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21. 发明申请

US20220352419A1 DISPLAY DEVICE 有权
公开(公告)号：US20220352419A1
公开(公告)日：2022-11-03
申请号：US17559443
申请日：2021-12-22
申请人： Samsung Display Co., LTD.
发明人： Byung Choon YANG , Sung Kook PARK , Dae Ho SONG , Hyung Il JEON , Joo Woan CHO , Jin Woo CHOI
IPC分类号： H01L33/38 , H01L25/075 , H01L33/54 , H01L33/62 , H01L27/15
摘要： A display device includes a first electrode disposed on a substrate; a light emitting element disposed on the first electrode, the light emitting element being electrically connected to the first electrode; a second electrode disposed on the light emitting element, the second electrode being electrically connected to the light emitting element; a meta structure disposed on the second electrode, the meta structure overlapping the light emitting element; and a bank pattern disposed on the substrate, the bank pattern being spaced apart from the light emitting element.

22. 发明申请

US20220328738A1 SEMICONDUCTOR COMPONENT, DEVICE HAVING A SEMICONDUCTOR COMPONENT AND METHOD OF PRODUCING SEMICONDUCTOR COMPONENTS 有权
公开(公告)号：US20220328738A1
公开(公告)日：2022-10-13
申请号：US17639160
申请日：2020-08-19
申请人： OSRAM Opto Semiconductors GmbH
发明人： Berthold Hahn , Georg Bogner
IPC分类号： H01L33/58 , H01L33/22 , H01L33/40 , H01L33/50 , H01L33/54 , H01L33/62 , H01L33/00
摘要： A semiconductor component includes a radiation exit surface; a semiconductor body having an active region that generates radiation; wherein a molded body molded onto the semiconductor body; contacts for external electrical contacting of the semiconductor component are accessible on an outer side of the molded body; a deflection structure arranged between the active region and the radiation exit surface; a planarization layer arranged on the deflection structure; and a polarizer arranged on a side of the planarization layer facing away from the semiconductor body; wherein the semiconductor body on a side facing away from the radiation exit surface includes a mirror structure having at least one dielectric layer and a metallic connection layer, and the dielectric layer is arranged at locations between the semiconductor body and the metallic connection layer.

23. 发明申请

US20220320383A1 SUBSTRATE AND METHOD OF MANUFACTURING THEREOF 有权
公开(公告)号：US20220320383A1
公开(公告)日：2022-10-06
申请号：US17252156
申请日：2020-11-13
申请人： TCL CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD.
发明人： Weiwei Liu
IPC分类号： H01L33/54 , H01L33/00 , H01L33/10
摘要： A substrate and a method of manufacturing thereof. A scratch-resistant layer is formed before filling the solder paste in the area corresponding to the binding terminal of the light-emitting device on the substrate, so that each circuit in the drive circuit area of the substrate will not be damaged during screen printing. After filling solder paste, the scratch-resistant layer is stripped off to prevent the circuit on the substrate from being damaged, without affecting the performance of the substrate.

24. 发明授权

US11462663B2 Light emitting device, light emitting diode package, backlight unit, and liquid crystal display 有权
公开(公告)号：US11462663B2
公开(公告)日：2022-10-04
申请号：US17110293
申请日：2020-12-03
申请人： Seoul Semiconductor Co., Ltd.
发明人： Eun Ju Kim
IPC分类号： H01L33/46 , G02F1/13357 , H01L25/075 , H01L33/42 , H01L33/50 , H01L33/54 , H01L33/56 , H01L33/58 , H01L33/60 , H01L33/62 , G02F1/1335
摘要： A light emitting diode including a circuit board, at least one light emitting diode chip disposed on the circuit board, the light emitting diode chip including a substrate, a light emitting structure disposed under the substrate and including a first conductivity type semiconductor layer and a second conductivity type semiconductor layer, a transparent electrode layer disposed on a lower surface of the light emitting structure, first and second electrode pads electrically connected to the first and second conductivity type semiconductor layers, respectively, a reflective layer covering at least part of the lower surface of the light emitting structure, a reflective member covering an upper surface of the light emitting diode chip and including at least one of a distributed Bragg reflector (DBR) and metal, and a light transmitting resin surrounding the light emitting diode chip and the reflective member on the circuit board.

25. 发明申请

US20220310885A1 ENCAPSULATED FLUORESCENT ADHESIVE LAYER, METHOD FOR MANUFACTURING THEREOF, AND QUANTUM DOT BACKLIGHT 有权
公开(公告)号：US20220310885A1
公开(公告)日：2022-09-29
申请号：US16757390
申请日：2020-03-24
申请人： TLC CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD.
发明人： Hongquan WEI
IPC分类号： H01L33/50 , C09J11/04 , C09J133/08 , C09J163/00 , C09J183/04 , H01L33/54 , C09J11/06
摘要： The present disclosure provides an encapsulated fluorescent adhesive layer, a method for manufacturing the same, and a quantum dot backlight. The quantum dot backlight includes a substrate, a light emitting chip, and the encapsulated fluorescent adhesive layer. The encapsulated fluorescent adhesive layer is used for heat transfer and heat dissipation.

