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    • 28. 发明授权
    • Resistor trimming method
    • US10446304B2
    • 2019-10-15
    • US15516025
    • 2015-07-22
    • KOA Corporation
    • Naoto OkaHomare Sasaki
    • B23K26/00B23K26/08H01C17/242B23K26/351H01C17/00
    • The invention is to provide a resistor trimming method capable of adjusting a resistance value with ultrahigh precision and having excellent production efficiency. To achieve the object, a start point (S1) at a distance from a resistor (4) is irradiated with laser light while probes are brought into contact with a pair of surface electrodes (3) to measure a resistance value of the resistor (4). The place irradiated with the laser light is scanned so that a first trimming groove (5) extending in a direction perpendicular to a current direction can be formed in the resistor (4). Then, the place irradiated with the laser light is returned by a predetermined amount from an end point (first turning point (T1)) of the first trimming groove (5) to be set as a second turning point (T2). With the second turning point (T2) as a start point, scanning and cutting is performed to forma second trimming groove (6). Thus, the resistance value of the resistor (4) is adjusted to a target resistance value with high precision.