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11. 发明公开

US20230352217A1 RESISTOR 审中-公开
公开(公告)号：US20230352217A1
公开(公告)日：2023-11-02
申请号：US18349774
申请日：2023-07-10
申请人： ROHM CO., LTD.
发明人： Yoichi GOTO
IPC分类号： H01C1/148 , H01C7/00
CPC分类号： H01C1/148 , H01C7/00 , H01C1/142
摘要： A resistor includes a resistive element, an insulation plate, a protective film, and a pair of electrodes. The resistive element includes a first face and a second face arranged to face in opposite directions in a thickness direction. The insulation plate is on the first face, and the protective film on the second face. The electrodes are spaced apart in a first direction perpendicular to the thickness direction, and held in contact with the resistive element. Each electrode includes a bottom portion opposite to the insulation plate with respect to the resistive element in the thickness direction. Each bottom portion overlaps with a part of the protective film as viewed in the thickness direction. The resistor further includes a pair of intermediate layers spaced apart in the first direction. The intermediate layers are formed of a material electrically conductive and containing a synthetic resin. Each intermediate layer includes a cover portion covering a part of the protective film. The cover portion of each intermediate layer is disposed between the protective film and the bottom portion of one of the electrodes.

12. 发明公开

US20230344154A1 PLUG-IN DEVICE AND POWER CONVERSION APPARATUS 审中-公开
公开(公告)号：US20230344154A1
公开(公告)日：2023-10-26
申请号：US18137269
申请日：2023-04-20
申请人： Sungrow Power Supply Co., Ltd.
发明人： Zhengwei Wu , Xiaohu Wang , Hao Zheng , Zelin Du
IPC分类号： H01R4/30 , H01R13/66 , H02M7/00 , H01C7/00
CPC分类号： H01R4/30 , H01R13/6683 , H02M7/003 , H01C7/008
摘要： A plug-in device and a power conversion apparatus are provided. The plug-in device includes a housing, a connector and a temperature acquisition device. The housing is defined with a holding cavity. The connector includes a clamping part and a fixed connection part. The clamping part is arranged in the holding cavity. The fixed connection part partially extends out of the housing. The clamping part is configured to clamp a power conversion device. The fixed connection part is connected to a reactor. The temperature acquisition device is arranged close to the connector, and is configured to acquire a temperature at an overlapping point of the power conversion device and the clamping part.

13. 发明公开

US20230326634A1 THIN FILM RESISTOR 审中-公开
公开(公告)号：US20230326634A1
公开(公告)日：2023-10-12
申请号：US17716276
申请日：2022-04-08
申请人： GLOBALFOUNDRIES Singapore Pte. Ltd.
发明人： Chuan WANG , Chim Seng SEET , Yudi SETIAWAN
IPC分类号： H01C7/00 , H01C17/08 , H01L23/528 , H01L23/522 , H01L21/768
CPC分类号： H01C7/006 , H01C17/08 , H01L23/5283 , H01L23/5228 , H01L21/76802
摘要： The present disclosure relates to semiconductor structures and, more particularly, to a thin film resistor and methods of manufacture. A structure includes: a thin film resistor having an opening and being between an upper insulator material and a lower insulator material; and a contact extending through the opening in the thin film resistor and into the lower insulator material.

14. 发明授权

US11765831B1 Resistive device 有权
公开(公告)号：US11765831B1
公开(公告)日：2023-09-19
申请号：US18120638
申请日：2023-03-13
申请人： NOKIA SOLUTIONS AND NETWORKS OY
发明人： Darrell Barabash , Abhijit Ghose , Joseph Smetana
IPC分类号： H01C7/06 , H01C7/13 , H05K1/16 , H01C7/00
CPC分类号： H05K1/167 , H01C7/006
摘要： According to an aspect, there is provided a printed circuit board-based resistive device. The resistive device comprises, arranged on a substrate of the printed circuit board of the printed circuit board: a first conductive pad; a second conductive pad; a resistive patch having a first longitudinal end connected to the first conductive pad and a second longitudinal end connected to the second conductive pad, wherein a width of the resistive patch varies along a length of the resistive patch and has a maximum at a point between the first and second longitudinal ends.

15. 发明公开

US20230274862A1 Thin Film Resistance Element and High-Frequency Circuit 审中-公开
公开(公告)号：US20230274862A1
公开(公告)日：2023-08-31
申请号：US18006342
申请日：2020-08-03
申请人： Nippon Telegraph and Telephone Corporation
发明人： Hiroshi Hamada , Hideyuki Nosaka
IPC分类号： H01C7/00 , H03H7/24 , H01C1/14 , H03F3/195
CPC分类号： H01C7/006 , H03H7/24 , H01C1/14 , H03F3/195
摘要： A thin-film resistive element includes: a first electrode that is formed with a conductor formed in an annular shape in a planar view; a second electrode that is formed with a conductor disposed at a distance from the first electrode in a region surrounded by the first electrode; and a thin-film resistor that is electrically connected to the first electrode and the second electrode.

