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1. 发明申请

US20230137296A1 Illumination apparatus 有权
公开(公告)号：US20230137296A1
公开(公告)日：2023-05-04
申请号：US17988550
申请日：2022-11-16
申请人： Optovate Limited
发明人： Jonathan HARROLD , Graham J. WOODGATE
IPC分类号： F21V13/04 , F21K9/00 , H01L25/075 , H01L33/60 , H01L33/62 , H01L23/00 , G02B19/00 , G02F1/13357 , H01L33/58 , H01L33/00 , H01L33/56 , H01L33/50 , F21V9/30 , F21V5/00 , H01L25/16 , H01L33/08 , G09G3/20 , H01L21/268 , F21K9/64 , F21K9/68 , F21K9/69 , F21K9/90 , H01L21/66
摘要： An illumination apparatus comprises a plurality of LEDs aligned to an array of directional optical elements wherein the LEDs are substantially at the input aperture of respective optical elements. An electrode array is formed on the array of optical elements to provide at least a first electrical connection to the array of LED elements. Advantageously such an arrangement provides low cost and high efficiency from the directional LED array.

2. 发明授权

US11629847B2 Illumination apparatus 有权
公开(公告)号：US11629847B2
公开(公告)日：2023-04-18
申请号：US17392632
申请日：2021-08-03
申请人： Optovate Limited
发明人： Jonathan Harrold , Graham J. Woodgate
IPC分类号： F21Y115/10 , F21Y101/00 , G02F1/1335 , F21V17/00 , F21Y113/13 , F21K9/69 , F21K9/90 , H01L21/66 , F21V13/04 , F21K9/00 , H01L25/075 , H01L33/60 , H01L33/62 , H01L23/00 , G02B19/00 , G02F1/13357 , H01L33/58 , H01L33/00 , H01L33/56 , H01L33/50 , F21V9/30 , F21V5/00 , H01L25/16 , H01L33/08 , G09G3/20 , H01L21/268 , F21K9/64 , F21K9/68
摘要： An illumination apparatus comprises a plurality of LEDs aligned to an array of directional optical elements wherein the LEDs are substantially at the input aperture of respective optical elements. An electrode array is formed on the array of optical elements to provide at least a first electrical connection to the array of LED elements. Advantageously such an arrangement provides low cost and high efficiency from the directional LED array.

3. 发明申请

US20230101321A1 CURABLE LIQUID SILICONE COMPOSITION, CURED PRODUCT OF CURABLE LIQUID SILICONE COMPOSITION, OPTICAL FILLER INCLUDING CURABLE LIQUID SILICONE COMPOSITION, AND DISPLAY DEVICE INCLUDING LAYER COMPRISING CURED PRODUCT OF CURABLE LIQUID SILICONE COMPOSITION 有权
公开(公告)号：US20230101321A1
公开(公告)日：2023-03-30
申请号：US17800213
申请日：2021-02-19
申请人： DOW TORAY CO., LTD.
发明人： Takuya OGAWA , Michitaka SUTO
IPC分类号： C08G77/04 , C08G77/08 , C08G77/12 , C08G77/20 , C08G77/00 , C08K5/5419 , C08K5/5425 , G02B1/04 , H01L33/56
摘要： A photocurable liquid silicone composition, having a low viscosity that facilitates injection into a small gap, having a refractive index (pre-cure) that is high not only in a visible region but also in an infrared region, and that is particularly useful as a material for a device using an infrared LED light source, is provided. The composition comprises: (A): (A1) an organosilane or organopolysiloxane having 1 to 5 silicon atoms, having an alkenyl group, and having at least one monovalent functional group selected from aromatic groups and aralkyl groups, and/or (A2) an organopolysiloxane having 2 to 5 silicon atoms, having an alkenyl group, and not having a monovalent functional group selected from aromatic groups and aralkyl groups; (C) a compound having at least two silicon-bonded hydrogen atoms; and (D) a hydrosilylation reaction catalyst. Pre-cure, the refractive index of the entire liquid composition is ≥1.47, and the viscosity is ≤500 mPa·s.

