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31. 发明申请

US20130115857A1 TRANSLOCATION-SIMULATING LOADING APPARATUS FOR GEAR GRINDING MACHINE WITH SHAPED GRINDING WHEEL AND DETECTION METHOD FOR STIFFNESS DISTRIBUTION 有权
标题翻译：用于具有成型砂轮的齿轮磨床的模拟装载装置和用于紧凑分配的检测方法
公开(公告)号：US20130115857A1
公开(公告)日：2013-05-09
申请号：US13811221
申请日：2011-08-26
申请人： Yumei Huang , Yao Liu , Feng Gao , Li Zhang
发明人： Yumei Huang , Yao Liu , Feng Gao , Li Zhang
IPC分类号： B24B49/03 , B24B51/00
CPC分类号： B23Q11/001 , B23F1/02 , B23F5/04 , B23F9/025 , B23F17/00 , B23F23/10 , B23F23/12 , B23Q17/22 , G01M13/021 , G01M13/025 , Y10T409/103816 , Y10T409/103975 , Y10T409/104134 , Y10T409/104293 , Y10T409/104452
摘要： A translocation-simulating loading apparatus for gear grinding machine with shaped grinding wheel is provided. The apparatus comprises a load-receiving test piece (25) disposed on the gear grinding machine with shaped grinding wheel and a load-exerting component for use in loading simulation. The gear grinding machine with shaped grinding wheel enables a linear movement along the X axis, a linear movement forward and backward along the Y axis, a linear movement along the Z axis, a rotary movement n around the Y axis, a rotary movement C around the Z axis, and a rotary movement A around the X axis. An angle α is formed between the axis L of a ball seat (17) of the load-exerting component and the X axis direction of a Y axis component (6); an angle formed between the normal line of a load receiving face a and the X direction of the coordinate system of the machine tool is α. A detection method for static stiffness distribution is provided. The method comprises: moving the load-exerting component to a load-exertion position to exert a load, by means of a coordinating movement in the X, Y, and Z axes; detecting the displacement by a displacement sensor, and detecting the simulated load by a force sensor (13); deriving a stiffness value at the load-exertion position under the simulated load; changing the load-exertion position; repeating the above steps, thus deriving a stiffness distribution under the simulated load. Employment of the load-exerting apparatus enables automatic translocation-simulating loading. The apparatus has a simple structure. Employment of the detection method enables the detection of static stiffness distribution. Operations of the method are simple.
摘要翻译：提供了一种具有成型砂轮的齿轮磨床的易位模拟加载装置。该装置包括设置在具有成形砂轮的齿轮磨床上的载荷接收试验片（25）和用于加载模拟的载荷施加部件。具有成型砂轮的齿轮磨床使得能够沿X轴线性移动，沿Y轴向前和向后的线性运动，沿Z轴的线性运动，围绕Y轴的旋转运动n，围绕Y轴的旋转运动C Z轴，以及围绕X轴的旋转运动A. 在负载施加部件的球座（17）的轴线L与Y轴部件（6）的X轴方向之间形成角度α。在负载接收面a的法线与机床的坐标系的X方向之间形成的角度为α。提供静态刚度分布的检测方法。该方法包括：通过X，Y和Z轴的协调运动将负载施加部件移动到负载运行位置以施加负载; 通过位移传感器检测位移，并通过力传感器（13）检测模拟的载荷; 在模拟载荷下导出载荷运动位置的刚度值; 改变负荷消耗的位置; 重复上述步骤，从而导出模拟载荷下的刚度分布。使用负载施加装置可实现自动移位模拟装载。该装置结构简单。使用检测方法可以检测静态刚度分布。方法操作简单。

32. 发明授权

US07172495B2 Method and apparatus using a sensor for finish-machining teeth 有权
标题翻译：使用传感器进行精加工牙齿的方法和设备
公开(公告)号：US07172495B2
公开(公告)日：2007-02-06
申请号：US11433947
申请日：2006-05-15
申请人： Claus Kobialka
发明人： Claus Kobialka
IPC分类号： B24B49/03
CPC分类号： B23F19/057 , B23F23/1218
摘要： Teeth of a workpiece of a workpiece are finish-machined by first gauging shapes of the workpiece teeth and generating actual-value signals corresponding thereto. These actual-value signals are compared to set points representing desired tooth shapes, and the teeth of the workpiece are meshed with abrasive teeth of a honing tool and the tool and workpiece are relatively rotated while orienting them so as to remove material from workpiece teeth whose actual-value signals vary from the respective set points. The steps of gauging, comparing, and removing material are then repeated until the actual-value signals are substantially equal to the set points.
摘要翻译：通过对工件齿的第一测量形状并产生与其相对应的实际值信号，对工件的工件的牙齿进行精加工。将这些实际值信号与表示期望的齿形的设定点进行比较，并且将工件的齿与珩磨工具的研磨齿啮合，并且工具和工件相对旋转同时定向它们以从工件齿移除材料实际值信号从相应的设定点变化。然后重复测量，比较和去除材料的步骤，直到实际值信号基本上等于设定点。

