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11. 发明申请

US20230116832A1 DISPLAY DEVICE 有权
公开(公告)号：US20230116832A1
公开(公告)日：2023-04-13
申请号：US17945183
申请日：2022-09-15
申请人： Samsung Display Co., LTD.
发明人： Jae Yong JANG , Sun Hwa LEE , Bon Yong KOO , Su Jin LEE
IPC分类号： H01L27/12 , G09G3/3233 , H01L25/16
摘要： A display device may include a first conductive layer disposed on a substrate, and including an auxiliary bottom line and an additional conductive pattern; a first insulating layer disposed on the substrate and the first conductive layer; a semiconductor pattern disposed on the first insulating layer; a second insulating layer disposed on the first insulating layer and the semiconductor pattern; a second conductive layer disposed on the second insulating layer, and including a conductive pattern and a gate electrode; a third insulating layer disposed on the second insulating layer and the second conductive layer; a connection pattern disposed on the third insulating layer and electrically connected to the conductive pattern; a first electrode disposed on the connection pattern and electrically connected to the connection pattern; and at least one light emitting element disposed on the first electrode and electrically connected to the first electrode.

12. 发明申请

US20230112742A1 LIGHT EMITTING SUBSTRATES AND DISPLAY DEVICES 有权
公开(公告)号：US20230112742A1
公开(公告)日：2023-04-13
申请号：US17894716
申请日：2022-08-24
申请人： Hefei BOE Ruisheng Technology Co., Ltd. , BOE Technology Group Co., Ltd.
发明人： Wenjie XU , Min HE , Xiaodong XIE , Bin PANG , Huayu SANG , Xinxiu ZHANG , Xue ZHAO , Jing WANG
IPC分类号： H01L25/16 , H01L23/538 , G09G3/32
摘要： A light emitting substrate (100) and a display device are provided. The light emitting substrate (100) includes a light emitting region (110) and a border region (160). The light emitting substrate (100) includes a base (10), and a plurality of light emitting units (102) and a plurality of signal lines (30) located on the base (10). The light emitting units (102) are located in the light emitting region (110), and each includes a driving circuit (103) and at least one light emitting element (104). The plurality of light emitting units (102) are arranged into M rows along a first direction (D1) and into N columns along a second direction (D2) intersecting the first direction (D1). The plurality of signal lines (30) include N target signal lines (31) extending along the first direction (D1); the border region (160) includes a region of the light emitting substrate (100) located outside a first column of light emitting units (101), a region of the light emitting substrate (100) located outside an Nth column of light emitting units (101), and a region of the light emitting substrate (100) located outside a first row of light emitting units. A target signal line (31) for the first column of light emitting units (101) and/or the Nth column of light emitting units (101) include(s) a first extension section (311), a connection section (312) and a second extension section (313) connected in sequence. The first extension section (311) is connected with a driving circuit (103) and located in the border region (160). The first extension section (311), the connection section (312) and the second extension section (313) enclose a receiving region surrounding at least two groups of light emitting units (102).

13. 发明申请

US20230112423A1 MICRO LED DISPLAY PANEL 有权
公开(公告)号：US20230112423A1
公开(公告)日：2023-04-13
申请号：US17574891
申请日：2022-01-13
申请人： PlayNitride Display Co., Ltd.
发明人： Shiang-Ning YANG , Yung-Chi CHU , Yu-Yun LO , Bo-Wei WU , Yu-Ya PENG
IPC分类号： H01L23/00 , H01L25/16 , H01L33/38
摘要： A micro LED display panel is provided. The micro LED display panel includes a driving substrate and a plurality of bonding pads disposed on the driving substrate and spaced apart from each other. The micro LED display panel also includes a plurality of micro LED structures electrically connected to the bonding pads. Each micro LED structure includes at least one electrode disposed on the side of the micro LED structure facing the driving substrate. The electrode has a normal contact surface and a side contact surface. The normal contact surface faces the driving substrate, and the side contact surface is laterally connected to the corresponding bonding pad.

14. 发明授权

US11626446B2 Pixel circuit and method of operating the same in an always-on mode 有权
公开(公告)号：US11626446B2
公开(公告)日：2023-04-11
申请号：US17036357
申请日：2020-09-29
申请人： STMICROELECTRONICS (RESEARCH & DEVELOPMENT) LIMITED
发明人： Neale Dutton
IPC分类号： H01L27/146 , H01L25/16 , G06T7/579 , H04N5/3745 , H01L31/02
摘要： An embodiment method of operating an imaging device including a sensor array including a plurality of pixels, includes: capturing a first low-spatial resolution frame using a subset of the plurality of pixels of the sensor array; generating, using a processor coupled to the sensor array, a first depth map using raw pixel values of the first low-spatial resolution frame; capturing a second low-spatial resolution frame using the subset of the plurality of pixels of the sensor array; generating, using the processor, a second depth map using raw pixel values of the second low-spatial resolution frame; and determining whether an object has moved in a field of view of the imaging device based on a comparison of the first depth map to the second depth map.

15. 发明授权

US11626390B1 Display devices and methods of making the same 有权
公开(公告)号：US11626390B1
公开(公告)日：2023-04-11
申请号：US17403697
申请日：2021-08-16
申请人： META PLATFORMS TECHNOLOGIES, LLC
发明人： Andrew John Ouderkirk , James Ronald Bonar , Jasmine Soria Sears
IPC分类号： H01L25/075 , H01L33/62 , H01L25/16
摘要： A display device includes a display panel having a first emission region and a second emission region that surrounds the first emission region. The display device includes a first plurality of light emitters arranged in the first emission region, a plurality of activation lines for the first emission region, a second plurality of light emitters arranged in the second emission region, and a plurality of activation lines for the second emission region. A single activation line of the plurality of activation lines for the first emission region is electrically coupled with a first number of light emitters in the first emission region and a single activation line of the plurality of activation lines for the second emission region is electrically coupled with a second number, distinct from the first number, of light emitters in the second emission region.

