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    • 10. 发明申请
    • COMPOSITION FOR MANUFACTURING ORGANIC SEMICONDUCTOR DEVICE
    • US20190214580A1
    • 2019-07-11
    • US16308352
    • 2017-05-17
    • DAICEL CORPORATION
    • Takeshi YOKOOYouji SUZUKIYasuyuki AKAI
    • H01L51/00
    • H01L51/0074H01L51/0004H01L51/05
    • Provided is a composition for manufacturing an organic semiconductor device, the composition enabling formation of an organic semiconductor device that stably shows high carrier mobility.A composition for manufacturing an organic semiconductor device contains 2,3-dihydrobenzofuran as a solvent and an organic semiconductor material below, in which the water content of the solvent is 0.25 wt % or less.The organic semiconductor material: at least one compound selected from the group consisting of a compound represented by formula (1-1), a compound represented by formula (1-2), a compound represented by formula (1-3), a compound represented by formula (1-4), a compound represented by formula (1-5), and a compound represented by formula (1-6). wherein X1 and X2 are the same or different and each represent an oxygen atom, a sulfur atom, or a selenium atom, m is 0 or 1, n1 and n2 are the same or different and each represent 0 or 1, and R1 and R2 are the same or different and each represent a fluorine atom, a C1-20 alkyl group, a C6-13 aryl group, a pyridyl group, a furyl group, a thienyl group, or a thiazolyl group, in which 1 or 2 or more hydrogen atoms contained in the alkyl group may be substituted by a fluorine atom, and in which 1 or 2 or more hydrogen atoms contained in the aryl group, the pyridyl group, the furyl group, the thienyl group, and the thiazolyl group may be substituted by a fluorine atom or an alkyl group having 1 to 10 carbon atoms.)