4. 发明申请

US20230090352A1 LIGHT EMITTING DIODE DEVICE 有权
公开(公告)号：US20230090352A1
公开(公告)日：2023-03-23
申请号：US18058765
申请日：2022-11-24
申请人： Lextar Electronics Corporation
发明人： Shu-Wei CHEN , Ching-Huai NI , Kuo-Wei HUANG , Jia-Jhang KUO
IPC分类号： H01L33/60 , H01L33/48 , H01L33/54 , H01L33/56
摘要： A light emitting diode device includes a substrate, a frame, an LED die and a transparent layer. The frame is located on the substrate. The frame and the substrate collectively define a concave portion. The frame has a light reflectivity ranging from 20% to 40%. The LED die is located on the substrate and within the concave portion. The transparent layer is filled into the concave portion and covering the LED die, wherein the LED die has a side-emitting surface and a top-emitting surface, the side-emitting surface has a luminous intensity greater than that of the top-emitting surface.

5. 发明授权

US11605761B2 Light-emitting device 有权
公开(公告)号：US11605761B2
公开(公告)日：2023-03-14
申请号：US17028496
申请日：2020-09-22
申请人： NICHIA CORPORATION
发明人： Kazushige Fujio , Masaki Kondo
IPC分类号： H01L33/48 , H01L33/50 , C09K11/77 , H01L33/32 , H01L33/56 , H01L33/62
摘要： A light-emitting device is provided. The light-emitting device includes a light-emitting element having a peak light-emitting wavelength in the range of 440 nm to 470 nm, and a fluorescent member. The fluorescent member includes a first fluorescent material having a peak light-emitting wavelength in the range of 480 nm to less than 520 nm, a second fluorescent material having a peak light-emitting wavelength in the range of 520 nm to less than 600 nm, and a third fluorescent material having a peak light-emitting wavelength in the range of 600 nm to 670 nm. The light-emitting device has a ratio of an effective radiant intensity for melatonin secretion suppression to an effective radiant intensity for blue-light retinal damage of 1.53 to 1.70 when the light-emitting device emits light with a correlated color temperature of 2700 K to less than 3500 K; 1.40 to 1.70 when the light-emitting device emits light with a correlated color temperature of 3500 K to less than 4500 K; 1.40 to 1.70 when the light-emitting device emits light with a correlated color temperature of 4500 K to less than 5700 K; and 1.35 to 1.65 when the light-emitting device emits light with a correlated color temperature of 5700 K to 7200 K.

6. 发明申请

US20230073210A1 SEMICONDUCTOR LIGHT-EMITTING DEVICE 有权
公开(公告)号：US20230073210A1
公开(公告)日：2023-03-09
申请号：US18056034
申请日：2022-11-16
申请人： ROHM CO., LTD.
发明人： Tomoichiro TOYAMA
IPC分类号： H01L33/62 , H01L33/48 , H01L23/00 , H01L33/56
摘要： Semiconductor light-emitting device, includes: substrate having base and conductive part; first to third semiconductor light-emitting elements; first to third wires connected to the first to third semiconductor light-emitting elements respectively; and light-transmitting resin part covering the first to the third semiconductor light-emitting elements, wherein the base has main and rear surfaces facing opposite sides in thickness direction of the base, wherein the conductive part includes main surface part on the main surface, wherein the main surface part includes main surface first part where the first and second semiconductor light-emitting elements are mounted, wherein the main surface first part reaches both ends of the main surface in first direction perpendicular to the thickness direction, and wherein the main surface first part is separated from both the main surface part where the third semiconductor light-emitting element is mounted and the main surface part where the first, second, and third wires are connected.