33. 发明授权

US6159075A Method and system for in-situ optimization for semiconductor wafers in a chemical mechanical polishing process 有权
标题翻译：化学机械抛光工艺中半导体晶片原位优化的方法和系统
公开(公告)号：US6159075A
公开(公告)日：2000-12-12
申请号：US417417
申请日：1999-10-13
申请人： Liming Zhang
发明人： Liming Zhang
IPC分类号： B24B37/04 , B24B49/03 , G05B19/416 , H01L21/304 , H01L21/66 , B24B49/00
CPC分类号： B24B37/013 , B24B37/042 , B24B49/03 , G05B19/4163 , G05B2219/37398 , G05B2219/37602 , G05B2219/45232 , G05B2219/49085
摘要： A method for optimizing CMP (chemical mechanical polishing) processing of semiconductor wafers on a CMP machine. The optimization method includes the steps of polishing a test series of semiconductor wafers on a CMP machine. During the CMP processing, a film thickness is measured at a first point proximate to the center of each respective wafer using a film thickness detector coupled to the machine. A film thickness at a second point proximate to the outside edge of the respective wafers is also measured. Based upon the in-process film thickness measurements at the first point and the second points, the optimization process determines a polishing profile describing a removal rate and a removal uniformity with respect to a set of process variables. The process variables include different CMP machine settings for the polishing process, such as the amount of down force applied to the wafer. The polishing profile is subsequently used to polish production wafers accordingly. For each production wafer, their respective removal rate and removal uniformity is determined by measuring a film thickness at the center of each production wafer and a film thickness at the outside edge of each production wafer using the film thickness detector. Based upon these measurements, the set of process variables is adjusted in accordance the removal rate and the removal uniformity measurements to optimize the CMP process for the production wafer as each respective wafer is being polished.
摘要翻译：一种用于优化CMP机器上的半导体晶片的CMP（化学机械抛光）处理的方法。优化方法包括在CMP机器上抛光半导体晶片的测试系列的步骤。在CMP处理期间，使用耦合到机器的膜厚检测器在靠近每个相应晶片的中心的第一点处测量膜厚度。还测量了在相应晶片的外边缘附近的第二点处的膜厚度。基于在第一点和第二点处的过程中膜厚度测量，优化过程确定描述相对于一组过程变量的去除速率和去除均匀性的抛光轮廓。过程变量包括抛光过程的不同CMP机器设置，例如施加到晶片的向下力的量。随后抛光轮廓被用于相应地抛光生产晶片。对于每个生产晶片，通过使用膜厚检测器测量每个生产晶片的中心处的膜厚度和在每个生产晶片的外部边缘处的膜厚度来确定其各自的去除速率和去除均匀性。基于这些测量，根据去除速率和去除均匀度测量来调整一组工艺变量，以在每个相应的晶片被抛光时优化用于生产晶片的CMP工艺。

34. 发明授权

US06098452A Machine control gage system performing roughness and roundness measuring functions 失效
标题翻译：机器控制量规系统执行粗糙度和圆度测量功能
公开(公告)号：US06098452A
公开(公告)日：2000-08-08
申请号：US170162
申请日：1998-10-13
申请人： Masato Enomoto
发明人： Masato Enomoto
IPC分类号： B24B49/03 , B23Q15/02 , B23Q17/20 , B24B5/04 , B24B49/04 , B23Q17/09
CPC分类号： B24B5/04 , B23Q15/02 , B23Q17/20 , B24B49/04 , G05B2219/37377 , G05B2219/37402 , G05B2219/37573 , G05B2219/45161
摘要： The machine control gage system measures the size of a workpiece through a measuring head while a machining tool machines the workpiece. When the measured size of the workpiece reaches a preset size, the machine control gage system commands the machining tool to stop machining the workpiece. The machine control gage system also performs roundness and surface roughness measurement of the workpiece as well as in-process control functions. On completion of the machining, the machine control gage system obtains and samples shape data on the workpiece through the measuring head and performs a predetermined processing for the sampled data, so that the roundness and surface roughness measurement can be performed automatically.
摘要翻译：机器控制量规系统通过测量头测量工件的尺寸，而加工工具则加工工件。当测量的工件尺寸达到预设尺寸时，机床控制量规系统命令加工工具停止加工工件。机器控制量规系统还执行工件的圆度和表面粗糙度测量以及过程控制功能。加工完成后，机器控制量规系统通过测量头获取工件上的形状数据并对采样数据进行预定处理，从而可以自动进行圆度和表面粗糙度测量。

