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11. 发明申请

US20230012552A1 LIGHT EMITTING DEVICE 有权
公开(公告)号：US20230012552A1
公开(公告)日：2023-01-19
申请号：US17876521
申请日：2022-07-28
申请人： NICHIA CORPORATION
发明人： Shimpei BANDO , Koki SHIBAI
IPC分类号： H01L27/15 , H01L33/56 , H01L25/075 , H01L33/60
摘要： A light emitting device includes a substrate, a plurality of light sources disposed on the substrate, and a plurality of light reflecting members disposed on the substrate. The light reflecting members respectively include wall parts each surrounding each of the light sources individually or two or more of the light sources in groups. Two adjacent ones of the light reflecting members are joined to each other such that outer surfaces of the wall parts of the two adjacent ones of the light reflecting members are bonded to each other via an adhesive agent.

12. 发明授权

US11551982B2 Fabrication of thin-film encapsulation layer for light-emitting device 有权
公开(公告)号：US11551982B2
公开(公告)日：2023-01-10
申请号：US17305963
申请日：2021-07-19
申请人： Kateeva, Inc.
发明人： Eliyahu Vronsky , Nahid Harjee
IPC分类号： H01L21/66 , B05C11/10 , B41J2/01 , B41J2/20 , B41J2/21 , H01L21/02 , H01L21/67 , H01L31/0203 , H01L31/048 , H01L33/52 , H01L33/54 , H01L51/00 , H01L51/52 , H01L51/56 , H04N1/405 , B41J2/205 , H01L33/56
摘要： An ink jet process is used to deposit a material layer to a desired thickness. Layout data is converted to per-cell grayscale values, each representing ink volume to be locally delivered. The grayscale values are used to generate a halftone pattern to deliver variable ink volume (and thickness) to the substrate. The halftoning provides for a relatively continuous layer (e.g., without unintended gaps or holes) while providing for variable volume and, thus, contributes to variable ink/material buildup to achieve desired thickness. The ink is jetted as liquid or aerosol that suspends material used to form the material layer, for example, an organic material used to form an encapsulation layer for a flat panel device. The deposited layer is then cured or otherwise finished to complete the process.

13. 发明申请

US20230005896A1 WAFER LEVEL CHIP SCALE PACKAGING 有权
公开(公告)号：US20230005896A1
公开(公告)日：2023-01-05
申请号：US17779927
申请日：2021-04-29
申请人： ams Sensors Asia Pte. Ltd.
发明人： Kam Wah Leong , QiChuan Yu , Yoong Kheng Teoh , Sung Hoe Hng , Kyaw Oo Aung
IPC分类号： H01L25/16 , H01L33/56 , H01L33/62
摘要： A method of fabricating one or more optoelectronic devices each comprising at least one passive optical component. The method comprises providing a first carrier, depositing a soluble adhesive onto a surface of the first carrier, and placing a plurality of integrated circuit devices onto said surface and curing the soluble adhesive to fix the integrated circuit devices to the carrier. The method further comprises depositing a molding material onto a plurality of molds of a second carrier to form a plurality of said passive optical components, aligning said first and second carriers such that the plurality of passive optical components contact respective zones of the plurality of integrated circuit devices, injecting a polymer compound into a space between said first and second carriers and curing said polymer compound, removing said second carrier to leave the plurality of optical components fixed to the integrated circuit devices by said polymer compound, and dissolving said soluble adhesive to remove the integrated circuit devices, polymer compound and passive optical components from the first carrier to provide a wafer package.

14. 发明授权

US11538970B2 Light emitting diode device 有权
公开(公告)号：US11538970B2
公开(公告)日：2022-12-27
申请号：US17027731
申请日：2020-09-22
申请人： Lextar Electronics Corporation
发明人： Shu-Wei Chen , Ching-Huai Ni , Kuo-Wei Huang , Jia-Jhang Kuo
IPC分类号： H01L33/60 , H01L33/48 , H01L33/54 , H01L33/56 , H01L33/02 , H01L33/58
摘要： A light emitting diode device includes a substrate, a frame, an LED die and a transparent layer. The frame is located on the substrate. The frame and the substrate collectively define a concave portion. The frame has a light reflectivity ranging from 20% to 40%. The LED die is located on the substrate and within the concave portion. The transparent layer is filled into the concave portion and covering the LED die, wherein the LED die has a side-emitting surface and a top-emitting surface, the side-emitting surface has a luminous intensity greater than that of the top-emitting surface.

15. 发明授权

US11532776B2 Semiconductor light-emitting device 有权
公开(公告)号：US11532776B2
公开(公告)日：2022-12-20
申请号：US17161374
申请日：2021-01-28
申请人： ROHM CO., LTD.
发明人： Tomoichiro Toyama
IPC分类号： H01L33/62 , H01L33/48 , H01L23/00 , H01L33/56
摘要： Semiconductor light-emitting device, includes: substrate having base and conductive part; first to third semiconductor light-emitting elements; first to third wires connected to the first to third semiconductor light-emitting elements respectively; and light-transmitting resin part covering the first to the third semiconductor light-emitting elements, wherein the base has main and rear surfaces facing opposite sides in thickness direction of the base, wherein the conductive part includes main surface part on the main surface, wherein the main surface part includes main surface first part where the first and second semiconductor light-emitting elements are mounted, wherein the main surface first part reaches both ends of the main surface in first direction perpendicular to the thickness direction, and wherein the main surface first part is separated from both the main surface part where the third semiconductor light-emitting element is mounted and the main surface part where the first, second, and third wires are connected.

