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21. 发明授权

US09392666B2 Monolithic LED chip in an integrated control module with active circuitry 有权
公开(公告)号：US09392666B2
公开(公告)日：2016-07-12
申请号：US15008358
申请日：2016-01-27
申请人： Bridgelux, Inc.
发明人： Vladimir Odnoblyudov , Jesus Del Castillo
IPC分类号： H05B33/08 , H01L25/075 , H01L33/62 , H01L25/16 , H01L33/50 , H01L33/56 , H01L33/32
CPC分类号： H05B33/0869 , H01L25/0753 , H01L25/167 , H01L33/32 , H01L33/50 , H01L33/504 , H01L33/507 , H01L33/56 , H01L33/62 , H01L2924/0002 , H05B33/0812 , H05B33/0815 , H05B33/0827 , H05B33/083 , H05B37/0227 , H01L2924/00
摘要： A lighting device includes a monolithic LED chip flip-chip mounted onto an interconnect structure. The monolithic chip includes LED junctions formed from a single LED junction. An active electronic component is also mounted onto the interconnect structure at a distance from the monolithic chip that is less than five times the maximum dimension of the monolithic chip. The active electronic component controls LED drive currents independently supplied to the LED junctions. Different types of phosphor are disposed laterally above the various LED junctions. A color sensor measures the light emitted from the lighting device when drive currents are supplied to first and second LED junctions. The active electronic component then supplies more drive current to the first LED junction than to the second LED junction in response to the color sensor measuring the light emitted when the prior LED drive currents are supplied to the first and second LED junctions.

22. 发明授权

US09351358B2 LED array member and integrated control module assembly with built-in switching converter 有权
公开(公告)号：US09351358B2
公开(公告)日：2016-05-24
申请号：US14614361
申请日：2015-02-04
申请人： Bridgelux, Inc.
发明人： Michael Neal Gershowitz , Babak Imangholi
IPC分类号： H05B33/08 , H01L25/16 , F21K99/00 , F21V23/02 , F21V29/00 , H05B37/02 , F21V23/00 , F21V29/70 , H01L25/075 , H01L33/48 , H01L33/50 , H01L33/54 , H01L33/62 , F21Y101/02 , F21Y105/00 , H05K1/14 , H05K3/00
CPC分类号： H05B33/0815 , F21K9/20 , F21V23/006 , F21V23/02 , F21V29/70 , F21Y2101/00 , F21Y2105/10 , F21Y2115/10 , H01L25/0753 , H01L25/167 , H01L33/486 , H01L33/507 , H01L33/54 , H01L33/62 , H01L2224/48091 , H01L2224/48137 , H01L2224/73265 , H01L2924/181 , H05B33/0824 , H05B33/0827 , H05B33/083 , H05B33/0842 , H05B33/0845 , H05B33/0884 , H05B33/089 , H05B37/0272 , H05K1/142 , H05K3/0061 , H05K2201/10106 , H01L2924/00014 , H01L2924/00012
摘要： A LAM/ICM assembly comprises an integrated control module (ICM) and an LED array member (LAM). The ICM includes interconnect through which power from outside the assembly is received. In a first novel aspect, active circuitry is embedded in the ICM. In one example, the circuitry monitors LED operation, controls and supplies power to the LEDs, and communicates information into and out of the assembly. In a second novel aspect, a lighting system comprises an AC-to-DC converter and a LAM/ICM assembly. The AC-to-DC converter outputs a substantially constant current or voltage. The magnitude of the current or voltage is adjusted by a signal output from the LAM/ICM. In a third novel aspect, the ICM includes a built-in switching DC-to-DC converter. An AC-to-DC power supply supplies a roughly regulated supply voltage. The switching converter within the LAM/ICM receives the roughly regulated voltage and supplies a regulated LED drive current to its LEDs.

23. 发明授权

US09331056B2 White LED assembly with LED string and intermediate node substrate terminals 有权
公开(公告)号：US09331056B2
公开(公告)日：2016-05-03
申请号：US14671985
申请日：2015-03-27
申请人： Bridgelux, Inc.
发明人： Tao Xu , Michael Solomensky
IPC分类号： H01L33/58 , H01L33/00 , H01L27/15 , H01L25/16 , H01L25/075 , H01L33/62 , H01L33/48 , H01L33/54 , H01L33/60 , H01L33/40 , H01L33/50 , F21K99/00 , F21Y105/00
CPC分类号： H01L25/0753 , F21K9/64 , F21Y2107/50 , F21Y2115/10 , H01L25/167 , H01L27/153 , H01L33/005 , H01L33/405 , H01L33/486 , H01L33/50 , H01L33/505 , H01L33/507 , H01L33/54 , H01L33/60 , H01L33/62 , H01L2224/48091 , H01L2224/48227 , H01L2224/49171 , H01L2933/0033 , H01L2933/0041 , H01L2933/005 , H01L2933/0058 , H01L2933/0066 , H01L2924/00014 , H01L2924/00
摘要： A white LED assembly includes a string of series-connected blue LED dice mounted on a substrate. The substrate has a plurality of substrate terminals. A first of the substrate terminals is coupled to be a part of first end node of the string. A second of the substrate terminals is coupled to be a part of an intermediate node of the string. A third of the substrate terminals is coupled to be a part of a second end node of the string. Other substrate terminals may be provided and coupled to be parts of corresponding other intermediate nodes of the string. A single contiguous amount of phosphor covers all the LED dice, but does not cover any of the substrate terminals. In one example, the amount of phosphor contacts the substrate and has a circular periphery. All the LEDs are mounted to the substrate within the circular periphery.