35. 发明授权

US5659492A Chemical mechanical polishing endpoint process control 失效
标题翻译：化学机械抛光终点过程控制
公开(公告)号：US5659492A
公开(公告)日：1997-08-19
申请号：US620721
申请日：1996-03-19
申请人： Leping Li , Steven George Barbee , Arnold Halperin
发明人： Leping Li , Steven George Barbee , Arnold Halperin
IPC分类号： B24B37/013 , B24B49/03 , H01L21/66 , B24B49/16
CPC分类号： B24B37/013 , B24B49/03 , H01L22/26
摘要： A method and apparatus are provided for determining the endpoint for chemical mechanical polishing a film on a wafer. First, a reference point polishing time indicating when a breakthrough of the film has occurred is determined, then an overpolishing time indicating an interval between the reference point polishing time and when the film has been completely polished is determined. To get the total polishing time to the endpoint, the reference point polishing time and the overpolishing time are added.
摘要翻译：提供了一种用于确定化学机械抛光晶片上的薄膜的终点的方法和装置。首先，确定指示膜的突破何时发生的参考点抛光时间，然后确定指示参考点研磨时间与膜完全抛光之间的间隔的过度抛光时间。为了得到终点的总抛光时间，添加了参考点抛光时间和过度抛光时间。

36. 发明授权

US5643049A Floating contact gage for measuring cylindrical workpieces exiting a grinder 失效
标题翻译：用于测量离开研磨机的圆柱形工件的浮动接触规
公开(公告)号：US5643049A
公开(公告)日：1997-07-01
申请号：US509436
申请日：1995-07-31
申请人： Karl J. Liskow
发明人： Karl J. Liskow
IPC分类号： B24B5/35 , B24B49/03 , G01B5/10
CPC分类号： G01B5/10 , B24B49/03 , B24B5/35
摘要： A gage for a thrufeed centerless grinder for post process gaging of a work piece in which the gage is mounted for movement so as to track along a moving work piece as it is moved along a path of travel from the grinder. The gage is movable in two directions mutually orthogonal to the path of travel of the work piece as it exits the grinder so as to track along the cross-section of the moving work piece enabling the gage to measure the work piece diameter. Movement of the gage is provided for by rotation about two axes wherein the gage motion is an arcuate direction having substantial vector components in the mutual orthogonal directions to the work piece path of travel.
摘要翻译：一种用于后轮过程测量工件的量具无心磨床的量规，其中，安装量具运动，以便沿着沿磨床的行进路径移动的移动工件轨道。当工件离开研磨机时，量具可在与工件的行进路径相互正交的两个方向上移动，以沿着移动工件的横截面跟踪，使得量具能够测量工件直径。通过围绕两个轴线的旋转来提供量规的移动，其中量规运动是在与工件行进路径相互正交的方向上具有相当的向量分量的弓形方向。

37. 发明授权

US5601473A Skate sharpening apparatus and method 失效
标题翻译：溜冰磨刀装置及方法
公开(公告)号：US5601473A
公开(公告)日：1997-02-11
申请号：US396185
申请日：1995-02-24
申请人： Randy L. Strain , Jeffrey P. Jannetto , Robert M. Evans
发明人： Randy L. Strain , Jeffrey P. Jannetto , Robert M. Evans
IPC分类号： A63C3/12 , B24B3/00 , B24B3/40 , B24B47/02 , B24B49/03
CPC分类号： B24B3/003 , A63C3/12
摘要： An apparatus and method for sharpening skate blades operate by measuring the length of a skate blade, determining a predetermined profile corresponding to a desired radius of curvature for the blade, and coordinating the motion of a grinding wheel and the blade to grind the blade according to the predetermined profile. A grinding force is applied by the grinding wheel against the blade using a stepper motor coupled through a screw drive, thereby not allowing the grinding wheel to chatter or bounce against the blade. In addition, the blade is clamped end-to-end by a clamping assembly that also determines the length of the blade via the position of the clamp.
摘要翻译：用于磨削溜冰刀片的装置和方法通过测量溜冰刀的长度来操作，确定与刀片的期望曲率半径对应的预定轮廓，以及协调砂轮和刀片的运动以根据预定的轮廓。使用通过螺旋驱动器联接的步进马达，砂轮将研磨力施加到刀片上，从而不允许砂轮与刀片颤动或反弹。此外，刀片通过夹持组件端对端夹紧，夹紧组件还通过夹具的位置确定刀片的长度。

