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91. 发明申请

US20130141850A1 CAPACITOR DEVICE AND METHOD FOR MANUFACTURING SAME 有权
标题翻译：电容器及其制造方法
公开(公告)号：US20130141850A1
公开(公告)日：2013-06-06
申请号：US13816388
申请日：2011-07-20
申请人： Ikufumi Honda , Nobukatsu Abe , Tsubasa Abe
发明人： Ikufumi Honda , Nobukatsu Abe , Tsubasa Abe
IPC分类号： H01G4/38 , H01G2/02
CPC分类号： H01G4/38 , H01G2/02 , H01G2/04 , H01G2/10 , H01G11/10 , H01G11/82 , Y02E60/13 , Y10T29/43
摘要： An object of the invention is to provide a capacitor device that can be made slimmer and lighter and that enables the strength and heat dissipation properties to be improved. A capacitor device (1) has a plurality of capacitor units (2) integrally housed within a housing case (3), the housing case (3) having cylindrical housing sections (5) for housing the capacitor bodies. The housing sections (5) are longitudinally aligned in the same direction and are joined together as an integrated whole. A capacitor unit (2) is inserted via an opening (9) at one end of each of the housing sections (5) so that the entire circumference of the capacitor unit (2) is covered by the corresponding housing section (5). The housing sections (5) have a uniform thickness at least on the outer side along the outer periphery of the capacitor units.
摘要翻译：本发明的一个目的是提供一种可以变得更薄和更轻的电容器装置，并且能够提高强度和散热性能。电容器装置（1）具有一体地容纳在壳体（3）内的多个电容器单元（2），壳体（3）具有用于容纳电容器体的圆柱形壳体部分（5）。壳体部分（5）在相同的方向上纵向排列并且作为整体结合在一起。电容器单元（2）经由每个壳体部分（5）的一端处的开口（9）插入，使得电容器单元（2）的整个圆周被相应的容纳部分（5）覆盖。壳体部分（5）至少沿着电容器单元的外周的外侧具有均匀的厚度。

92. 发明申请

US20080106854A1 Lead frame, method of manufacturing a face-down terminal solid electrolytic capacitor using the lead frame, and face-down terminal solid electrolytic capacitor manufactured by the method 有权
标题翻译：引线框架，使用引线框架制造面朝下端子固体电解电容器的方法以及通过该方法制造的面朝下端子固体电解电容器
公开(公告)号：US20080106854A1
公开(公告)日：2008-05-08
申请号：US11593217
申请日：2006-11-06
申请人： Masami Ishijima
发明人： Masami Ishijima
IPC分类号： H01G9/012 , H01G2/02 , B29C65/00
CPC分类号： H01G9/012 , H01G2/065 , H01G9/10 , Y10T29/41 , Y10T29/417 , Y10T156/1052
摘要： In a lead frame for use in fabricating a face-down terminal solid electrolytic capacitor having a capacitor element an anode terminal, and a cathode terminal, a frame body has a connecting portion for being connected to the capacitor element. The connecting portion extends from a cathode terminal forming portion in a first direction to a position near an anode terminal forming portion. The anode terminal forming portion is connected to the frame body and used for forming the anode terminal. The cathode terminal forming portion is connected to the frame body and used for forming the cathode terminal. The anode terminal forming and the cathode terminal forming portions are spaced to each other in the first direction on a principal surface of the frame body.
摘要翻译：在用于制造具有电容器元件的阳极端子和阴极端子的面朝下端子固体电解电容器的引线框架中，框体具有用于连接到电容器元件的连接部分。连接部从第一方向的阴极端子形成部延伸到靠近阳极端子形成部的位置。阳极端子形成部分连接到框体并用于形成阳极端子。阴极端子形成部分连接到框体并用于形成阴极端子。阳极端子形成部分和阴极端子形成部分在框体的主表面上沿第一方向彼此间隔开。

93. 发明授权

US5563763A Capacitor 失效
标题翻译：电容器
公开(公告)号：US5563763A
公开(公告)日：1996-10-08
申请号：US490008
申请日：1995-06-13
申请人： Claes-Goran Johansson , Olle Winroth
发明人： Claes-Goran Johansson , Olle Winroth
IPC分类号： G10K11/16 , H01G20060101 , H01G2/02 , H01G4/224 , H01G4/232 , H01G4/30
CPC分类号： H01G4/224
摘要： A capacitor for temporary storage of electrical energy comprising at least two capacitor elements (2) composed of electrodes (5) which are separated by one or more dielectrics (6), and especially a power capacitor for high voltage. When the capacitor is being loaded, electrostatic forces give rise to mechanical forces between the electrodes in the capacitor. The forces give rise to vibrations which radiate as sound from the surface of the capacitor. Between, or adjacent to, packages (10) of compressed capacitor elements (2), there are placed one or more active or passive spring elements (11), which are adapted to change the natural frequencies of the capacitor. In this way, the oscillation resistance of the capacitor may be changed at the frequency ranges where the force is acting. The vibrations in the surface layer of the capacitor decrease, resulting in reduced sound radiation from the capacitor.
摘要翻译：一种用于临时存储电能的电容器，包括由电极（5）组成的至少两个由一个或多个电介质（6）分离的电容器元件（2），特别是用于高电压的功率电容器。当电容器被加载时，静电力在电容器中的电极之间产生机械力。力产生作为声音从电容器表面辐射的振动。在压缩电容器元件（2）的封装（10）之间或邻近的位置处，放置有一个或多个有源或无源弹簧元件（11），其适于改变电容器的固有频率。以这种方式，可以在力作用的频率范围内改变电容器的振荡电阻。电容器表层的振动减小，从而降低了电容器的声辐射。

