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91. 发明公开

US20240219165A1 WAFER STATE DETECTION 审中-公开
公开(公告)号：US20240219165A1
公开(公告)日：2024-07-04
申请号：US18558327
申请日：2022-04-29
申请人： Lam Research Corporation
发明人： Noah Elliot Baker
IPC分类号： G01B7/28 , H01J37/32 , H01L21/67 , H01L21/683
CPC分类号： G01B7/28 , H01J37/32715 , H01L21/67288 , H01L21/6833 , H01J2237/2007 , H01J2237/24578
摘要： Various embodiments herein relate to apparatuses and methods for wafer state detection. In some embodiments, an apparatus for wafer state detection is provided, the apparatus comprising: an RF blocking filter; a DC blocking filter; and a controller coupled to a plurality of electrodes associated with an electrostatic chuck (ESC) via the RF blocking filter and the DC blocking filter, wherein the controller is configured to: cause an input signal to be injected in an input side of a circuit associated with the plurality of electrodes, the RF blocking filter, and the DC blocking filter, wherein the input side corresponds to a first electrode; measure characteristics of an output signal at an output side of the circuit, wherein the output side corresponds to a second electrode; and calculate wafer state characteristics of a wafer positioned on a surface of a platen based on the characteristics of the output signal.

92. 发明公开

US20240216939A1 LIQUID SUPPLY UNIT AND SUBSTRATE TREATING APPARATUS 审中-公开
公开(公告)号：US20240216939A1
公开(公告)日：2024-07-04
申请号：US18343242
申请日：2023-06-28
申请人： SEMES CO., LTD.
发明人： Soon Hyun KIM , Kyung Min KIM
IPC分类号： B05B13/04 , H01L21/67
CPC分类号： B05B13/0421 , H01L21/67051 , H01L21/6708
摘要： The inventive concept provides a liquid supply unit which may implement a rotation (swing) of a plurality of nozzles by a single motor, and which has simple structure. The liquid supply unit includes a first nozzle, a second nozzle, a motor, and a first belt. The first nozzle includes a first supply pipe for supplying a liquid, a first rotation part provided at a bottom part of the first supply pipe, and a first electromagnetic clutch provided at a bottom part of the first rotation part. The second nozzle includes a second supply pipe for supplying a liquid, a second rotation part provided at a bottom part of the second supply pipe, and a second electromagnetic clutch provided at a bottom part of the second rotation part. The motor provides a rotation force to the first electromagnetic clutch. The first belt which interlocks a rotation of the first electromagnetic clutch and the second electromagnetic clutch.

93. 发明授权

US12028991B2 Guided transport path correction 有权
公开(公告)号：US12028991B2
公开(公告)日：2024-07-02
申请号：US17444796
申请日：2021-08-10
申请人： Kateeva, Inc.
发明人： Eliyahu Vronsky , Karl Mathia , Alexander Sou-Kang Ko
IPC分类号： H05K3/46 , B05C5/02 , B05D5/12 , B41J3/407 , B41J13/00 , B41J29/393 , H10K99/00 , B41J2/01 , H01L21/67 , H01L21/677 , H01L21/68 , H01L21/683 , H10K71/13
CPC分类号： H05K3/4644 , B05C5/0208 , B05D5/12 , B41J3/407 , B41J13/0027 , B41J29/393 , H05K3/4679 , H10K99/00 , B41J2/01 , H01L21/67 , H01L21/6715 , H01L21/6776 , H01L21/67784 , H01L21/68 , H01L21/683 , H05K2203/0104 , H05K2203/013 , H05K2203/0736 , H05K2203/166 , H10K71/135
摘要： A printer deposits material onto a substrate as part of a manufacturing process for an electronic product; at least one transported component experiences error, which affects the deposition. This error is mitigated using transducers that equalize position of the component, e.g., to provide an “ideal” conveyance path, thereby permitting precise droplet placement notwithstanding the error. In one embodiment, an optical guide (e.g., using a laser) is used to define a desired path; sensors mounted to the component dynamically detect deviation from this path, with this deviation then being used to drive the transducers to immediately counteract the deviation. This error correction scheme can be applied to correct for more than type of transport error, for example, to correct for error in a substrate transport path, a printhead transport path and/or split-axis transport non-orthogonality.