16. 发明申请

US20220393083A1 LIGHT-EMITTING DEVICE WITH IMPROVED FLEXURAL RESISTANCE AND ELECTRICAL CONNECTION BETWEEN LAYERS, PRODUCTION METHOD THEREFOR, AND DEVICE USING LIGHT-EMITTING DEVICE 有权
公开(公告)号：US20220393083A1
公开(公告)日：2022-12-08
申请号：US17889137
申请日：2022-08-16
申请人： NICHIA CORPORATION
发明人： Keiichi MAKI
IPC分类号： H01L33/54 , H01L33/56 , H01L33/62 , H01L33/38
摘要： A light-emitting device includes a pair of light-transmissive insulator sheets disposed opposite to each other and two types of light-transmissive electroconductive layers disposed on a common one of or separately on one and the other of the pair of light-transmissive insulator sheets, and at least one light-emitting semiconductor each provided with a cathode and an anode which are individually and electrically connected to the two types of the light-transmissive electroconductive layers. The electrical connection and mechanical bonding between the members are improved by a light-transmissive elastomer which is between the pair of light-transmissive insulator sheets. A method in which a light-emitting semiconductor element and a light-transmissive electroconductive member are subjected to vacuum hot-pressing.

17. 发明申请

US20220393068A1 DISPLAY DEVICE 有权
公开(公告)号：US20220393068A1
公开(公告)日：2022-12-08
申请号：US17723763
申请日：2022-04-19
申请人： Samsung Display Co., LTD.
发明人： Su Jeong KIM , Dae Won KIM , Jong Ho SON , Jin Hyeong LEE
IPC分类号： H01L33/38 , H01L33/56 , H01L33/10 , H01L25/075 , H01L33/40
摘要： A display device comprises a first and a second electrode disposed on a base substrate and spaced apart from each other, the second electrode facing the first electrode, a light emitting elements disposed between the first electrode and the second electrode, and a light structure disposed on the light emitting elements. The light structure includes a light transmitting portion disposed on the light emitting element, and a light shielding portion including at least one opening pattern. The light shielding portion is disposed on the light transmitting portion.

18. 发明申请

US20220384404A1 LIGHT EMITTING DIODE DEVICE CONTAINING A POSITIVE PHOTORESIST INSULATING SPACER AND A CONDUCTIVE SIDEWALL CONTACT AND METHOD OF MAKING THE SAME 有权
公开(公告)号：US20220384404A1
公开(公告)日：2022-12-01
申请号：US17818822
申请日：2022-08-10
申请人： NANOSYS, INC.
发明人： Willibrordus Gerardus Maria VAN DEN HOEK , Tsun Yin LAU , Cameron DANESH , Fariba DANESH
IPC分类号： H01L25/16 , H01L33/40 , H01L33/62 , H01L33/56 , H01L33/12 , H01L33/06 , H01L33/32 , H01L33/24 , H01L33/08 , H01L33/00
摘要： A light emitting device includes a backplane, an array of light emitting diodes attached to a frontside of the backplane, a positive tone, imageable dielectric material layer, such as a positive photoresist layer, located on the frontside of the backplane and laterally surrounding the array of light emitting diodes, such that sidewalls of the light emitting diodes contacting the positive tone, imageable dielectric material layer have a respective reentrant vertical cross-sectional profile, and at least one common conductive layer located over the positive tone, imageable dielectric material layer and contacting the light emitting diodes.

19. 发明授权

US11515448B2 Semiconductor light-emitting element and method of manufacturing the same 有权
公开(公告)号：US11515448B2
公开(公告)日：2022-11-29
申请号：US17047690
申请日：2019-04-18
申请人： DOWA Electronics Materials Co., Ltd.
发明人： Jumpei Yamamoto , Tetsuya Ikuta
IPC分类号： H01L33/30 , H01L33/22 , H01L33/00 , H01L33/46 , H01L33/56
摘要： A semiconductor light-emitting element capable of reducing multipeaks to thereby achieve a single peak in an emission spectrum is provided. A semiconductor light-emitting element according to the present disclosure includes, in this order, a substrate, a reflective layer, a first conductivity type cladding layer made of InGaAsP containing at least In and P, a semiconductor light-emitting layer having an emission central wavelength of 1000 nm to 2200 nm, and a second conductivity type cladding layer made of InGaAsP containing at least In and P, wherein the second conductivity type cladding layer is configured to be on a light extraction side. The surface of a light extraction face of the second conductivity type cladding layer is a roughened surface which has a surface roughness Ra of 0.03 μm or more and has a random irregularity pattern.

20. 发明授权

US11515296B2 Light-emitting device, integrated light-emitting device, and light-emitting module 有权
公开(公告)号：US11515296B2
公开(公告)日：2022-11-29
申请号：US17382699
申请日：2021-07-22
申请人： NICHIA CORPORATION
发明人： Motokazu Yamada , Yuichi Yamada
IPC分类号： H01L25/075 , H01L33/50 , H01L33/54 , H01L33/60 , H01L33/62 , G02F1/13357 , H01L33/46 , F21V7/00 , F21V9/08 , F21V23/00 , H01L33/58 , H01L33/56 , G02F1/1335 , F21Y115/10
摘要： A light-emitting device includes a base including a conductive wiring; a light-emitting element mounted on the base and configured to emit light; a light reflective film provided on an upper surface of the light-emitting element; and a encapsulant covering the light-emitting element and the light reflective film. A ratio (H/W) of a height (H) of the encapsulant to a width (W) of a bottom surface of the encapsulant is less than 0.5.

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