94. 发明授权

US5041696A Chip component for fastening to a circuit board, comprising an electrical or electronic function member 失效
标题翻译：用于紧固到电路板的芯片部件，包括电气或电子功能部件
公开(公告)号：US5041696A
公开(公告)日：1991-08-20
申请号：US341220
申请日：1989-04-21
申请人： Ferdinand Utner
发明人： Ferdinand Utner
IPC分类号： H01G4/12 , H01C1/02 , H01C17/00 , H01C17/02 , H01G2/02 , H01G2/06 , H01G4/18 , H01G4/224 , H01G4/252 , H01G9/004 , H01G9/06 , H01G9/08
CPC分类号： H01G2/065 , H01C17/006 , H01L2924/0002
摘要： A chip component incorporating an electrical or electronic function member (2) and having terminal elements (7, 8) is integrated in a pre-fabricated housing (9) of cup shape composed of insulating material, with the function member (2) being held in the housing (9) by supporting elements (12) so as to form at least one air gap (10) that is 1 mm less wide and that separates the function member (2) from the inner housing surfaces (11) on all sides except where the function member (2) is fixed in the housing (9) with small-area supporting elements (12).
摘要翻译：包含电气或电子功能构件（2）并具有端子元件（7,8）的芯片部件集成在由绝缘材料构成的杯形预制外壳（9）中，功能构件（2）被保持通过支撑元件（12）在壳体（9）中形成至少一个宽度为1mm的气隙（10），并且使功能元件（2）与所有侧面的内壳体表面（11）分开除了功能件（2）用小面积支撑元件（12）固定在外壳（9）中。

95. 发明授权

US4104697A Discrete, fixed-value capacitor 失效
标题翻译：离散固定值电容器
公开(公告)号：US4104697A
公开(公告)日：1978-08-01
申请号：US759518
申请日：1977-01-14
申请人： Don L. Kendall , Byron T. Ahlburn , Klaus C. Wiemer
发明人： Don L. Kendall , Byron T. Ahlburn , Klaus C. Wiemer
IPC分类号： H01L29/94 , H01G2/02 , H01G4/06 , H01G4/08 , H01G1/01
CPC分类号： H01G4/08
摘要： An axial-lead fixed-value capacitor comprising a metal-nitride-oxide-silicon chip in a standard diode package has been fabricated, having capacitance values in the 10 to 1000 pico-farad range. The device features a beveled-edge configuration which contributes to a low leakage current and also facilitates the sealing of the semiconductor chip in a double plug axial-lead package. The double layer dielectric medium comprises a thermally grown silicon oxide film typically 450 angstroms thick, for example, and a plasma deposited layer of silicon nitride typically 350 angstroms thick, for example.
摘要翻译：已经制造了包括标准二极管封装中的金属氮化物 - 氧化物 - 硅芯片的轴向引线固定值电容器，其电容值在10至1000皮拉范围内。该器件具有倾斜边缘配置，其有助于低泄漏电流，并且还有助于将半导体芯片密封在双插头轴向引线封装中。例如，双层介电介质包括通常为450埃厚的热生长氧化硅膜，例如通常为350埃厚的氮化硅等离子体沉积层。

96. 发明公开

US20240258029A1 MULTILAYER CERAMIC CAPACITOR AND BUMP-PRODUCING PASTE 审中-公开
公开(公告)号：US20240258029A1
公开(公告)日：2024-08-01
申请号：US18629015
申请日：2024-04-08
申请人： Murata Manufacturing Co., Ltd.
发明人： Kota ZENZAI
IPC分类号： H01G2/02 , H01G4/232 , H01G4/248 , H01G4/30
CPC分类号： H01G2/02 , H01G4/2325 , H01G4/248 , H01G4/30
摘要： A multilayer ceramic capacitor includes a multilayer body including dielectric layers and internal electrode layers alternately laminated on one another, outer electrode layers on end surfaces of the multilayer body at opposite ends in a longitudinal direction and covering end surface sides of principal surfaces of the multilayer body at opposite ends in a laminating direction and end surface sides of side surfaces at opposite ends with respect to a width direction, and bumps on the end surface sides of one of the principal surfaces of the multilayer body such that the outer electrode layers covering the one principal surface are sandwiched between the bumps and the one principal surface. Each of the bumps includes tin regions, metal regions including copper, and silver regions including silver.