94. 发明授权

US12027408B2 Transfer device of micro-elements and manufacturing method thereof 有权
公开(公告)号：US12027408B2
公开(公告)日：2024-07-02
申请号：US17144474
申请日：2021-01-08
申请人： Chengdu Vistar Optoelectronics Co., Ltd.
发明人： Bo Chen , Rubo Xing , Enqing Guo , Dong Wei , Xiaowei Li , Bo Chen
IPC分类号： H01L21/683 , H01L21/67 , H01L25/075 , H01L33/00
CPC分类号： H01L21/6838 , H01L21/67144 , H01L25/0753 , H01L33/0095
摘要： A transfer device of micro-elements and manufacturing method thereof are provided in the present disclosure. The transfer device of micro-elements may comprise a vacuum chamber, a plurality of movable mass blocks and a plurality of electrode assemblies. The vacuum chamber may define a vacuum space and a plurality of through holes. The plurality of through holes can communicate the vacuum space with outside. The plurality of through holes can be configured to suck the micro-elements. The plurality of movable mass blocks may be arranged in the vacuum chamber. Each movable mass block may be arranged corresponding to a through hole. The plurality of electrode assemblies may be fixed in the vacuum chamber. Each electrode assembly can be arranged corresponding to a through hole.

95. 发明授权

US12027400B2 Automatic system calibration for wafer handling 有权
公开(公告)号：US12027400B2
公开(公告)日：2024-07-02
申请号：US17326533
申请日：2021-05-21
申请人： ASM IP Holding B.V.
发明人： Theodorus G. M. Oosterlaken
IPC分类号： H01L21/677 , H01L21/67
CPC分类号： H01L21/67763 , H01L21/67259 , G05B2219/39024 , G05B2219/39527 , G05B2219/40555
摘要： A method for automatically calibrating the position of a wafer handling robot relative to a wafer carrier. The method comprises providing a semiconductor processing assembly comprising the wafer carrier and the wafer handling robot having an end effector, placing a wafer on a wafer support surface of the end effector, moving the end effector to an end position adjacent the wafer carrier, determining a displacement of the wafer on the wafer support surface, repeating these steps until the magnitude of the displacement meets a set end criterion, and storing the latest used end position as a calibrated end position.

96. 发明授权

US12027392B2 Pump backstream prevention structure for semiconductor fabrication equipment 有权
公开(公告)号：US12027392B2
公开(公告)日：2024-07-02
申请号：US16958082
申请日：2020-02-27
申请人： Tae Wha Kim
发明人： Tae Wha Kim
IPC分类号： H01L21/67 , F04B51/00 , F04D15/00 , F04D19/04
CPC分类号： H01L21/67253 , F04B51/00 , F04D15/0088 , F04D19/04 , H01L21/67017 , F04B2203/0201
摘要： Provided is a pump backstream prevention structure for semiconductor fabrication equipment, including a sensor, an isolation air supply pipe, and a control unit. A time delay from a point in time at which the dry pump starts to malfunction to a point in time at which the isolation valve is closed is reduced, compared to a method of closing the isolation valve by a controller of the semiconductor fabrication equipment. Accordingly, a backstream in which particles move from the pumping pipe to the process chamber before the closing of the isolation valve is prevented.

97. 发明授权

US12027387B2 Holding device 有权
公开(公告)号：US12027387B2
公开(公告)日：2024-07-02
申请号：US17607241
申请日：2020-12-10
申请人： NGK SPARK PLUG CO., LTD.
发明人： Takahisa Komatsu , Kazutaka Tanaka
IPC分类号： H01L21/687 , C23C14/34 , C23C14/50 , C23C16/458 , H01J37/32 , H01J37/34 , H01L21/67
CPC分类号： H01L21/67103 , C23C14/34 , C23C14/50 , C23C16/458 , H01J37/32715 , H01J37/3438 , H01J2237/332 , H01J2237/334
摘要： A holding device includes a plate-shaped member, a tubular member, and a connecting member. The tubular member is made of ceramic and is joined to plate-shaped member at an end thereof. The tubular member has, at an other end thereof, a flange portion having a first through-hole. The connecting member is disposed on the other side of the tubular member and has, in a third surface, which is an end face of the connecting member, a hole into which a fastening member inserted through the first through-hole in the flange portion is to be screwed. A specific portion, which is a portion in an outer edge line of a fourth surface of the tubular member, the portion overlapping a minimum virtual circle covering the fourth surface, is not in contact with the third surface of the connecting member.

