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21. 发明授权

US10215504B2 Flexible cold plate with enhanced flexibility 有权
公开(公告)号：US10215504B2
公开(公告)日：2019-02-26
申请号：US14818117
申请日：2015-08-04
申请人： International Business Machines Corporation
发明人： Paul W. Coteus , Shawn A. Hall , Mark D. Schultz , Todd E. Takken , Shurong Tian
IPC分类号： F28F7/00 , F28F3/12 , F28F3/14 , F28F3/04 , H01L23/473 , H05K7/20
摘要： An apparatus for cooling an electronic component has a planar top member of a thermal energy conductive material and a parallel planar bottom member of the material, the planar bottom member including a surface having regions configured for heat exchange contact with the electronic component. The joined planar top and bottom members have a sidewall structure of reduced height (and generally the height of the cold plate) between active areas in order to improve flexibility. The stiffness of the sidewalls is reduced by very advantageously reduce the height of the sidewalls. In one embodiment, the sidewalls are shorter in height corresponding to regions only between active areas. Alternatively, the sidewalls are of reduced height everywhere by insetting the active areas within the top and/or bottom sheets.

22. 发明授权

US09634959B2 High-density, fail-in-place switches for computer and data networks 有权
公开(公告)号：US09634959B2
公开(公告)日：2017-04-25
申请号：US14548345
申请日：2014-11-20
申请人： International Business Machines Corporation
发明人： Paul W. Coteus , Fuad E. Doany , Shawn A. Hall , Mark D. Schultz , Todd E. Takken , Shurong Tian
IPC分类号： H05K7/18 , H04L12/933 , H05K7/20
CPC分类号： H04L49/109 , H05K7/20254 , H05K7/20309 , H05K7/20318 , H05K7/20509 , H05K7/20572 , H05K7/20763
摘要： A structure for a network switch. The network switch may include a plurality of spine chips arranged on a plurality of spine cards, where one or more spine chips are located on each spine card; and a plurality of leaf chips arranged on a plurality of leaf cards, wherein one or more leaf chips are located on each leaf card, where each spine card is connected to every leaf chip and the plurality of spine chips are surrounded on at least two sides by leaf cards.

23. 发明授权

US09570373B1 Near-chip compliant layer for reducing perimeter stress during assembly process 有权
标题翻译：用于减少组装过程中周边应力的近芯片兼容层
公开(公告)号：US09570373B1
公开(公告)日：2017-02-14
申请号：US14963466
申请日：2015-12-09
申请人： International Business Machines Corporation
发明人： Mark D. Schultz , Todd E. Takken , Shurong Tian , Yuan Yao
IPC分类号： H01L23/367 , H01L25/00 , H01L25/065 , H01L25/10 , H01L21/48 , H01L23/34
CPC分类号： H01L23/3675 , H01L21/4882 , H01L23/10 , H01L23/345 , H01L23/36 , H01L25/0655 , H01L25/105 , H01L25/50
摘要： A heat source (single semiconductor chip or group of closely spaced semiconductor chips of similar height) is provided on a first side of a substrate, which substrate has on said first side a support member comprising a compressible material. A heat removal component, oriented at an angle to said heat source, is brought into proximity of said heat source such that said heat removal component contacts said support member prior to contacting said heat source. Said heat removal component is assembled to said heat source such that said support member at least partially absorbs global inequality of force that would otherwise be applied to said heat source, absent said support member comprising said compressible material.
摘要翻译：在基板的第一侧上设置有热源（单个半导体芯片或类似高度的紧密间隔的半导体芯片组），该基板在所述第一侧上具有包括可压缩材料的支撑构件。与所述热源成角度定向的散热部件被接近所述热源，使得所述散热部件在接触所述热源之前接触所述支撑部件。所述除热部件组装到所述热源，使得所述支撑构件至少部分地吸收否则将施加到所述热源的全局不均匀力，而不存在所述支撑构件包括所述可压缩材料。

24. 发明申请

US20160021795A1 DATA CENTER COOLANT SWITCH 审中-公开
公开(公告)号：US20160021795A1
公开(公告)日：2016-01-21
申请号：US14867199
申请日：2015-09-28
申请人： International Business Machines Corporation
发明人： Madhusudan K. Iyengar , Pritish R. Parida , Mark D. Schultz
IPC分类号： H05K7/20
CPC分类号： H05K7/20836 , F25B25/005 , F25B47/006 , F25B2313/009 , F25B2700/2106 , F28D15/00 , H05K7/20218 , H05K7/20254 , H05K7/2079
摘要： A data center cooling system has an indoor portion wherein heat is absorbed from components in the data center, and an outdoor heat exchanger portion wherein outside air is used to cool a first heat transfer fluid (e.g., water) present in at least the outdoor heat exchanger portion of the cooling system during a first mode. When an appropriate time has been reached to switch from the first mode to a second mode, the outdoor heat exchanger portion of the data cooling system is switched to a second heat transfer fluid, which is a relatively low performance heat transfer fluid (compared to the first fluid). It has a second heat transfer fluid freezing point, lower than the first heat transfer fluid freezing point, and sufficiently low to operate without freezing when the outdoor air temperature drops below a first predetermined relationship with the first heat transfer fluid freezing point.

