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    • 21. 发明授权
    • Heat-flux measuring method, substrate processing system, and heat-flux measuring member
    • 热通量测量方法,基板处理系统和热通量测量部件
    • US09459159B2
    • 2016-10-04
    • US14580460
    • 2014-12-23
    • TOKYO ELECTRON LIMITED
    • Chishio KoshimizuTatsuo Matsudo
    • G01K17/20H05H1/24H05H1/00H01J37/32G01J5/58
    • G01K17/20G01J2005/583H01J37/32724H01J37/32917H01J37/32935H05H1/0043H05H1/24
    • In a heat-flux measuring method for measuring an ion flux of plasma generated in a substrate processing chamber using a heat flux, a heat-flux measuring member is exposed to the plasma and irradiated with a low coherent light. The heat-flux measuring member has a three-layered structure in which a first length and a second length of optical paths of the low-coherent light in the first layer and the third layer are measured using optical interference of reflected lights from the heat-flux measuring member. Current temperatures of the first layer and the third layer are obtained based on the measured first length, the measured second length, and data representing thermal-optical path length relationship. A heat flux flowing through the heat-flux measuring member is calculated based on the obtained temperatures, and a thickness and a thermal conductivity of the second layer.
    • 在利用热通量测量在基板处理室中产生的等离子体的离子通量的热通量测量方法中,将热量测量部件暴露于等离子体并用低相干光照射。 热通量测量部件具有三层结构,其中使用来自热交换器的反射光的光学干涉来测量第一层和第三层中的低相干光的第一长度和第二长度的光路, 焊剂测量部件。 基于所测量的第一长度,测量的第二长度和表示热 - 光路长度关系的数据,获得第一层和第三层的当前温度。 基于获得的温度,第二层的厚度和热导率计算流过热通量测量部件的热通量。
    • 24. 发明授权
    • System and method of simultaneously fueling and mitigating debris for a plasma-based illumination source
    • 同时加油和减轻等离子体照明光源碎片的系统和方法
    • US09155180B1
    • 2015-10-06
    • US13647826
    • 2012-10-09
    • KLA-Tencor Corporation
    • Karl R. Umstadter
    • H05H1/00H01J27/08G03F7/20H01J17/30
    • H05H1/00G03F7/70916H01J17/30H01J27/08H05G2/003
    • The disclosure is directed to a system and method of fueling and mitigating debris for an illumination source. An illumination system may include a plasma-based illumination source. The illumination system may provide illumination along an illumination path emanating from an illumination origin of the illumination source. A gas jet nozzle may be disposed at a selected distance from the illumination origin or proximate to the illumination origin. The gas jet nozzle may be configured to provide fuel gas to fuel the plasma-based illumination source. The gas jet nozzle may be further configured to provide fuel gas in a selected direction substantially opposite to a direction of illumination emanating from the illumination origin to remove at least a portion of debris from the illumination path.
    • 本公开涉及一种用于加注和减轻照明源的碎屑的系统和方法。 照明系统可以包括基于等离子体的照明源。 照明系统可以沿着从照明源的照明原点发出的照明路径提供照明。 气体喷嘴可以设置在距照明原点或接近照明原点的选定距离处。 气体喷嘴可以被配置为提供燃料气体来燃料基于等离子体的照明源。 气体喷嘴可以进一步构造成在与从照明原点发出的照明方向基本相反的选定方向上提供燃料气体,以从照明路径去除至少一部分碎片。
    • 27. 发明授权
    • Anti-smudging, better gripping, better shelf-life of products and surfaces
    • 防污,更好的抓握,更好的保质期的产品和表面
    • US08895888B2
    • 2014-11-25
    • US13519611
    • 2010-09-20
    • Venkata BuradaJainagesh SekharJerod BattGanta S. ReddyBrian Kandell
    • Venkata BuradaJainagesh SekharJerod BattGanta S. ReddyBrian Kandell
    • B23K10/00H05H1/00H05H1/30B08B7/00B29C59/14
    • H05H1/00B08B7/00B29C59/14H05H1/30
    • A device to provide improved anti-smudging, better gripping and longer shelf-life to products and surfaces includes an electric superheated steam generator and an electric low-ion plasma generator to provide superheated steam and low-ion plasma to the surfaces of products including plastics. One embodiment envisions the superheated steam generator and the low-ion plasma generator being contained in a housing while another embodiment anticipates a conveyor means positioned in front of the superheated steam generator and the low-ion plasma generator. A method for the improving of anti-smudging, gripping and shelf-life for properties includes the application of superheated steam and low-ion plasma by means of a superheated steam generator and a low-ion plasma generator to products for specific periods of time and at specific distances to attain desired surface and bulk properties. The superheated steam and low-ion plasma may be applied individually, simultaneously or sequentially.
    • 为产品和表面提供改进的防污染,更好的夹持和更长的保存期限的装置包括电过热蒸汽发生器和电动低离子等离子体发生器,以向包括塑料在内的产品的表面提供过热蒸汽和低离子等离子体 。 一个实施方案设想,过热蒸汽发生器和低离子等离子体发生器被包含在壳体中,而另一个实施例预期位于过热蒸汽发生器和低离子等离子体发生器前面的输送机装置。 用于改善防污染,夹持和保存性能的方法包括通过过热蒸汽发生器和低离子等离子体发生器将过热蒸汽和低离子等离子体应用于产品特定的时间段, 以达到所需的表面和体积特性。 过热蒸汽和低离子等离子体可以单独,同时或顺序地施加。
    • 30. 发明授权
    • Electrostatic chuck assembly
    • 静电吸盘组件
    • US08854790B1
    • 2014-10-07
    • US10127084
    • 2002-04-22
    • David Hsieh
    • David Hsieh
    • H02N13/00H05H1/00
    • H01L21/68735H01L21/6831
    • The present invention generally relates to an electrostatic chuck assembly for uniformly processing a wafer in a semiconductor wafer processing process, more particularly to prevent a byproduct formed from leakage of wafer processing materials from depositing between a wafer and the electrostatic chuck assembly.The electrostatic chuck assembly has a wafer holding member for holding a wafer; a shadow ring in engagement with the wafer holding member; and an insert ring disposed between the shadow ring and the wafer holding member.The wafer holding member has a wafer mounting surface and may preferably have a conical head having a tapered peripheral wall and a cylindrical portion. Alternatively, the wafer holding member is cylindrical and extends downwardly from the wafer mounting surface. The insert ring has an inner wall for sealably engaging the wafer holding member and preferably, is removable to allow for easy cleaning of the electrostatic chuck assembly.
    • 本发明一般涉及一种用于在半导体晶片加工工艺中均匀加工晶片的静电卡盘组件,更具体地说,涉及防止由晶片处理材料的泄漏形成的副产物在晶片和静电卡盘组件之间的沉积。 静电吸盘组件具有用于保持晶片的晶片保持部件; 与晶片保持构件接合的阴影环; 以及设置在所述阴影环和所述晶片保持构件之间的插入环。 晶片保持构件具有晶片安装表面,并且可以优选地具有锥形头部,其具有锥形周壁和圆柱形部分。 或者,晶片保持构件是圆柱形的并且从晶片安装表面向下延伸。 插入环具有用于密封地接合晶片保持构件的内壁,并且优选地是可移除的,以允许容易地清洁静电卡盘组件。