16. 发明授权

US11626360B2 Semiconductor device package and method for manufacturing the same 有权
公开(公告)号：US11626360B2
公开(公告)日：2023-04-11
申请号：US17486829
申请日：2021-09-27
申请人： Advanced Semiconductor Engineering, Inc.
发明人： Chang-Lin Yeh
IPC分类号： H01L21/48 , H01L23/498 , H01L25/16
摘要： A semiconductor device package includes a first substrate, a second substrate, a conductive structure, a first solder and a second solder. The second substrate is disposed over the first substrate. The conductive structure is disposed between the first substrate and the second substrate. The conductive structure includes a first wetting portion, a second wetting portion, and a non-wetting portion disposed between the first wetting portion and the second wetting portion. The first solder covers the first wetting portion and connects the conductive structure to the first substrate. The second solder covers the second wetting portion and connects the conductive structure to the second substrate. The first solder is spaced apart from the second solder by the non-wetting portion.

17. 发明授权

US11625523B2 Logic drive based on standard commodity FPGA IC chips 有权
公开(公告)号：US11625523B2
公开(公告)日：2023-04-11
申请号：US17187766
申请日：2021-02-27
申请人： iCometrue Company Ltd.
发明人： Mou-Shiung Lin , Jin-Yuan Lee
IPC分类号： G06F30/34 , G06F3/06 , H01L27/112 , G11C7/10 , H03K19/1776 , G05B19/042 , G11C11/412 , H03K19/177 , H01L25/18 , H01L25/16 , H01L27/11524
摘要： A chip package used as a logic drive, includes: multiple semiconductor chips, a polymer layer horizontally between the semiconductor chips; multiple metal layers over the semiconductor chips and polymer layer, wherein the metal layers are connected to the semiconductor chips and extend across edges of the semiconductor chips, wherein one of the metal layers has a thickness between 0.5 and 5 micrometers and a trace width between 0.5 and 5 micrometers; multiple dielectric layers each between neighboring two of the metal layers and over the semiconductor chips and polymer layer, wherein the dielectric layers extend across the edges of the semiconductor chips, wherein one of the dielectric layers has a thickness between 0.5 and 5 micrometers; and multiple metal bumps on a top one of the metal layers, wherein one of the semiconductor chips is a FPGA IC chip, and another one of the semiconductor chips is a NVMIC chip.

18. 发明授权

US11623376B2 Conductive member module, and method of manufacturing the same 有权
公开(公告)号：US11623376B2
公开(公告)日：2023-04-11
申请号：US16866431
申请日：2020-05-04
申请人： DENSO CORPORATION
发明人： Akifumi Kurita , Yohei Yoshimura , Ryota Tanabe , Tsuyoshi Arai
IPC分类号： B29C45/14 , H01B1/20 , H01R13/52 , H02G5/06 , B29L31/34 , H01L25/16 , H02M7/5387
摘要： Performed are an accommodation step of accommodating a pair of conductive members in a die, a sealing step of injecting a resin to seal the conductive members, and an extraction step of extracting a conductive member module. In the sealing step, the conductive members are sealed while a force is applied by the resin injected into the die to the individual conductive members in directions away from each other, and the individual conductive members are supported by support members disposed outside.

19. 发明授权

US11621678B2 Semiconductor device and power amplifier module 有权
公开(公告)号：US11621678B2
公开(公告)日：2023-04-04
申请号：US17143940
申请日：2021-01-07
申请人： Murata Manufacturing Co., Ltd.
发明人： Isao Obu , Yasunari Umemoto , Masahiro Shibata , Kenichi Nagura
IPC分类号： H03F1/52 , H01L23/00 , H01L29/04 , H03F3/213 , H01L29/737 , H01L27/02 , H01L27/06 , H01L29/08 , H01L29/10 , H01L29/205 , H01L29/06 , H01L21/265 , H01L29/417 , H01L29/423 , H01L23/48 , H01L29/861 , H01L21/768 , H03F3/195 , H01L21/02 , H01L29/36 , H01L29/207 , H01L29/45 , H01L21/285 , H01L21/3213 , H01L21/027 , H01L29/66 , H01L21/306 , H01L21/311 , H03F1/56 , H01L23/31 , H01L23/29 , H01L23/538 , H01L25/16 , H01L21/8252
摘要： A circuit element is formed on a substrate made of a compound semiconductor. A bonding pad is disposed on the circuit element so as to at least partially overlap the circuit element. The bonding pad includes a first metal film and a second metal film formed on the first metal film. A metal material of the second metal film has a higher Young's modulus than a metal material of the first metal film.

20. 发明申请

US20230101822A1 HYBRID CMOS MICRO-LED DISPLAY LAYOUT 有权
公开(公告)号：US20230101822A1
公开(公告)日：2023-03-30
申请号：US17947327
申请日：2022-09-19
申请人： Lumileds LLC
发明人： Toni Lopez , Florent Monestier
IPC分类号： H01L25/16 , H01L25/075 , H01L33/62
摘要： Described is a CMOS power plane including interleaving contact areas, alternating Vled and Vcat contact areas, on at least two long sides of the μLED display area. By this way, Vled and cathode current are injected uniformly along the four sides of the μLED display panel. A large cathode current distribution ring on Vled and Vcat circuits is used to distribute the current along the four sides of the panel. The current distribution ring surrounds a pixel die area. An insulated area may be included on the cathode current redistribution ring adjacent one of the of μbumps.

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