24. 发明授权

US09312465B2 Packaging photon building blocks having only top side connections in a molded interconnect structure 有权
公开(公告)号：US09312465B2
公开(公告)日：2016-04-12
申请号：US14813277
申请日：2015-07-30
申请人： Bridgelux, Inc.
发明人： R. Scott West , Tao Tong , Mike Kwon , Michael Solomensky
IPC分类号： H01L29/18 , H01L33/62 , H01L33/48 , H01L33/58 , H01L25/075 , H01L33/54 , H01L33/60
CPC分类号： H01L25/0753 , H01L33/486 , H01L33/505 , H01L33/54 , H01L33/58 , H01L33/60 , H01L33/62 , H01L33/64 , H01L33/642 , H01L2224/45144 , H01L2224/48091 , H01L2224/48137 , H01L2224/48227 , H01L2224/49113 , H01L2224/73265 , H01L2924/07811 , H01L2933/0041 , H01L2933/005 , H01L2933/0058 , H01L2933/0066 , H01L2933/0075 , H01L2924/00014 , H01L2924/00
摘要： Standardized photon building blocks are packaged in molded interconnect structures to form a variety of LED array products. No electrical conductors pass between the top and bottom surfaces of the substrate upon which LED dies are mounted. Microdots of highly reflective material are jetted onto the top surface. Landing pads on the top surface of the substrate are attached to contact pads disposed on the underside of a lip of the interconnect structure. In a solder reflow process, the photon building blocks self-align within the interconnect structure. Conductors in the interconnect structure are electrically coupled to the LED dies in the photon building blocks through the contact pads and landing pads. Compression molding is used to form lenses over the LED dies and leaves a flash layer of silicone covering the landing pads. The flash layer laterally above the landing pads is removed by blasting particles at the flash layer.

25. 发明授权

US09277618B2 Monolithic LED chip in an integrated control module with active circuitry 有权
标题翻译：整体LED芯片集成控制模块，具有有源电路
公开(公告)号：US09277618B2
公开(公告)日：2016-03-01
申请号：US14318383
申请日：2014-06-27
申请人： Bridgelux, Inc.
发明人： Vladimir Odnoblyudov , Jesus Del Castillo
IPC分类号： H05B33/08 , H01L25/075 , H01L33/62 , H01L25/16 , H01L33/50 , H01L33/56 , H01L33/32
CPC分类号： H05B33/0869 , H01L25/0753 , H01L25/167 , H01L33/32 , H01L33/50 , H01L33/504 , H01L33/507 , H01L33/56 , H01L33/62 , H01L2924/0002 , H05B33/0812 , H05B33/0815 , H05B33/0827 , H05B33/083 , H05B37/0227 , H01L2924/00
摘要： A lighting device includes a monolithic LED chip flip-chip mounted onto an interconnect structure. The monolithic chip includes LED junctions formed from a single LED junction. An active electronic component is also mounted onto the interconnect structure at a distance from the monolithic chip that is less than five times the maximum dimension of the monolithic chip. The active electronic component controls LED drive currents independently supplied to the LED junctions. Different types of phosphor are disposed laterally above the various LED junctions. A color sensor measures the light emitted from the lighting device when drive currents are supplied to first and second LED junctions. The active electronic component then supplies more drive current to the first LED junction than to the second LED junction in response to the color sensor measuring the light emitted when the prior LED drive currents are supplied to the first and second LED junctions.
摘要翻译：照明装置包括安装在互连结构上的单片LED芯片倒装芯片。单片芯片包括由单个LED结形成的LED结。有源电子部件也被安装到互连结构上距离单片芯片一小距离的单片芯片的最大尺寸的五倍。有源电子部件控制独立提供给LED结的LED驱动电流。不同类型的荧光体被布置在各个LED结的横向上方。当驱动电流被提供给第一和第二LED结时，颜色传感器测量从照明装置发射的光。响应于颜色传感器测量当将现有LED驱动电流提供给第一和第二LED结时所发射的光，有源电子部件随后向第一LED结提供更多的驱动电流而不是第二LED结。

