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    • 33. 发明申请
    • Process and ink for making electronic devices
    • 用于制造电子设备的工艺和墨水
    • US20060154033A1
    • 2006-07-13
    • US10528582
    • 2003-08-22
    • Alan HopperMark James
    • Alan HopperMark James
    • B32B3/00
    • C09D11/36C09D11/101H05K3/0076H05K3/061H05K2203/013Y10T428/24917
    • A process for making an electronic device comprising a dielectric substrate laminated with an electrically conductive metal or alloy which comprises applying a non-aqueous etch-resistant ink by ink jet printing to selected areas of the metal or alloy, exposing the etch-resistant ink to actinic radiation and/or particle beam radiation to effect polymerisation, removing exposed metal or alloy by a chemical etching process and then removing the polymerised etch-resistant ink by alkali wherein the etch-resistant ink is substantially solvent free and comprises the components: A) 30 to 90 parts acrylate functional monomers free from acid groups comprising mono or higher functionality wherein 5-95% by weight is one or more mono-functional monomers; B) 1 to 30 parts acrylate functional monomer containing one or more acid groups; C) 0 to 20 parts polymer or prepolymer; D) 0 to 20 parts radical initiator; E) 0 to 5 parts colorant; F) 0 to 5 parts surfactant; and wherein the ink has a viscosity of not greater than 30 cPs (mPa·s) at 40° C. and all parts are by weight.
    • 一种用于制造电子器件的方法,该电子器件包括层叠有导电金属或合金的电介质基底,其包括通过喷墨印刷将非水性耐蚀刻油墨施加到金属或合金的选定区域,将耐蚀刻油墨暴露于 光化辐射和/或粒子束辐射以进行聚合,通过化学蚀刻工艺去除暴露的金属或合金,然后通过碱除去聚合的耐蚀刻油墨,其中耐蚀刻油墨基本上无溶剂并且包含组分:A) 30至90份不含包含单官能或更高官能度的酸基的丙烯酸酯官能单体,其中5-95重量%是一种或多种单官能单体; B)1至30份含有一个或多个酸基的丙烯酸酯官能单体; C)0至20份聚合物或预聚物; D)0〜20份自由基引发剂; E)0-5份着色剂; F)0-5份表面活性剂; 并且其中所述油墨在40℃下的粘度不大于30cPs(mPa.s),并且所有份数均为重量份。
    • 36. 发明申请
    • Plating process
    • 电镀工艺
    • US20060049129A1
    • 2006-03-09
    • US10528581
    • 2003-08-22
    • Alan HopperMark James
    • Alan HopperMark James
    • H01B13/00C23F1/00
    • C09D11/36H05K3/0076H05K3/0079H05K3/108H05K3/184H05K2203/013
    • A process for making an electronic device which comprises applying a non-aqueous plate-resistant ink by ink jet printing to selected areas of a dielectric substrate, optionally laminated with an electrically conductive metal(s), exposing the plate resistant ink to actinic and/or particle beam radiation to effect polymerisation, adding one or more metal layers by electrolytic or electroless deposition, the upper layer of which is an etch-resistant metal(s), removing the polymerised plate-resistant ink with alkali and finally removing the electrically conductive metal(s) which are optionally directly laminated to the dielectric substrate and not protected by an upper layer of etch-resistant metal(s) by chemical etching wherein the plate-resistant ink is substantially solvent-free and comprises: A) 30 to 90 parts acrylate functional monomers free from acid groups comprising mono- or higher functionality wherein 5 to 95% by weight are mono-functional monomers; B) 1 to 30 parts acrylate functional monomer containing one or more acid groups; C) 0 to 20 parts polymer or prepolymer; D) 0 to 20 parts radical initiator; E) 0 to 5 parts colorant; F) 0 to 5 parts surfactant; and where the ink has a viscosity of not greater than 30 cPs (mPa·s) at 40° C. and all parts are by weight.
    • 一种制造电子设备的方法,其包括通过喷墨印刷将非水性耐板油墨施加到电介质基板的选定区域,任选地与导电金属层压,将耐板油墨暴露于光化和/ 或粒子束辐射以进行聚合,通过电解或无电沉积加入一个或多个金属层,其上层是耐蚀刻金属,用碱除去聚合的耐板油墨,最后除去导电 任选地直接层压到电介质基底上并且不被上蚀刻金属的上层通过化学蚀刻保护的金属,其中抗板墨水基本上是无溶剂的,并且包括:A)30至90 部分丙烯酸酯官能单体不含包含单官能或更高官能度的酸基,其中5至95重量%是单官能单体; B)1至30份含有一个或多个酸基的丙烯酸酯官能单体; C)0至20份聚合物或预聚物; D)0〜20份自由基引发剂; E)0-5份着色剂; F)0-5份表面活性剂; 并且其中油墨在40℃下的粘度不大于30cPs(mPa.s),并且所有份数均为重量份。