25. 发明申请

US20160021794A1 DATA CENTER COOLANT SWITCH 审中-公开
标题翻译：数据中心冷却开关
公开(公告)号：US20160021794A1
公开(公告)日：2016-01-21
申请号：US14867161
申请日：2015-09-28
申请人： International Business Machines Corporation
发明人： Madhusudan K. Iyengar , Pritish R. Parida , Mark D. Schultz
IPC分类号： H05K7/20
CPC分类号： H05K7/20836 , F25B25/005 , F25B47/006 , F25B2313/009 , F25B2700/2106 , F28D15/00 , H05K7/20218 , H05K7/20254 , H05K7/2079
摘要： A data center cooling system has an indoor portion wherein heat is absorbed from components in the data center, and an outdoor heat exchanger portion wherein outside air is used to cool a first heat transfer fluid (e.g., water) present in at least the outdoor heat exchanger portion of the cooling system during a first mode. When an appropriate time has been reached to switch from the first mode to a second mode, the outdoor heat exchanger portion of the data cooling system is switched to a second heat transfer fluid, which is a relatively low performance heat transfer fluid (compared to the first fluid). It has a second heat transfer fluid freezing point, lower than the first heat transfer fluid freezing point, and sufficiently low to operate without freezing when the outdoor air temperature drops below a first predetermined relationship with the first heat transfer fluid freezing point.
摘要翻译：数据中心冷却系统具有室内部分，其中从数据中心的部件吸收热量;室外热交换器部分，其中外部空气用于冷却至少室外热量中存在的第一传热流体（例如，水）在第一模式期间冷却系统的交换器部分。当达到从第一模式切换到第二模式的适当时间时，数据冷却系统的室外热交换器部分切换到作为相对低性能的传热流体的第二传热流体（与第一流体）。其具有比第一传热流体凝固点低的第二传热流体凝固点，并且当室外空气温度低于与第一传热流体凝固点的第一预定关系时，足够低的操作而不会冻结。

26. 发明申请

US20150289406A1 HIGH-DENSITY, FAIL-IN-PLACE SWITCHES FOR COMPUTER AND DATA NETWORKS 有权
标题翻译：高密度，计算机和数据网络的失效开关
公开(公告)号：US20150289406A1
公开(公告)日：2015-10-08
申请号：US14548345
申请日：2014-11-20
申请人： International Business Machines Corporation
发明人： Paul W. Coteus , Fuad E. Doany , Shawn A. Hall , Mark D. Schultz , Todd E. Takken , Shurong Tian
IPC分类号： H05K7/18 , H05K7/20 , H04L12/933
CPC分类号： H04L49/109 , H05K7/20254 , H05K7/20309 , H05K7/20318 , H05K7/20509 , H05K7/20572 , H05K7/20763
摘要： A structure for a network switch. The network switch may include a plurality of spine chips arranged on a plurality of spine cards, where one or more spine chips are located on each spine card; and a plurality of leaf chips arranged on a plurality of leaf cards, wherein one or more leaf chips are located on each leaf card, where each spine card is connected to every leaf chip and the plurality of spine chips are surrounded on at least two sides by leaf cards.
摘要翻译：网络交换机的结构。网络交换机可以包括布置在多个脊椎卡上的多个脊椎芯片，其中一个或多个脊椎芯片位于每个脊椎卡上; 以及布置在多个叶片上的多个叶片，其中一个或多个叶片位于每个叶片上，其中每个脊椎卡连接到每个叶片，并且所述多个脊椎芯片在至少两侧被包围通过叶卡片。

