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    • 22. 发明授权
    • Low-temperature, photo-induced epitaxy
    • 低温,光诱导外延
    • US5123995A
    • 1992-06-23
    • US592648
    • 1990-10-04
    • Charter D. StinespringAndrew Freedman
    • Charter D. StinespringAndrew Freedman
    • C23C16/48C30B25/10H01L21/365
    • H01L21/0262C23C16/483C30B25/105C30B29/48H01L21/02395H01L21/02562H01L21/02631Y10S117/904
    • Disclosed herein is a process for producing a thin film of epitaxial material on a substrate surface at low temperatures under ultrahigh vacuum conditions. In general, precursor compounds are deposited, and converted into the epitaxial material, on the substrate surface at a temperature at which they undergo no substantial dissociation. By way of example, a beam-deposited admixture of dimethyl tellurium and dimethyl cadmium is efficiently converted to an epitaxial cadmium telluride crystal on the surface of a GaAs(100) substrate placed in an ultrahigh vacuum chamber by low power, 193 nm laser irradiation (pulse fluence approximately 6 mJ cm.sup.-2) at substrate temperature of -150.degree. C. and by subsequent annealing at 200.degree. C. for 30 seconds. In addition to efficient use of precursors, this process also permits considerable improvement of pattern resolution.
    • 本文公开了一种在超低真空条件下在低温下在衬底表面上生产外延材料薄膜的方法。 通常,前体化合物在它们不经历实际解离的温度下沉积并转化成衬底表面上的外延材料。 例如,通过低功率,193nm激光照射,在位于超高真空室的GaAs(100)衬底的表面上,将二甲基碲和二甲基镉的光束沉积的混合物有效地转化为外延碲化镉晶体( 脉冲能量密度约6mJ cm -2),然后在200℃退火30秒。 除了有效利用前体外,该方法还允许显着提高图案分辨率。
    • 28. 发明授权
    • Method of fabricating silicon-on-insulator like devices
    • 制造绝缘体上硅的器件的方法
    • US4716128A
    • 1987-12-29
    • US940255
    • 1986-12-10
    • Peter J. SchubertNadeem S. Alvi
    • Peter J. SchubertNadeem S. Alvi
    • H01L21/20H01L21/285H01L21/762H01L29/78H01L21/365
    • H01L21/28525H01L21/02381H01L21/02543H01L21/02546H01L21/0262H01L21/02639H01L21/02647H01L21/76216H01L29/78
    • A process for forming MOS transistors in which the source and drain regions essentially interface only the channel portion of the silicon substrate to keep parasitic capacitances low. To this end, a monocrystalline silicon substrate has one major planar surface covered with a layer of silicon oxide and a hole formed in the oxide layer of a size suited for the channel of the transistor. Then silicon is epitaxially grown vertically to fill the hole. The grown silicon is then covered. Next, portions of the oxide layer are removed to expose a pair of opposed vertical sidewalls of the vertically grown silicon and silicon is epitaxially grown laterally out of said exposed sidewalls. Such laterally grown regions serve as the source and drain of the transistor and an upper portion of the vertically grown silicon serves as the channel. A gate oxide is grown over a top portion of the vertically grown silicon and a polysilicon gate region is formed over the gate oxide. The gate region then serves as a mask which allows the laterally grown drain and source regions to be doped and to be self-aligned to the gate region.
    • 用于形成MOS晶体管的工艺,其中源极和漏极区域仅基本上与硅衬底的沟道部分相接,以保持寄生电容较低。 为此,单晶硅衬底具有覆盖有氧化硅层的一个主平面,并且在适于晶体管的沟道的尺寸的氧化物层中形成的孔。 然后硅垂直外延生长以填补孔。 然后覆盖生长的硅。 接下来,去除氧化物层的部分以暴露垂直生长的硅的一对相对的垂直侧壁,并且硅在所述暴露侧壁外侧向外延生长。 这种横向生长的区域用作晶体管的源极和漏极,并且垂直生长的硅的上部用作沟道。 在垂直生长的硅的顶部上生长栅极氧化物,并且在栅极氧化物上形成多晶硅栅极区。 然后,栅极区域用作掩模,其允许横向生长的漏极和源极区域被掺杂并且与栅极区域自对准。