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    • 22. 发明授权
    • Semiconductor device and testing method thereof
    • 半导体器件及其测试方法
    • US08848469B2
    • 2014-09-30
    • US13333715
    • 2011-12-21
    • Bo-Yeun KimJi-Eun Jang
    • Bo-Yeun KimJi-Eun Jang
    • G11C29/00G11C29/44
    • G11C29/785G11C29/802G11C2029/4402
    • A semiconductor device includes a plurality of cell blocks activated in response to a plurality of selection signals, respectively, a pre-selection signal generator configured to generate a plurality of pre-selection signals corresponding to the cell blocks, respectively, and activate at least two of the pre-selection signals by decoding addresses in a multi-test mode, a selection signal controller configured to selectively activate the plurality of selection signals in response to the plurality pre-selection signals and control active periods of the activated selection signals so as not to overlap, and a decision circuit configured to decide whether or not the cell blocks activated in response to the activated selection signals are repaired in response to stored repair information and the plurality of selection signals.
    • 半导体器件分别包括响应于多个选择信号而被激活的多个单元块;预选择信号发生器,被配置为分别产生与单元块相对应的多个预选信号,并激活至少两个 通过在多测试模式中解码地址来选择预选信号,选择信号控制器被配置为响应于多个预选信号选择性地激活多个选择信号,并且控制所激活的选择信号的有效期,以便不 以及判定电路,其被配置为响应于所存储的修复信息和所述多个选择信号来确定响应于所激活的选择信号而被激活的单元块是否被修复。
    • 23. 发明授权
    • Method for fabricating semiconductor device
    • 制造半导体器件的方法
    • US08846472B2
    • 2014-09-30
    • US13406739
    • 2012-02-28
    • Hong-Gu Yi
    • Hong-Gu Yi
    • H01L21/336H01L21/44H01L21/4763H01L21/768H01L27/108
    • H01L21/76897H01L27/10855H01L27/10876
    • A method for fabricating a semiconductor device includes providing a substrate including first landing plugs and second landing plugs that are arrayed on a first line, forming a capping layer over the substrate, forming hole-type first trenches that expose the second landing plugs by selectively etching the capping layer, forming an insulation layer over the substrate including the first trenches, forming line-type second trenches that are stretched on the first line while overlapping with the first trenches by selectively etching the insulation layer, and forming a first conductive layer inside the second trenches.
    • 一种用于制造半导体器件的方法,包括提供包括排列在第一线上的第一着陆塞和第二着陆栓的衬底,在衬底上形成覆盖层,形成孔型第一沟槽,通过选择性蚀刻 所述覆盖层在包括所述第一沟槽的所述衬底上形成绝缘层,形成线型第二沟槽,所述第二沟槽在所述第一线上被拉伸,同时通过选择性地蚀刻所述绝缘层而与所述第一沟槽重叠,以及在所述第一沟槽内部形成第一导电层 第二壕沟
    • 28. 发明授权
    • Semiconductor memory device
    • 半导体存储器件
    • US08817555B2
    • 2014-08-26
    • US13478727
    • 2012-05-23
    • Sung-Hwa Ok
    • Sung-Hwa Ok
    • G11C7/00
    • G11C7/22G11C7/109G11C11/4076G11C11/4096G11C2207/229
    • A semiconductor memory device includes an internal signal generation unit configured to output a column select signal and a write enable signal in response to an external address, a write circuit unit configured to output internal data corresponding to external data in response to the write enable signal, a core unit configured to store the internal data in response to the column select signal, and an output timing control unit configured to control output timings of the internal signal generation unit and the write circuit unit in response to an external command, an internal synchronization signal, and preamble related information.
    • 半导体存储器件包括:内部信号生成单元,被配置为响应于外部地址输出列选择信号和写使能信号;写电路单元,被配置为响应于写使能信号输出与外部数据对应的内部数据, 核心单元,被配置为响应于列选择信号来存储内部数据;以及输出定时控制单元,被配置为响应于外部命令来控制内部信号生成单元和写入电路单元的输出定时,内部同步信号 和前导码相关信息。
    • 29. 发明授权
    • Electrostatic discharge protection circuit
    • 静电放电保护电路
    • US08780511B2
    • 2014-07-15
    • US13196258
    • 2011-08-02
    • Jung-Eon Moon
    • Jung-Eon Moon
    • H02H9/00
    • H02H9/046H01L27/0255H01L29/8611
    • An electrostatic discharge protection circuit includes a diode chain coupled between a power supply voltage end and a control node, a control voltage generator configured to generate a control voltage in response to a first current flowing through the diode chain, and a discharger configured to discharge a second current from the power supply voltage end to a ground voltage end in response to the control voltage, wherein the diode chain includes a plurality of P-well regions formed in an N-well region, diodes formed in the respective P-well regions, and a resistor coupled between the diodes.
    • 静电放电保护电路包括耦合在电源电压端和控制节点之间的二极管链,控制电压发生器,被配置成响应于流过二极管链的第一电流而产生控制电压;以及放电器, 响应于所述控制电压从所述电源电压端到地电压端的第二电流,其中所述二极管链包括形成在N阱区中的多个P阱区,在所述P阱区中形成的二极管, 和耦合在二极管之间的电阻器。
    • 30. 发明授权
    • Semiconductor device and operating method thereof
    • 半导体器件及其操作方法
    • US08766708B2
    • 2014-07-01
    • US13525805
    • 2012-06-18
    • Jun-Gyu Lee
    • Jun-Gyu Lee
    • G05F1/10
    • G11C5/147
    • A semiconductor device includes an internal voltage input buffer configured to determine voltage levels of a pull-up driving node and a pull-down driving node as a result of a comparison between a voltage level of an internal voltage node and a voltage level of a reference voltage node such that the pull-up driving node and the pull-down driving node to maintain a voltage level difference, and an internal voltage driving block configured to pull-up drive the internal voltage node in response to the voltage level of the pull-up driving node and pull-down drive the internal voltage node in response to the voltage level of the pull-down driving node.
    • 半导体器件包括内部电压输入缓冲器,其被配置为通过内部电压节点的电压电平与参考电压的电平之间的比较来确定上拉驱动节点和下拉驱动节点的电压电平 电压节点,使得上拉驱动节点和下拉驱动节点保持电压电平差;以及内部电压驱动块,其被配置为响应于所述下拉驱动节点的电压电平上拉驱动内部电压节点, 上拉驱动节点和下拉驱动内部电压节点响应于下拉驱动节点的电压电平。