7. 发明申请

US20230066558A1 LIGHT EMITTING DIODE WITH CONDUCTIVE ENCAPSULATION AND METHOD OF MAKING THEREOF 有权
公开(公告)号：US20230066558A1
公开(公告)日：2023-03-02
申请号：US17818097
申请日：2022-08-08
申请人： NANOSYS, INC.
发明人： Brian KIM
IPC分类号： H01L33/56 , H01L33/10 , H01L33/00 , H01L27/15
摘要： A light emitting device includes a backplane, an array of light emitting diodes attached to a front side of the backplane, such that each of the light emitting diodes includes a stack of a first doped semiconductor layer, a second doped semiconductor layer and an active region located between the first and the second doped semiconductor layers, and a conductive encapsulation layer in contact with sidewalls of the first doped semiconductor layers of the array of light emitting diodes.

8. 发明授权

US11594664B2 Light emitting diode package 有权
公开(公告)号：US11594664B2
公开(公告)日：2023-02-28
申请号：US16877941
申请日：2020-05-19
申请人： SAMSUNG ELECTRONICS CO., LTD.
发明人： Seungjin Yoon , Hosik Jun , Sangbok Yun
IPC分类号： H01L33/62 , H01L33/50 , H01L33/48 , H01L25/075 , H01L33/56
摘要： A light emitting diode (LED) package is provided. The LED package includes a package body having a concave portion; an LED chip disposed on the concave portion; a phosphor sheet disposed on the LED chip; a barrier wall disposed on the concave portion and spaced apart from the LED chip by a first distance, the barrier wall being disposed in parallel with at least one side surface of the LED chip, an upper surface of the barrier wall being higher than an upper surface of the LED chip with respect to the lower surface of the concave portion and disposed at a level that is 50 μm or less from an upper surface of the phosphor sheet; and an encapsulation portion disposed on the LED chip, a side surface of the phosphor sheet and a side surface of the barrier wall.

9. 发明授权

US11594662B2 Light-emitting device 有权
公开(公告)号：US11594662B2
公开(公告)日：2023-02-28
申请号：US16942767
申请日：2020-07-30
申请人： NICHIA CORPORATION
发明人： Toshifumi Imura , Masafumi Kuramoto , Hiroki Inoue
IPC分类号： H01L33/54 , H01L23/00 , H01L33/50 , H01L33/60 , H01L33/62 , H01L33/56
摘要： A light-emitting device includes: a light-emitting element including a first surface provided as a light extraction surface, a second surface opposite to the first surface, a plurality of third surfaces between the first surface and the second surface, and a positive electrode and a negative electrode at the second surface; a light-transmissive member disposed at the first surface; and a bonding member disposed between the light-emitting element and the light-transmissive member and covering from the first surface to the plurality of third surfaces of the light-emitting element to bond the light-emitting element and the light-transmissive member. The bonding member is made of a resin that contains nanoparticles. The nanoparticles have a particle diameter of 1 nm or more and 30 nm or less and a content of 10 mass % or more and 20 mass % or less.

10. 发明申请

US20230042041A1 HOUSING, OPTOELECTRONIC SEMICONDUCTOR COMPONENT AND PRODUCTION METHOD 有权
公开(公告)号：US20230042041A1
公开(公告)日：2023-02-09
申请号：US17792679
申请日：2020-12-18
申请人： OSRAM Opto Semiconductors GmbH
发明人： Karlheinz ARNDT , Matthias GOLDBACH , Simon JEREBIC , Matthias HOFMANN , Markus BOSS , Constantin HETZER , Harald JAEGER , Jens EBERHARD , Sebastian STOLL
IPC分类号： H01L33/48 , H01L33/62 , H01L33/10 , H01L33/00 , H01L33/56
摘要： The Invention relates to a housing for an optoelectronic semiconductor component, comprising: a housing main body, which has a chip mounting side, at least two electrical conducting structures in and/or on the housing main body, and a plurality of drainage structures on the chip mounting side. The electrical conducting structures form, on the chip mounting side, electrical contact surfaces for at least one optoelectronic semiconductor chip and the drainage structure are designed as means for feeding a liquid potting material to the electrical contact surfaces.

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