16. 发明公开

US20230274861A1 CHIP RESISTOR 审中-公开
公开(公告)号：US20230274861A1
公开(公告)日：2023-08-31
申请号：US18314621
申请日：2023-05-09
申请人： ROHM CO., LTD.
发明人： Takanori SHINOURA
IPC分类号： H01C1/14 , H01C7/00 , H01C17/00 , H01C17/28
CPC分类号： H01C1/14 , H01C7/00 , H01C17/006 , H01C17/281
摘要： A chip resistor includes a substrate, two top electrodes, a resistor element, two back electrodes, and two side electrodes. The substrate has a top surface, a back surface and two side surface. The top and back surfaces face away in the thickness direction of the substrate. The side surfaces, spaced apart in a predetermined direction orthogonal to the thickness direction, are connected to the top and back surfaces. The top electrodes, spaced apart in the predetermined direction, are in contact with the top surface. The resistor element, disposed on the top surface, is connected to the top electrodes. The back electrodes, spaced apart in the predetermined direction, are in contact with the back surface. The side electrodes, held in contact with the side surfaces, are connected to the top and back electrodes. Each back electrode has a first and a second layer. The first layer is in contact with the back surface. The second layer, covering a part of the first layer, is made of a material containing metal particles and synthetic resin.

17. 发明公开

US20230271874A1 THICK FILM RESISTOR PASTE, THICK FILM RESISTOR, AND ELECTRONIC COMPONENT 审中-公开
公开(公告)号：US20230271874A1
公开(公告)日：2023-08-31
申请号：US17922096
申请日：2021-04-30
申请人： SUMITOMO METAL MINING CO., LTD.
发明人： Masaki Ando
IPC分类号： C03C4/14 , C03C8/16 , C03C8/10 , H01C7/00
CPC分类号： C03C4/14 , C03C8/10 , C03C8/16 , H01C7/003 , C03C2204/00 , C03C2205/00
摘要： To provide a thick film resistor paste for a resistor having a smaller resistance change rate and excellent surge resistance, a thick film resistor using the thick film resistor paste, and an electronic component provided with the thick film resistor. A thick film resistor paste comprises an organic vehicle and a conductive substance-containing glass powder comprising ruthenium oxide and lead ruthenate, the conductive substance-containing glass powder comprises 10 to 70 mass% of conductive substances, a glass composition of the conductive substance-containing glass powder comprises 3 to 30 mass% of silicon oxide, 30 to 90 mass% of lead oxide, 5 to 50 mass% of boron oxide relative to 100 mass% of glass components, and, a combined amount of silicon oxide, lead oxide and boron oxide by mass% is 50 mass% or more relative to 100 mass% of the glass components.

18. 发明授权

US11742115B2 Resistor 有权
公开(公告)号：US11742115B2
公开(公告)日：2023-08-29
申请号：US17424752
申请日：2020-01-28
申请人： ROHM CO., LTD.
发明人： Yoichi Goto
IPC分类号： H01C1/148 , H01C7/00 , H01C1/142 , H01C17/28
CPC分类号： H01C1/148 , H01C7/00 , H01C1/142 , H01C17/288
摘要： A resistor includes a resistive element, an insulation plate, a protective film, and a pair of electrodes. The resistive element includes a first face and a second face arranged to face in opposite directions in a thickness direction. The insulation plate is on the first face, and the protective film on the second face. The electrodes are spaced apart in a first direction perpendicular to the thickness direction, and held in contact with the resistive element. Each electrode includes a bottom portion opposite to the insulation plate with respect to the resistive element in the thickness direction. Each bottom portion overlaps with a part of the protective film as viewed in the thickness direction. The resistor further includes a pair of intermediate layers spaced apart in the first direction. The intermediate layers are formed of a material electrically conductive and containing a synthetic resin. Each intermediate layer includes a cover portion covering a part of the protective film. The cover portion of each intermediate layer is disposed between the protective film and the bottom portion of one of the electrodes.

19. 发明公开

US20230198066A1 BATTERY PACK 审中-公开
公开(公告)号：US20230198066A1
公开(公告)日：2023-06-22
申请号：US18171913
申请日：2023-02-21
申请人： DENSO CORPORATION
发明人： Takahiro MURAKAMI , Hironobu Kawashima , Hiromi Adachi , Takeshi Honda , Ryo Yamakawa , Hidemitsu Watanabe , Masahiro Sakakibara
IPC分类号： H01M50/204 , H01M50/284 , H01M50/569 , H01M10/48 , H01C7/00 , H01M50/298
CPC分类号： H01M50/204 , H01M50/284 , H01M50/569 , H01M10/48 , H01C7/008 , H01M50/298
摘要： A battery pack comprises a battery and a flexible printed circuit board (FPC) utilized to detect a voltage and a temperature of the battery. The FPC comprises a substrate having a front surface and a back surface, a thermistor which detects a temperature of the battery, temperature detection lines and voltage detection lines. The temperature detection lines are electrically connected to a thermistor and arranged between the back surface and the battery. The voltage detection lines are arranged on the front surface so as to overlap the temperature detection lines in a case that the FPC is observed in a plane view in a transmissive manner from a back surface to a front surface.

20. 发明申请

US20230110573A1 THREE DIMENSIONAL PRINTED RESISTOR FOR DOWNHOLE APPLICATIONS 有权
公开(公告)号：US20230110573A1
公开(公告)日：2023-04-13
申请号：US18065712
申请日：2022-12-14
申请人： Schlumberger Technology Corporation
发明人： Swapna Arun Kumar , Srinand Karuppoor
IPC分类号： H05K1/16 , H05K1/02 , B22F10/00 , H01C1/01 , H01C7/00
摘要： Aspects of the disclosure relate to apparatus and methods for producing a downhole electrical component, having steps of providing a non-conductive polymer substrate, establishing an active area on the non-conductive polymer substrate, patterning the active area on the non-conductive polymer substrate with a conductive material through an additive manufacturing process and incorporating the patterned non-conductive polymer substrate into a final arrangement.

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