26. 发明申请

US20220302098A1 LIGHT EMITTING DEVICE 有权
公开(公告)号：US20220302098A1
公开(公告)日：2022-09-22
申请号：US17837028
申请日：2022-06-10
申请人： NICHIA CORPORATION
发明人： Kenji OZEKI , Hiroki FUKUTA
IPC分类号： H01L25/16 , H01L33/00 , H01L33/56 , H01L33/52 , H01L23/00 , H01L33/54 , H01L33/58 , H01L33/60
摘要： A light emitting device includes a substrate, a light emitting element, and a protective element. The substrate includes a support member and a plurality of wirings disposed on an upper surface of the support member. The substrate has a first side extending in a first direction and a second side opposite to the first side. The light emitting element is disposed on an upper surface of the substrate, and the protective element is disposed on the upper surface of the substrate. The plurality of wirings has a plurality of external connecting portions disposed adjacent to the first side and arranged in the first direction in a plan view. The protective element is disposed between the light emitting element and the second side of the substrate.

27. 再颁专利

USRE49146E1 Light emitting device package and lighting apparatus having same 有权
公开(公告)号：USRE49146E1
公开(公告)日：2022-07-19
申请号：US16364363
申请日：2019-03-26
申请人： SUZHOU LEKIN SEMICONDUCTOR CO., LTD.
发明人： Chang Man Lim , Won Jung Kim , Hyoung Jin Kim , Bong Kul Min , Ho Young Chung
IPC分类号： H01L23/495 , H01L25/16 , H01L25/075 , H01L33/60 , H01L33/54 , H01L33/62 , H01L33/48
摘要： An embodiment relates to a light emitting device package and a lighting apparatus having the same. According to the embodiment, a light emitting device package includes a first lead frame; a second lead frame spaced apart from the first lead frame; a body coupled to the first lead frame and the second lead frame and includes a first cavity which exposes a portion of the upper surface of the first lead frame, a second cavity which exposes a portion of the upper surface of the second lead frame, and a spacer which is disposed between the first lead frame and the second frame; at least one light emitting device disposed in the first cavity; and a protection device disposed in the second cavity. The second cavity is disposed on a first inside surface of the first cavity and the first inside surface is connected to an upper surface of the spacer, and an area of a bottom surface of the first cavity is equal to or less than 40% of entire area of the body.

28. 发明授权

US11378252B2 Lighting device 有权
公开(公告)号：US11378252B2
公开(公告)日：2022-07-05
申请号：US17264064
申请日：2019-07-31
申请人： LG INNOTEK CO., LTD.
发明人： Jung Ju Lee , Sa Rum Han
IPC分类号： F21V3/08 , F21K9/64 , F21K9/65 , H01L27/15 , H01L33/54 , F21Y105/10 , F21Y115/10 , H01L33/50
摘要： The lighting device disclosed in the embodiment includes a substrate, light sources disposed on the substrate at predetermined intervals, a resin layer disposed on the substrate and the light sources, and a phosphor layer disposed on the resin layer. The phosphor layer includes a first region overlapped with some of the N light sources in a direction perpendicular to the substrate and including a flat region, and a second region extending from a side surface of the first region toward the substrate and including a curved surface. The second region includes a first point horizontally in contact with the substrate from a center of a first light source closest to the side surface of the resin layer, a second point on the curved surface, and a third point where a straight line perpendicular to the substrate passes the center of the first light source, and a second distance from the center of the first light source to the second point is greater than a first distance from the center of the first light source to the first point, and is smaller than a third distance from the center of the first light source to the third point.

29. 发明申请

US20220199869A1 LIGHT EMITTING DIODE STRUCTURE 有权
公开(公告)号：US20220199869A1
公开(公告)日：2022-06-23
申请号：US17523865
申请日：2021-11-10
申请人： LITE-ON OPTO TECHNOLOGY (CHANGZHOU) CO., LTD.
发明人： Shu-yong Jia , ZHEN-WEI SHAO , PENG-FEI LI
IPC分类号： H01L33/50 , H01L33/58 , H01L33/54
摘要： A light emitting diode structure including a light emitting unit having a blue LED chip to produce a first light beam, a first light conversion layer disposed on the light emitting unit to convert a part of the first light beam into a second light beam, and a second light conversion layer disposed on the first light conversion layer to convert another part of the first light beam into a third light beam is provided. A remaining part of the first light beam, the second light beam, and the third light beam are superposed to form a working light beam whose spectrum includes a first wave band ranging from 350 nm to 660 nm and a second wave band ranging from 660 nm to 1000 nm. A power of the working light beam in the second wave band is higher than that in the first wave band.

30. 发明授权

US11367821B2 Light emitting device 有权
公开(公告)号：US11367821B2
公开(公告)日：2022-06-21
申请号：US16934902
申请日：2020-07-21
申请人： NICHIA CORPORATION
发明人： Hiroaki Ukawa , Ryuichi Nakagami
IPC分类号： H01L33/62 , H01L33/60 , H01L33/48 , H01L25/16 , H01L33/54
摘要： A light emitting device includes: a base member including: a first lead, a second lead, and a supporting member holding the first lead and the second lead while electrically separating the first lead and the second lead from each other; a light emitting element located on the first lead; a resin frame located on the upper surface of the base member; a first resin part surrounded by the resin frame and covering the light emitting element; and a second resin part covering the resin frame and the first resin part. The first lead includes a main part having a plurality of projecting parts disposed at a lateral surface between an upper surface and a lower surface of the main part. The plurality of projecting parts overlap with the resin frame in a plan view.

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