98. 发明授权

US12027382B2 Surface cleaning with directed high pressure chemistry 有权
公开(公告)号：US12027382B2
公开(公告)日：2024-07-02
申请号：US17541540
申请日：2021-12-03
申请人： Applied Materials, Inc.
发明人： Brian K. Kirkpatrick , Ekaterina A. Mikhaylichenko , Brian J. Brown
IPC分类号： H01L21/67 , B08B3/02 , B24B37/00 , H01L21/306
CPC分类号： H01L21/67051 , B08B3/024 , B08B3/02 , B24B37/00 , H01L21/30625
摘要： Cleaning chambers may include a substrate support having a substrate seating position. The cleaning chambers may include a plurality of fluid nozzles facing the substrate support. Each fluid nozzle of the plurality of fluid nozzles may define a fluid port characterized by a leading edge and a trailing edge. Each fluid nozzle of the plurality of fluid nozzles may be angled relative to the substrate seating position of the substrate support to produce an interior angle of greater than or about 90° at an intersection location across the substrate seating position for a fluid delivered from each fluid nozzle at the leading edge of the fluid port.

99. 发明授权

US12027344B2 Film forming apparatus 有权
公开(公告)号：US12027344B2
公开(公告)日：2024-07-02
申请号：US17974193
申请日：2022-10-26
申请人： Tokyo Electron Limited
发明人： Shinya Iwashita , Ayuta Suzuki , Takahiro Shindo , Kazuki Dempoh , Tatsuo Matsudo , Yasushi Morita , Takamichi Kikuchi , Tsuyoshi Moriya
IPC分类号： C23C16/00 , H01J37/32 , H01L21/00 , H01L21/67
CPC分类号： H01J37/32027 , H01J37/32091 , H01J37/32183 , H01J37/32568 , H01L21/67253 , H01J2237/327 , H01J2237/3321 , H01J2237/334
摘要： A film forming apparatus includes a vacuum-evacuable processing chamber, a lower electrode for mounting thereon a target substrate, an upper electrode disposed to face the lower electrode, a gas supply unit, a voltage application unit and a switching unit. The gas supply unit supplies a film forming source gas to be formed into plasma to a processing space between the upper and the lower electrode. The voltage application unit applies to the upper electrode a voltage outputted from at least one of a high frequency power supply and a DC power supply included therein. The switching unit selectively switches the voltage to be applied to the upper electrode among a high frequency voltage outputted from the high frequency power supply, a DC voltage outputted from the DC power supply, and a superimposed voltage in which the DC voltage is superimposed with the high frequency voltage.

100. 发明授权

US12024771B2 Method for manufacturing de-powder device for piping, and method for installing same 有权
公开(公告)号：US12024771B2
公开(公告)日：2024-07-02
申请号：US18271858
申请日：2023-01-17
申请人： M. I Co., Ltd
发明人： Gi Nam Kim
IPC分类号： C23C16/44 , F16L53/38 , H01L21/67 , H02G1/14 , H05B3/04 , H05B3/06 , H05B3/52
CPC分类号： C23C16/4412 , H02G1/14
摘要： The present disclosure relates to a method for manufacturing a de-powder device for piping and a method for installing the same, and more particularly, to a method for manufacturing a de-powder device for piping, which is for suppressing attachment and deposition of exhaust matters to an inner circumferential surface of a pipe exposed to the flow of exhaust matters such as unreacted raw material gas, reaction products, and the like exhausted from substrate processing devices for semiconductors and displays, and a method for installing the same.
The method for manufacturing a de-powder device for piping according to the present disclosure includes: a heater manufacturing step (S1) including a step (S11) of manufacturing an intermediate product by installing a heating wire connected to a power source inside a metal pipe and filling it with an insulating agent and a step (S12) of cutting the intermediate product and connecting one end portions of exposed heating wires; a winding step (S2) of manufacturing a heating coil which has a predetermined outer diameter by winding the heater around a jig and at least a portion of which is inserted into a pipe; and a coupling step (S3) of coupling the flange and the heating coil by inserting an end portion of the heating coil into an exposed hole formed in a metal flange.

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