27. 发明授权

US09052722B2 Dynamically limiting energy consumed by cooling apparatus 有权
标题翻译：动力限制冷却装置消耗的能量
公开(公告)号：US09052722B2
公开(公告)日：2015-06-09
申请号：US13705300
申请日：2012-12-05
申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION
发明人： Timothy J. Chainer , Milnes P. David , Madhusudan K. Iyengar , Pritish R. Parida , Roger R. Schmidt , Mark D. Schultz
IPC分类号： G06F19/00 , G05D7/06 , G06F1/20 , G11B33/14 , H05K7/20 , G06F1/32
CPC分类号： G05D7/0635 , G06F1/20 , G06F1/206 , G06F1/3206 , G11B33/144 , H05K7/20281 , H05K7/20781 , H05K7/2079 , H05K7/20836 , Y02D10/16
摘要： Cooling methods are provided which include providing: one or more coolant-cooled structures associated with an electronics rack, a coolant loop coupled in fluid communication with one or more passages of the coolant-cooled structure(s), one or more heat exchange units coupled to facilitate heat transfer from coolant within the coolant loop, and N controllable components associated with the coolant loop or the heat exchange unit(s), wherein N≧1. The N controllable components facilitate circulation of coolant through the coolant loop or transfer of heat from the coolant via the heat exchange unit(s). A controller is also provided to dynamically adjust operation of the N controllable components, based on Z input parameters and one or more specified constraints, and provide a specified cooling to the coolant-cooled structure(s), while limiting energy consumed by the N controllable components, wherein Z≧1.
摘要翻译：提供了冷却方法，其包括提供：与电子机架相关联的一个或多个冷却剂冷却结构，与冷却剂冷却结构的一个或多个通道流体连通地联接的冷却剂回路，一个或多个热交换单元以促进从冷却剂回路内的冷却剂的热传递，以及与冷却剂回路或热交换单元相关联的N个可控部件，其中N≥1。 N个可控部件促使冷却剂循环通过冷却剂回路或通过热交换单元从冷却剂传递热量。还提供控制器，以便基于Z输入参数和一个或多个指定的约束来动态地调整N个可控部件的运行，并且向冷却剂冷却的结构提供特定的冷却，同时限制由N可控的组分，其中Z≥1。

28. 发明申请

US20140190681A1 ENERGY EFFICIENCY BASED CONTROL FOR A COOLING SYSTEM 审中-公开
标题翻译：基于能源效率的冷却系统控制
公开(公告)号：US20140190681A1
公开(公告)日：2014-07-10
申请号：US13738980
申请日：2013-01-10
申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION
发明人： Timothy J. Chainer , Pritish R. Parida , Mark D. Schultz
IPC分类号： H05K7/20
CPC分类号： H05K7/20836
摘要： A method for controlling a cooling system based on a heat dissipation of an electronic module and an ambient air temperature includes determining a combination of individual controls on components of the cooling system that achieve a specific amount of cooling based on a cooling power relationship for the plurality of components, the heat dissipation of the electronic module and the ambient air temperature, and applying the individual controls to the plurality of components.
摘要翻译：基于电子模块的散热和环境空气温度控制冷却系统的方法包括基于多个冷却功率关系确定实现特定冷却量的冷却系统的部件上的各个控制的组合的组件，电子模块的散热和环境空气温度，以及将单独的控制应用于多个组件。

29. 发明授权

US11497143B2 Mechanically flexible cold plates for low power components 有权
公开(公告)号：US11497143B2
公开(公告)日：2022-11-08
申请号：US16827645
申请日：2020-03-23
申请人： International Business Machines Corporation
发明人： Paul W. Coteus , Mark D. Schultz , Todd E. Takken , Shurong Tian
IPC分类号： H05K7/20 , H01L23/367 , G06F1/20 , H01L23/473 , H01L23/373 , H01L23/40
摘要： An assembled circuit board has a topology that defines positions, dimensions and power dissipation of components mounted to the circuit board, including a high power component and one or more low power components. A cold plate makes thermal contact to the high power component through a thermal interface material. A thermally conductive sheet overlays the circuit board and is formed to match the topology of the low power component or components. The sheet has a first portion that makes thermal contact with the cold plate and a second portion that overlays the low power component or components. The cold plate removes heat directly from the high power component and indirectly through the thermally conductive sheet from the low power component or components. The thermally conductive sheet conforms to the topology of the low power components either by preforming or by flexibility.

30. 发明申请

US20220084969A1 WAFER SCALE SUPERCOMPUTER 有权
公开(公告)号：US20220084969A1
公开(公告)日：2022-03-17
申请号：US17023297
申请日：2020-09-16
申请人： International Business Machines Corporation
发明人： Evan Colgan , Timothy J. Chainer , Monty Montague Denneau , Kai Schleupen , Diego Anzola , Mark D. Schultz , Layne A. Berge
IPC分类号： H01L23/00 , H01L25/065 , H01L23/48 , H01L23/544
摘要： A data processing system includes a first wafer comprising a plurality of first chips, and kerf and crack-stop structures around perimeters of the first chips, and a second wafer comprising a plurality second chips, a plurality of interconnect structures through a connection zone between the second chips, and a plurality of thru silicon vias, wherein the first wafer and the second wafer are bonded face-to-face such that the interconnect structures of the second wafer electrically connect adjacent chip sites of the first wafer and where a pitch of the chips on the first and second wafer are equal.

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