26. 发明授权

US09252337B1 Composite substrate for light emitting diodes 有权
标题翻译：发光二极管复合基板
公开(公告)号：US09252337B1
公开(公告)日：2016-02-02
申请号：US14579937
申请日：2014-12-22
申请人： Bridgelux, Inc.
发明人： Brian Cumpston
IPC分类号： H01L27/15 , H01L29/88 , H01L33/48 , H01L33/50 , H01L33/64 , H01L33/56 , H01L33/62 , H01L33/60 , H01L25/16 , H05K1/18 , H05K1/02 , H01L33/58 , H01L33/20
CPC分类号： H01L33/486 , H01L25/0753 , H01L25/165 , H01L25/167 , H01L33/20 , H01L33/507 , H01L33/56 , H01L33/58 , H01L33/60 , H01L33/62 , H01L33/644 , H01L2224/48091 , H01L2224/48137 , H01L2224/49107 , H01L2224/49109 , H01L2224/73265 , H01L2224/8592 , H01L2924/181 , H05K1/0274 , H05K1/184 , H05K2201/10106 , H05K2201/10643 , H05K2203/049 , H01L2924/00012 , H01L2924/00014
摘要： A low-cost device for packaging LED dies provides superior reflectivity and thermal conductivity without covering entire surfaces of an LED luminaire with an expensive reflective aluminum substrate. The LED packaging device includes a highly reflective substrate disposed in a hole in a printed circuit board. The substrate has a reflectivity greater than 97% and includes an insulating layer and a reflective layer disposed above a thicker aluminum layer. An LED die is disposed on the top surface of the substrate. The PCB has a layer of glass fiber in resin and a metal layer. The lower surface of the PCB and the bottom surface of the substrate are substantially coplanar. The metal layer of the PCB is electrically coupled to the LED die only through bond wires. Electronic circuitry is disposed on the upper surface of the PCB and is used to control light emitted from the LED die.
摘要翻译：用于封装LED裸片的低成本设备提供了优异的反射率和导热性，而不用昂贵的反射铝基板覆盖LED照明器的整个表面。 LED封装装置包括设置在印刷电路板的孔中的高反射性基板。基板的反射率大于97％，并且包括设置在较厚铝层上方的绝缘层和反射层。 LED芯片设置在基板的顶表面上。 PCB具有树脂中的玻璃纤维层和金属层。 PCB的下表面和衬底的底表面基本上共面。 PCB的金属层仅通过接合线电耦合到LED管芯。电子电路设置在PCB的上表面上，用于控制从LED管芯发出的光。

27. 发明授权

US09157626B2 Light emitting diode lamp 有权
标题翻译：发光二极管灯
公开(公告)号：US09157626B2
公开(公告)日：2015-10-13
申请号：US14060420
申请日：2013-10-22
申请人： BRIDGELUX, INC.
发明人： Keith Scott
IPC分类号： F21V29/00 , F21K99/00 , F21V3/00 , F21V29/02 , F21V9/16 , F21V29/70 , F21Y101/02
CPC分类号： F21V29/67 , F21K9/135 , F21K9/232 , F21K9/27 , F21K9/278 , F21K9/60 , F21V3/00 , F21V9/30 , F21V23/005 , F21V23/006 , F21V29/60 , F21V29/70 , F21Y2101/02 , F21Y2115/10
摘要： A light emitting apparatus includes a housing having a transparent portion, at least one LED positioned within the housing to emit light through the transparent portion, and a fan positioned within the housing to cool said at least one LED.
摘要翻译：发光装置包括具有透明部分的壳体，位于壳体内的至少一个LED，以透过透明部分发光;以及风扇，其定位在壳体内以冷却所述至少一个LED。

28. 发明申请

US20150285461A1 OPTICS FOR CHIP-ON-BOARD LIGHTING HAVING A PROTRUSION 有权
标题翻译：用于推动板上照明的光学元件
公开(公告)号：US20150285461A1
公开(公告)日：2015-10-08
申请号：US14243695
申请日：2014-04-02
申请人： BRIDGELUX, INC.
发明人： Xiaolu CHEN
IPC分类号： F21V7/09 , F21V7/00 , F21V7/10 , F21S8/08
CPC分类号： F21V7/0091 , F21S8/086 , F21V5/04 , F21V5/08 , F21V7/09 , F21W2131/103 , G02B19/0028 , G02B19/0061 , H01L27/14618 , H01L27/14625 , H01L27/14627 , H01L31/0203 , H01L31/0232 , H01L31/0236 , H01L33/20 , H01L33/38 , H01L33/44 , H01L33/486 , H01L33/54 , H01L33/60 , H01L2924/16152
摘要： A cover for a light source for use in a lamp or luminaire. An outer surface of the cover, opposite the light source, comprises a rounded shape and includes a protrusion extending from the cover. The protrusion extends substantially in a light emission direction and is shaped the protrusion to direct light emitted from the light source in a desired direction.
摘要翻译：用于灯具或灯具的光源盖。盖的与光源相对的外表面包括圆形形状并且包括从盖延伸的突起。突起基本上在发光方向上延伸并且被成形为突出部，以将光从光源发射到期望的方向。

