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1. 发明申请

US20230110573A1 THREE DIMENSIONAL PRINTED RESISTOR FOR DOWNHOLE APPLICATIONS 有权
公开(公告)号：US20230110573A1
公开(公告)日：2023-04-13
申请号：US18065712
申请日：2022-12-14
申请人： Schlumberger Technology Corporation
发明人： Swapna Arun Kumar , Srinand Karuppoor
IPC分类号： H05K1/16 , H05K1/02 , B22F10/00 , H01C1/01 , H01C7/00
摘要： Aspects of the disclosure relate to apparatus and methods for producing a downhole electrical component, having steps of providing a non-conductive polymer substrate, establishing an active area on the non-conductive polymer substrate, patterning the active area on the non-conductive polymer substrate with a conductive material through an additive manufacturing process and incorporating the patterned non-conductive polymer substrate into a final arrangement.

2. 发明授权

US11533809B2 Three dimensional printed resistor for downhole applications 有权
公开(公告)号：US11533809B2
公开(公告)日：2022-12-20
申请号：US16599554
申请日：2019-10-11
申请人： Schlumberger Technology Corporation
发明人： Swapna Arun Kumar , Srinand Karuppoor
IPC分类号： H05K1/16 , H05K1/02 , B22F10/00 , H01C1/01 , H01C7/00
摘要： Aspects of the disclosure relate to apparatus and methods for producing a downhole electrical component, having steps of providing a non-conductive polymer substrate, establishing an active area on the non-conductive polymer substrate, patterning the active area on the non-conductive polymer substrate with a conductive material through an additive manufacturing process and incorporating the patterned non-conductive polymer substrate into a final arrangement.

3. 发明申请

US20220399140A1 CHIP COMPONENT 有权
公开(公告)号：US20220399140A1
公开(公告)日：2022-12-15
申请号：US17752200
申请日：2022-05-24
申请人： KOA CORPORATION
发明人： Naoto OKA
IPC分类号： H01C7/00 , H01C1/142
摘要： A chip resistor including: a rectangular parallelepiped insulating substrate; a strip-shaped resistor; a pair of front electrodes formed on a front surface of the resistor at both ends in the longitudinal direction; an insulating protective layer; and a pair of end face electrodes formed at both ends of the insulating substrate in the longitudinal direction, each of which is connected to each end face of the resistor, corresponding one of the front electrodes, and protective film; and a pair of external electrodes, wherein a cross-sectional shape of each of the front electrodes is almost a triangle in which a side of the end face has a maximum height, and a shape of an end face of each of the end face electrodes is almost a square.

4. 发明授权

US11460359B2 Strain gauge 有权
公开(公告)号：US11460359B2
公开(公告)日：2022-10-04
申请号：US16763345
申请日：2018-11-01
申请人： MINEBEA MITSUMI Inc.
发明人： Eiji Misaizu , Shigeyuki Adachi , Kosuke Kitahara , Toshiaki Asakawa , Atsushi Kitamura
IPC分类号： G01L1/22 , H01C1/01 , H01C7/00
摘要： A strain gauge includes a flexible substrate; and resistors each formed of a Cr composite film. The resistors include a first resistor and a second resistor that are formed on one side of the substrate, and include a third resistor and a fourth resistor that are formed on another side of the substrate. The first resistor, the second resistor, the third resistor, and the fourth resistor constitute a Wheatstone bridge circuit.

5. 发明申请

US20220293308A1 RESISTOR GEOMETRY 有权
公开(公告)号：US20220293308A1
公开(公告)日：2022-09-15
申请号：US17636099
申请日：2020-08-19
申请人： PRAGMATIC PRINTING LTD.
发明人： Richard PRICE , Robert MANN
IPC分类号： H01C17/00 , H01C7/00 , H01C17/075 , H01L49/02
摘要： A thin-film resistor and a method for fabricating a thin-film resistor are provided. The thin-film resistor comprises a first terminal, a second terminal, and a resistor body providing a resistive current path between the first terminal and the second terminal, and the method comprises depositing a first layer of conductive material onto at least one of the supporting structure and the resistor body, applying a first lithographic mask to the first layer, and etching the first layer to form the first terminal; and depositing a second layer of conductive material onto at least one of the supporting structure and the resistor body, applying a second lithographic mask to the second layer, and etching the second layer to form the second terminal, wherein the first lithographic mask is different to the second lithographic mask, and a lateral separation of the first terminal and the second terminal is less than an in-plane minimum feature size of the first and second lithographic masks

6. 发明申请

US20220230788A1 CHIP RESISTOR AND METHOD FOR MANUFACTURING SAME 有权
公开(公告)号：US20220230788A1
公开(公告)日：2022-07-21
申请号：US17584788
申请日：2022-01-26
申请人： KOA CORPORATION
发明人： Kazuhisa USHIYAMA
IPC分类号： H01C1/14 , H01C7/00 , H01C17/00
摘要： A glass protective film 4 is formed such that boundaries of top surface electrodes 3a and 3b do not exist at the base of corner portions of the rectangular glass protective film 4 so as to eliminate level differences generating due to thicknesses of the electrodes. Use of such a structure may resolve the problem that when printing glass paste individually over chip elements of a chip resistor on a large substrate from which multiple chips will be obtained, corner portions of the glass protective film bleed (flow) to the outer side (dividing grooves).

