed. The system includes the application and fixing of resistor terminations composed of a precious conductor material to a dielectric substrate. Resistor material is deposited over portions of the resistor terminations and to the dielectric substrate intermediate the resistor terminations. Terminal pads, conductor traces and resistor interconnections are printed on the dielectric substrate using a base conductor material. The resistor interconnections are deposited and fixed to the resistor terminations and to portions of the resistor material. The resistor material is trimmed to tolerance by kerfing the resistor material and a dielectric encapsulant is applied substantially over the resistor interconnections and resistor material.
摘要翻译：公开了一种在陶瓷电介质基片上制造厚膜电阻的材料系统。该系统包括将由贵重导体材料构成的电阻器端子的应用和固定到电介质基板。电阻器材料沉积在电阻器端子的部分上并且沉积在电阻器端子之上的电介质基板上。端子焊盘，导体迹线和电阻互连使用基底导体材料印刷在电介质基片上。电阻器互连被沉积并固定到电阻器端子和电阻器材料的部分。电阻材料通过切割电阻材料进行修整以使其公差，并且电介质密封剂基本上施加在电阻器互连和电阻材料上。

97. 发明授权

US4647815A Resistors for use in cathode ray tubes 失效
标题翻译：用于阴极射线管的电阻器
公开(公告)号：US4647815A
公开(公告)日：1987-03-03
申请号：US717809
申请日：1985-03-29
申请人： Yoshirou Ishikawa , Kazuyuki Ohta , Shinobu Mitsuhashi
发明人： Yoshirou Ishikawa , Kazuyuki Ohta , Shinobu Mitsuhashi
IPC分类号： H01J29/50 , H01C7/00 , H01C7/22 , H01C13/00 , H01C17/28 , H01J29/96 , H01J23/16
CPC分类号： H01C17/281 , H01C7/22 , H01J29/96
摘要： A resistor for use in a cathode ray tube comprises an insulating plate provided thereon with at least first and second electrode terminals for use respectively with relatively high and low voltages in the cathode ray tube, a coating insulator provided on the insulating plate for covering the same, and a resistive layer provided in a predetermined pattern on the insulating plate between first and second electrode terminals to be covered by the coating insulator and accompanied with a piece of conductive layer provided on the insulating plate at an area between first and second electrode terminals including a high potential difference position where a relatively large potential difference is applied to the coating insulator when the resistor is used in the cathode ray tube.
摘要翻译：用于阴极射线管的电阻器包括设置在其上的至少第一和第二电极端子的绝缘板，分别用于阴极射线管中具有相对较高和较低电压的绝缘板，设置在绝缘板上用于覆盖阴极射线管的绝缘板以及在第一和第二电极端子之间的绝缘板上以预定图案设置的电阻层，以被被覆绝缘体覆盖并且伴随着在第一和第二电极端子之间的区域处设置在绝缘板上的一块导电层，包括当在阴极射线管中使用电阻器时，对涂覆绝缘体施加相对较大的电位差的高电位差位置。

98. 发明授权

US4540604A Thick film conductor compositions 失效
标题翻译：厚膜导体组成
公开(公告)号：US4540604A
公开(公告)日：1985-09-10
申请号：US690454
申请日：1985-01-10
申请人： Vincent P. Siuta
发明人： Vincent P. Siuta
IPC分类号： H01B1/16 , H01C17/28 , H01L21/48 , H05K1/09 , B05D5/12
CPC分类号： H01C17/283 , H01B1/16 , H01L21/4867 , H05K1/092 , Y10T29/49082 , Y10T29/49099 , Y10T29/49117 , Y10T29/49124
摘要： A copper-containing thick film conductor composition comprising a mixture of finely divided particles of (a) a conductive material containing copper metal, (b) inorganic binder and (c) 0.2-5% wt. of a noncuprous metal selected from the group consisting of tungsten, molybdenum, rhenium and alloys and mixtures thereof all dispersed in organic medium. The metal particles must be within certain narrow ranges of particle size.
摘要翻译：一种含铜厚膜导体组合物，其包含（a）含铜金属的导电材料，（b）无机粘合剂和（c）0.2-5重量％选自钨，钼，铼的合金及其合金及其混合物的全部分散在有机介质中的非合金金属。金属颗粒必须在一定的窄范围内。