29. 发明申请

US20150276172A1 LIGHT-EMITTING DEVICE WITH REFLECTIVE CERAMIC SUBSTRATE 审中-公开
标题翻译：具有反射性陶瓷基板的发光装置
公开(公告)号：US20150276172A1
公开(公告)日：2015-10-01
申请号：US14231657
申请日：2014-03-31
申请人： Bridgelux, Inc.
发明人： Jesus DEL CASTILLO , Scott WEST , Vladimir ODNOBLYUDOV
IPC分类号： F21V7/00 , F21V29/503 , F21K99/00 , F21V9/16 , F21V23/00
摘要： A light-emitting device may include a ceramic substrate having a reflective component, a light-emitting diode on the ceramic substrate, and a light-converting material over the light-emitting diode. A lighting system may include a ceramic substrate having a reflective component, a plurality of light-emitting diodes connected together in series, wherein the plurality of light-emitting diodes are on the ceramic substrate, and a light-converting material over the plurality of light-emitting diodes. The ceramic substrate may provide electrical insulation between the light-emitting diode and the aluminum carrier. The ceramic substrate may provide thermal conductivity between the light-emitting diode and the aluminum carrier. The reflective component may include zirconium oxide. The ceramic substrate may include aluminum oxide and/or aluminum nitride. The light-converting material may include phosphor. The light-emitting diode may have an epitaxial diode structure.
摘要翻译：发光装置可以包括具有反射部件的陶瓷基板，陶瓷基板上的发光二极管和发光二极管上的光转换材料。照明系统可以包括具有反射部件的陶瓷基板，串联连接在一起的多个发光二极管，其中多个发光二极管在陶瓷基板上，以及在多个光上的光转换材料发光二极管。陶瓷基板可以在发光二极管和铝载体之间提供电绝缘。陶瓷基板可以在发光二极管和铝载体之间提供导热性。反射组分可以包括氧化锆。陶瓷基板可以包括氧化铝和/或氮化铝。光转换材料可以包括磷光体。发光二极管可以具有外延二极管结构。

30. 发明申请

US20150276144A1 Low-Profile Outdoor Lighting Module With Light Emitting Diodes 有权
标题翻译：带发光二极管的小型户外照明模块
公开(公告)号：US20150276144A1
公开(公告)日：2015-10-01
申请号：US14229903
申请日：2014-03-29
申请人： Bridgelux, Inc.
发明人： Robert Tudhope , R. Scott West
IPC分类号： F21K99/00 , H05K3/32 , F21V23/00 , F21V31/00 , F21V13/04 , F21V29/70
CPC分类号： H05K3/32 , F21K9/00 , F21K9/90 , F21V5/08 , F21V7/05 , F21V13/04 , F21V23/005 , F21V29/70 , F21V31/005 , F21Y2101/00 , F21Y2105/10 , F21Y2115/10 , H05K1/0203 , H05K1/141 , H05K1/142 , H05K2201/048 , H05K2201/10106 , Y02B20/72 , Y10T29/4913
摘要： A low-profile lighting module with light-emitting diodes (LEDs) has a water-tight seal between a molded-plastic cover and a printed circuit board (PCB). A substrate with the LEDs fits up into an indentation in the lower surface of the PCB. Landing pads on the top of the substrate attach to contact pads in the indentation that are extensions of a conductor of the PCB which is electrically coupled through the landing pads to the LEDs. A lens with a curved optical portion surrounded by a flat lip fits into another indentation on the upper surface of the PCB. A highly reflective sheet is disposed between the planar lower surface of the lens and bottom of the indentation in the upper surface. A double-sided adhesive sheet is disposed under the inside surface of the molded-plastic cover and over both the upper surface of the PCB and the flat lip of the lens.
摘要翻译：具有发光二极管（LED）的低调照明模块在模制塑料盖和印刷电路板（PCB）之间具有防水密封。具有LED的衬底在PCB的下表面中嵌合成凹陷。衬底顶部的着陆垫附着在凹槽中的接触垫上，PCB中的导体的延伸部分通过着陆焊盘电耦合到LED。具有由平坦唇部包围的弯曲光学部分的透镜装配到PCB的上表面上的另一个凹陷中。高反射性片材设置在透镜的平面下表面和上表面的凹陷的底部之间。双面粘合片设置在模制塑料盖的内表面下方，并且在PCB的上表面和透镜的平唇之间。

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