会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 26. 发明申请
    • DISPLAY APPARATUS
    • 显示设备
    • US20140085853A1
    • 2014-03-27
    • US14027161
    • 2013-09-14
    • Yi-Shian ChiouChong-Yang FangWen-Chun WangWei-Chou ChenHen-Ta KangTsung-Yen Hsieh
    • Yi-Shian ChiouChong-Yang FangWen-Chun WangWei-Chou ChenHen-Ta KangTsung-Yen Hsieh
    • H05K7/02
    • H05K7/02G02B6/0016G09F27/007
    • A display apparatus including a display and a waveguide plate is provided. The display panel includes multiple rows of display units and multiple rows of solar cell units. The display units and the solar cell units are substantially parallel to a first direction and alternately arranged along a second direction perpendicular to the first direction. The waveguide plate is disposed at one side of the display panel. A first side of the waveguide plate adjacent to the display panel includes multiple microstructures. First and second structure surfaces of each microstructure respectively correspond to one row of the display units and one row of the solar cell units. When the display apparatus is disposed such that the second direction is perpendicular to a ground surface, an inclination of the first structure surface makes a thickness of the waveguide plate gradually decrease along an upward direction from the ground surface.
    • 提供了包括显示器和波导板的显示装置。 显示面板包括多列显示单元和多排太阳能电池单元。 显示单元和太阳能电池单元基本上平行于第一方向并且沿着垂直于第一方向的第二方向交替布置。 波导板设置在显示面板的一侧。 与显示面板相邻的波导板的第一侧包括多个微结构。 每个微结构的第一和第二结构表面分别对应于一排显示单元和一排太阳能电池单元。 当显示装置被布置为使得第二方向垂直于地面时,第一结构表面的倾斜使得波导板的厚度沿着从地面的向上方向逐渐减小。
    • 27. 发明申请
    • Multiple Metal Film Stack in BSI Chips
    • BSI芯片中的多金属薄膜叠层
    • US20140061842A1
    • 2014-03-06
    • US13604380
    • 2012-09-05
    • Shyh-Fann TingJiech-Fun LuMing-I WangYeur-Luen TuChing-Chun Wang
    • Shyh-Fann TingJiech-Fun LuMing-I WangYeur-Luen TuChing-Chun Wang
    • H01L27/146H01L31/18
    • H01L27/1464H01L21/76838H01L27/14623H01L27/14687
    • A method includes forming an opening extending from a back surface of a semiconductor substrate to a metal pad on a front side of the semiconductor substrate, and forming a first conductive layer including a first portion overlapping active image sensors in the semiconductor substrate, a second portion overlapping black reference image sensors in the semiconductor substrate, and a third portion in the opening to contact the metal pad. A second conductive layer is formed over and contacting the first conductive layer. A first patterning step is performed to remove the first and the second portions of the second conductive layer, wherein the first conductive layer is used as an etch stop layer. A second patterning step is performed to remove a portion of the first portion of the first conductive layer. The second and the third portions of the first conductive layer remain after the second patterning step.
    • 一种方法包括形成从半导体衬底的背表面延伸到半导体衬底的前侧上的金属焊盘的开口,以及在半导体衬底中形成包括与有源图像传感器重叠的第一部分的第一导电层,第二部分 半导体衬底中重叠的黑色参考图像传感器,以及开口中的与金属垫接触的第三部分。 在第一导电层上形成第二导电层并与第一导电层接触。 执行第一图案化步骤以去除第二导电层的第一和第二部分,其中第一导电层用作蚀刻停止层。 执行第二图案化步骤以去除第一导电层的第一部分的一部分。 在第二图案化步骤之后,第一导电层的第二和第三部分保留。