97. 发明授权

US12009405B2 Deep trench capacitor including a compact contact region and methods of forming the same 有权
公开(公告)号：US12009405B2
公开(公告)日：2024-06-11
申请号：US17460178
申请日：2021-08-28
申请人： Taiwan Semiconductor Manufacturing Company Limited
发明人： Jen-Yuan Chang , Chia-Ping Lai , Chien-Chang Lee
IPC分类号： H01L29/66 , H01G2/02 , H01G7/02
CPC分类号： H01L29/66181 , H01G2/02 , H01G7/021
摘要： A deep trench capacitor includes at least one deep trench and a layer stack including at least three metallic electrode layers interlaced with at least two node dielectric layers and continuously extending over the top surface of a substrate and into each of the at least one deep trench. A contact-level dielectric layer overlies the substrate and the layer stack. Contact assemblies extend through the contact-level dielectric layer. A subset of the contact assemblies vertically extend through a respective metallic electrode layer. For example, a first contact assembly includes a first tubular insulating spacer that laterally surrounds a first contact via structure and contacts a cylindrical sidewall of a topmost metallic electrode layer.

98. 发明授权

US11935703B2 Multilayer electronic component including non-conductive resin layer on body thereof 有权
公开(公告)号：US11935703B2
公开(公告)日：2024-03-19
申请号：US18094668
申请日：2023-01-09
申请人： SAMSUNG ELECTRO-MECHANICS CO., LTD.
发明人： Jae Seok Yi , Jung Min Kim , Bon Seok Koo , Chang Hak Choi , Il Ro Lee , Byung Woo Kang , San Kyeong , Hae Sol Kang
IPC分类号： H01G4/30 , H01G2/02 , H01G4/008 , H01G4/012 , H01G4/12
CPC分类号： H01G4/30 , H01G2/02 , H01G4/008 , H01G4/012 , H01G4/1218
摘要： A multilayer electronic component has a body and a non-conductive resin layer. The non-conductive resin layer includes a body cover portion disposed in a region of an external surface of the body in which an electrode layer of an external electrode is not disposed, and an extending portion extending from the body cover portion between the electrode layer and a conductive resin layer of the external electrode, to thereby suppress arc discharge, improve bending strength, and improve moisture resistance.

99. 发明授权

US11901126B2 Multilayer ceramic capacitor 有权
公开(公告)号：US11901126B2
公开(公告)日：2024-02-13
申请号：US17236022
申请日：2021-04-21
申请人： Murata Manufacturing Co., Ltd.
发明人： Satoshi Yokomizo
IPC分类号： H01G4/012 , H01G2/02 , H01G4/12 , H01G4/30
CPC分类号： H01G4/012 , H01G2/02 , H01G4/1209 , H01G4/30
摘要： A multilayer ceramic capacitor includes, on a side of a first external electrode in a length direction of an interposer, a first joining electrode on a first surface and a first mounting electrode on a second surface, a first through conductive portion penetrating the interposer, and a first conductive joining agent providing electrical conduction between the first external electrode and the first joining electrode, and includes on a side of a second external electrode, a second joining electrode on the first surface and a second mounting electrode on the second surface, a second through conductive portion penetrating the interposer, and a second conductive joining agent providing electrical conduction between the second external electrode and the second joining electrode. A first joining region joining the first external electrode and the first conductive joining agent extends directly above an end at an upper end of the first through conductive portion, and a second joining region joining the second external electrode and the second conductive joining agent extends directly above an end at an upper end of the second through conductive portion.

100. 发明授权

US11817793B2 Power converter and capacitor module 有权
公开(公告)号：US11817793B2
公开(公告)日：2023-11-14
申请号：US17062938
申请日：2020-10-05
申请人： DENSO CORPORATION
发明人： Kazunari Kojima , Takashi Kurihara
IPC分类号： H02M7/00 , H01G2/02 , H01G4/228 , H01G4/224
CPC分类号： H02M7/003 , H01G2/02 , H01G4/224 , H01G4/228
摘要： A power converter includes a switching circuit and a capacitor module. The capacitor module includes a capacitor element, a capacitor case, an encapsulating resin, and a capacitor bus bar. The capacitor bus bar includes an element connection section, which is connected to the capacitor element inside the encapsulating resin, a terminal connection section, which is connected to a power terminal outside the encapsulating resin, and a power supply connection section, which is connected to power supply wiring outside the encapsulating resin. The power supply wiring is electrically connected to a DC power supply. The capacitor bus bar includes a DC path, which constitutes a current path between the terminal connection section and the power supply connection section. The DC path is exposed to the outside of the encapsulating resin.

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