99. 发明授权

US4525238A Process for manufacturing an electric circuit intended for firing a pyrotechnic device and the circuit thus obtained 失效
标题翻译：用于制造用于点燃烟火装置的电路和由此获得的电路的方法
公开(公告)号：US4525238A
公开(公告)日：1985-06-25
申请号：US559464
申请日：1983-12-08
申请人： Claude Flassayer , Bernard Le Grives , Paul R. Simon
发明人： Claude Flassayer , Bernard Le Grives , Paul R. Simon
IPC分类号： F42B3/12 , H01C3/12 , H01C17/28 , H05K1/09 , H05K1/16 , H05K3/06 , H05K3/42 , H01L21/306
CPC分类号： H05K1/167 , F42B3/13 , H01C17/28 , H01C3/12 , H05K1/09 , H05K2201/0355 , H05K2201/09263 , H05K2203/0542 , H05K3/062 , H05K3/428 , Y10T29/49099
摘要： The process is for manufacturing an electric circuit which comprises an electric element for firing a pyrotechnic device, in which a sheet (1) made from an electrically resistant material is fixed to an electrically insulating support (3), and in which two conducting zones (12a, 12b) separated by an electrically resistant element (13) are then etched on this sheet.This process comprises the following steps:a fine nickel layer and then a fine copper layer are applied to the sheet (1), after which;a hole (7) is pierced through the assembly,a fine copper layer is deposited on the assembly, a protecting mask is deposited in the openings etched in the resistive sheet, a copper layer (10) then a tin-lead layer are deposited in the hole (7) and on both faces of the assembly,the protecting mask is removed and the fine copper layer which was protected by the mask is stripped by chemical action and,the external tin-lead layer is removed by chemical action.The invention applies more especially to improving the reliability and safety of firing an electric munition firing device.
摘要翻译：该方法用于制造电路，其包括用于点燃烟火装置的电气元件，其中由电阻材料制成的片材（1）固定到电绝缘支撑件（3）上，并且其中两个导电区域 12a，12b）被电阻元件（13）分离，然后在该片材上被蚀刻。该方法包括以下步骤：将细镍层，然后将细铜层施加到片材（1）上，之后，一个孔（7）穿过组件，细铜层被沉积在组件上，保护掩模沉积在蚀刻在电阻片中的开口中，铜层（10）然后将锡铅层沉积在孔（7）并且在组件的两个面上，除去保护罩，通过化学作用剥离由掩模保护的细铜层，并且通过化学作用去除外部锡铅层。本发明尤其适用于提高点火装置的可靠性和安全性。

100. 发明授权

US4521329A Copper conductor compositions 失效
标题翻译：铜导体组成
公开(公告)号：US4521329A
公开(公告)日：1985-06-04
申请号：US505730
申请日：1983-06-20
申请人： Vincent P. Siuta , Joel Slutsky
发明人： Vincent P. Siuta , Joel Slutsky
IPC分类号： B22F1/00 , B22F7/04 , C03C17/06 , H01B1/16 , H01B1/22 , H01C1/14 , H01C17/28 , H05K1/09 , H01B1/02
CPC分类号： H05K1/092 , H01B1/16 , H01C17/283
摘要： Thick film conductor compositions comprising finely divided particles of copper oxide-coated copper and low softening point inorganic binder dispersed in a low-resin organic medium. Additional copper oxide is incorporated into the composition by either direct addition or by inclusion in the inorganic binder.
摘要翻译：包含分散在低树脂有机介质中的细分散的氧化铜涂覆的铜颗粒和低软化点无机粘合剂的厚膜导体组合物。通过直接添加或通过包含在无机粘合剂中将另外的氧化铜引入组合物中。

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