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    • 97. 发明申请
    • SOI bipolar transistors with reduced self heating
    • 具有自加热降低的SOI双极晶体管
    • US20070001262A1
    • 2007-01-04
    • US11173540
    • 2005-07-01
    • Qiqing OuyangKai Xiu
    • Qiqing OuyangKai Xiu
    • H01L27/082
    • H01L21/84H01L21/8249H01L27/0623H01L27/1203
    • A bipolar transistor includes a collector located over a substrate; and a heat conductive path connecting the substrate to the collector. The heat conductive path is filled with a heat conductive material such as metal or polysilicon. In one embodiment the heat conductive path runs through the collector to extract heat from the collector and drain it to the substrate. In alternate embodiments, the transistor can be a vertical or a lateral device. According to another embodiment, an integrated circuit using BiCMOS technology comprises pnp and npn bipolar transistors with heat conduction from collector to substrate and possibly p-channel and n-channel MOSFETS. According to yet another embodiment, a method for making a transistor in an integrated network comprises steps of etching the heat conducting path through the collector and to the substrate and fill with heat conductive material to provide a heat drain for the transistor comprising the collector.
    • 双极晶体管包括位于衬底上方的集电极; 以及将基板连接到集电体的导热路径。 导热路径填充有诸如金属或多晶硅的导热材料。 在一个实施例中,导热路径穿过收集器以从集电器提取热量并将其排出到基板。 在替代实施例中,晶体管可以是垂直或横向装置。 根据另一实施例,使用BiCMOS技术的集成电路包括具有从集电极到衬底以及可能的p沟道和n沟道MOSFET的热传导的pnp和npn双极晶体管。 根据另一个实施例,一种用于在集成网络中制造晶体管的方法包括以下步骤:蚀刻通过集电器和衬底的导热路径,并填充导热材料,以为包括集电器的晶体管提供散热。
    • 98. 发明授权
    • Structure of a bipolar junction transistor and fabricating method thereof
    • 双极结型晶体管的结构及其制造方法
    • US07157786B2
    • 2007-01-02
    • US11164882
    • 2005-12-08
    • Ching-Hung Kao
    • Ching-Hung Kao
    • H01L27/082
    • H01L29/66287H01L21/8249H01L29/0821H01L29/732
    • A method for fabricating a bipolar junction transistor on a wafer is disclosed. The wafer has a N-type doped area and a plurality of isolated structures. A protection layer is formed on the wafer and portions of the protection layer are then removed to expose portions of the doped area. A P-type epitaxy layer is formed on the protection layer and the first doped area and then portions of the epitaxy layer and the protection layer are removed. An insulation layer is formed and at least a collector opening and emitter opening are formed within the insulation layer. Following that, a polysilicon layer is formed to fill the collector opening and the emitter opening. A spacer is formed beside the polysilicon layer and the epitaxy layer followed by performing a self-aligned silicidation process to form a salicide layer on the polysilicon layer and portions of the epitaxy layer.
    • 公开了一种在晶片上制造双极结晶体管的方法。 晶片具有N型掺杂区域和多个隔离结构。 在晶片上形成保护层,然后去除保护层的部分以暴露掺杂区域的部分。 在保护层和第一掺杂区域上形成P型外延层,然后去除外延层和保护层的部分。 形成绝缘层,并且至少在绝缘层内形成集电极开口和发射极开口。 之后,形成多晶硅层以填充集电极开口和发射极开口。 在多晶硅层和外延层旁边形成间隔物,然后进行自对准硅化工艺,以在多晶硅层和外延层的部分上形成自对准硅化物层。
    • 100. 发明授权
    • Semiconductor device and method of manufacturing same
    • 半导体装置及其制造方法
    • US07132729B2
    • 2006-11-07
    • US10929475
    • 2004-08-31
    • Hirokazu Fujimaki
    • Hirokazu Fujimaki
    • H01L27/082
    • H01L27/0664H01L21/76227
    • The present invention provides a semiconductor device formed with a diode array together with bipolar transistors, which is capable of preventing the occurrence of crystal defects developed in cross patterns in deep trench regions and improving device yields, and a method of manufacturing the semiconductor device. A semiconductor device includes a LOCOS oxide film which isolates a plurality of diodes in an X direction, and deep trenches which isolate the plurality of diodes in a Y direction. The depth of each of the deep trenches is deeper than a high density layer embedded below a collector layer of each bipolar transistor. A shallow trench may be used as an alternative to the LOCOS oxide film.
    • 本发明提供了一种半导体器件,其形成有二极管阵列和双极晶体管,其能够防止在深沟槽区域中以交叉图案形成的晶体缺陷的出现并提高器件产量,以及制造半导体器件的方法。 半导体器件包括在X方向隔离多个二极管的LOCOS氧化物膜和在Y方向上隔离多个二极管的深沟槽。 每个深沟槽的深度比嵌入每个双极晶体管的集电极层下方的高密度层更深。 可以使用浅沟槽作为LOCOS氧化物膜的替代物。