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    • 33. 发明授权
    • Methods of generating circuit layouts using self-alligned double patterning (SADP) techniques
    • 使用自偏转双重图案(SADP)技术生成电路布局的方法
    • US09582629B2
    • 2017-02-28
    • US14245868
    • 2014-04-04
    • GLOBALFOUNDRIES Inc.
    • Lei YuanLi YangJongwook Kye
    • H01L21/76G06F17/50
    • G06F17/5072G06F17/5077
    • At least one method disclosed herein involves creating an overall pattern layout for an integrated circuit that is to be manufactured using a self-aligned double patterning (SADP) process, forming a first metal feature having a first width on a first track of a metal layer using the SADP process, forming a second metal feature having a second width on a second track of the metal layer. The second track is adjacent to the first track. The method also includes forming an electrical connection between the first metal feature and the second metal feature to provide an effectively single metal pattern having a third width that is the sum of the first and second widths, rendering the first and second features decomposable using the SADP process; and decomposing the overall pattern layout with the first and second metal features into a mandrel mask pattern and a block mask pattern.
    • 本文公开的至少一种方法涉及为使用自对准双图案(SADP)工艺制造的集成电路的整体图案布局,在金属层的第一轨道上形成具有第一宽度的第一金属特征 使用SADP工艺,在金属层的第二轨道上形成具有第二宽度的第二金属特征。 第二条轨道与第一条轨道相邻。 该方法还包括在第一金属特征和第二金属特征之间形成电连接,以提供具有第三宽度的有效单个金属图案,该第三宽度是第一宽度和第二宽度之和,使得第一和第二特征可以使用SADP分解 处理; 并且将具有第一和第二金属特征的整体图案布局分解成心轴掩模图案和块掩模图案。
    • 40. 发明授权
    • Self-aligned via and air gap
    • 自对准通孔和气隙
    • US09368395B1
    • 2016-06-14
    • US14270660
    • 2014-05-06
    • GLOBALFOUNDRIES Inc.
    • Andy Chih-Hung WeiMark A. Zaleski
    • H01L21/768H01L23/48
    • H01L23/5226H01L21/76802H01L21/76805H01L21/76807H01L21/7682H01L21/76834H01L21/76877H01L21/76883H01L21/76897H01L23/481H01L23/5283H01L23/5329H01L29/0649
    • Provided are approaches for forming a self-aligned via and an air gap within a semiconductor device. Specifically, one approach produces a device having: a first metal line beneath a second metal line within an ultra low-k (ULK) dielectric, the first metal line connected to the second metal line by a first via; a dielectric capping layer formed over the second metal line; a third metal line within first and second via openings formed within a ULK fill material formed over the dielectric capping layer, wherein the third metal line within the first via opening extends to a top surface of the dielectric capping layer, and wherein the third metal line within the second via opening is connected to the second metal by a second via passing through the dielectric capping layer; and an air gap formed between the third metal line within the first and seconds via openings.
    • 提供了用于在半导体器件内形成自对准通孔和气隙的方法。 具体地,一种方法产生一种器件,其具有:在超低k(ULK)电介质中的第二金属线下方的第一金属线,所述第一金属线通过第一通孔连接到所述第二金属线; 形成在所述第二金属线上的电介质覆盖层; 形成在形成在电介质覆盖层上的ULK填充材料内的第一和第二通孔内的第三金属线,其中第一通孔开口内的第三金属线延伸到介电覆盖层的顶表面,并且其中第三金属线 在第二通孔开口内通过穿过电介质盖层的第二通孔连接到第二金属; 以及形成在第一和第二通孔之间的第三金属线之间的气隙。