7. 发明申请

US20220165459A1 CHIP RESISTOR 有权
公开(公告)号：US20220165459A1
公开(公告)日：2022-05-26
申请号：US17430204
申请日：2020-02-27
申请人： ROHM CO., LTD.
发明人： Takanori SHINOURA
IPC分类号： H01C1/14 , H01C7/00 , H01C17/00 , H01C17/28
摘要： A chip resistor includes a substrate, two top electrodes, a resistor element, two back electrodes, and two side electrodes. The substrate has a top surface, a back surface and two side surface. The top and back surfaces face away in the thickness direction of the substrate. The side surfaces, spaced apart in a predetermined direction orthogonal to the thickness direction, are connected to the top and back surfaces. The top electrodes, spaced apart in the predetermined direction, are in contact with the top surface. The resistor element, disposed on the top surface, is connected to the top electrodes. The back electrodes, spaced apart in the predetermined direction, are in contact with the back surface. The side electrodes, held in contact with the side surfaces, are connected to the top and back electrodes. Each back electrode has a first and a second layer. The first layer is in contact with the back surface. The second layer, covering a part of the first layer, is made of a material containing metal particles and synthetic resin.

8. 发明授权

US11340119B2 Sensor body and method of manufacturing sensor body 有权
公开(公告)号：US11340119B2
公开(公告)日：2022-05-24
申请号：US16441232
申请日：2019-06-14
申请人： Yazaki Corporation
发明人： Kazuyuki Matsunaga , Keisuke Yamauchi , Toshirou Mochizuki
IPC分类号： G01K1/08 , G01K7/22 , H01C1/01 , H01C7/00 , H01C17/00
摘要： A method of manufacturing a sensor body used in an oil temperature sensor includes mounting a thermistor on a scheduled first resin mold portion and a scheduled second resin mold portion. The manufacturing method includes molding the scheduled first resin mold portion, the scheduled second resin mold portion, and the thermistor to form a resin mold portion. The manufacturing method includes cutting connecting portions, after the resin mold portion is formed, and separating a scheduled first-terminal-portion forming portion and a scheduled second-terminal-portion forming portion.

9. 发明申请

US20220130579A1 METHOD OF MANUFACTURING THERMISTOR 有权
公开(公告)号：US20220130579A1
公开(公告)日：2022-04-28
申请号：US17429758
申请日：2020-01-31
申请人： MITSUBISHI MATERIALS CORPORATION
发明人： Takehiro Yonezawa , Satoko Higano
IPC分类号： H01C7/00 , H01C17/00 , H01C17/065 , H01C1/142
摘要： The present invention is provided with a base electrode layer forming step of forming a base electrode layer on both surfaces of a thermistor wafer formed of a thermistor material, a chip forming step of obtaining a thermistor chip with a base electrode layer by cutting the thermistor wafer to form chips, a protective film forming step of forming a protective film formed of an oxide on an entire surface of the thermistor chip with a base electrode layer, a cover electrode layer forming step of forming a cover electrode layer by applying and sintering a conductive paste on an end surface of the thermistor chip with a base electrode layer, and a conduction heat treatment step of performing a heat treatment such that the base electrode layer and the cover electrode layer are electrically conductive, in which the electrode portion is formed.

10. 发明申请

US20220093294A1 RESISTOR 有权
公开(公告)号：US20220093294A1
公开(公告)日：2022-03-24
申请号：US17424752
申请日：2020-01-28
申请人： ROHM CO., LTD.
发明人： Yoichi GOTO
IPC分类号： H01C1/148 , H01C7/00
摘要： A resistor includes a resistive element, an insulation plate, a protective film, and a pair of electrodes. The resistive element includes a first face and a second face arranged to face in opposite directions in a thickness direction. The insulation plate is on the first face, and the protective film on the second face. The electrodes are spaced apart in a first direction perpendicular to the thickness direction, and held in contact with the resistive element. Each electrode includes a bottom portion opposite to the insulation plate with respect to the resistive element in the thickness direction. Each bottom portion overlaps with a part of the protective film as viewed in the thickness direction. The resistor further includes a pair of intermediate layers spaced apart in the first direction. The intermediate layers are formed of a material electrically conductive and containing a synthetic resin. Each intermediate layer includes a cover portion covering a part of the protective film. The cover portion of each intermediate layer is disposed between the protective film and the bottom portion of one of the electrodes.

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