38. 发明授权

US5303512A Method and apparatus for grinding a cylindrical surface of a workpiece by traverse grinding 失效
标题翻译：用于通过横向研磨研磨工件的圆柱形表面的方法和装置
公开(公告)号：US5303512A
公开(公告)日：1994-04-19
申请号：US902822
申请日：1992-06-23
申请人： Toshio Tsujiuchi , Tomoyasu Imai , Norio Ohta , Yukio Oda , Ryohei Mukai , Hisashi Nakamura , Takayuki Yoshimi
发明人： Toshio Tsujiuchi , Tomoyasu Imai , Norio Ohta , Yukio Oda , Ryohei Mukai , Hisashi Nakamura , Takayuki Yoshimi
IPC分类号： B24B1/00 , B24B5/01 , B24B5/04 , B24B49/03 , B24B49/04 , B24B49/16
CPC分类号： B24B1/00 , B24B49/03 , B24B49/04 , B24B5/01 , B24B5/04
摘要： A method and apparatus for grinding a cylindrical surface of a workpiece by a traverse movement of a grinding wheel having a relatively narrow grinding surface. To improve the cylindricity of cylindrical surface, the traverse grinding is divided into a rough traverse grinding and a finish traverse grinding. In the rough traverse grinding, a traverse girding is carried out with a large depth of cut which would causes a deterioration of the cylindricity at one end of the cylindrical surface. In the finish traverse grinding, a traverse girding is carried out with a small depth of cut to improve the cylindricity. In another embodiment, one of grinding conditions such as the traverse speed of the grinding wheel, the rotational speed of the workpiece and the peripheral speed of the grinding wheel is changed when the grinding wheel approaches an end of the cylindrical surface at which the traverse grinding ends so as to make the grinding force constant, thereby improving the cylindricity of the cylindrical surface. In other embodiments, the position of the wheel head is compensated based upon the measured diameter of the cylindrical surface so that the entire area of the cylindrical surface has a desired diameter. This compensation also improves the cylindricity of the cylindrical surface.
摘要翻译：一种用于通过具有相对窄的研磨表面的砂轮的横移来研磨工件的圆柱形表面的方法和装置。为了提高圆柱面的圆柱度，横向磨削分为粗加工磨削和精加工磨削。在粗加工研磨中，以大的切割深度进行横向加工，这将导致圆柱形表面的一端的圆柱度的劣化。在精加工磨削中，以较小的切削深度进行横向加工以提高圆柱度。在另一个实施例中，当研磨轮接近圆形表面的端部时，磨削条件（诸如砂轮的横动速度），工件的转速和砂轮的圆周速度之一变化，使磨削力保持恒定，从而提高圆筒面的圆筒度。在其他实施例中，基于圆柱形表面的测量直径来补偿轮头的位置，使得圆柱形表面的整个区域具有期望的直径。该补偿也提高了圆柱面的圆柱度。

39. 发明授权

US11679471B2 Method for operating a grinding device 有权
公开(公告)号：US11679471B2
公开(公告)日：2023-06-20
申请号：US16293871
申请日：2019-03-06
申请人： Karl Heesemann Maschinenfabrik GmbH & Co. KG
发明人： Christoph Giese
IPC分类号： B24B49/03 , B24B49/12 , B24B21/00 , B24B49/04 , B24B21/12 , B24B49/18
CPC分类号： B24B49/03 , B24B21/008 , B24B21/12 , B24B49/04 , B24B49/12 , B24B49/183
摘要： A grinding device is operated by grinding of a surface of the workpiece with at least one grinding medium while recording actual data of the surface after grinding with at least one data collection device. Actual data recorded during grinding is then compared with target data stored in an electronic memory in an electronic data processing device. Based on the comparison, adjustments are made to at least one grinding parameter if a deviation of the actual data from the target data exceeds a predetermined limit.

40. 发明授权

US11081359B2 Methods for polishing semiconductor substrates that adjust for pad-to-pad variance 有权
公开(公告)号：US11081359B2
公开(公告)日：2021-08-03
申请号：US16548429
申请日：2019-08-22
申请人： GLOBALWAFERS CO., LTD.
发明人： Ichiro Yoshimura , Alex Chu , H. J. Chiu , Sumeet Bhagavat , TaeHyeong Kim , Norimasa Katakura , Masaru Kitazawa
IPC分类号： H01L21/304 , B24B37/005 , H01L21/463 , B24B49/03 , H01L21/02 , G01N21/95 , H01L21/306
摘要： Methods for polishing semiconductor substrates that involve adjusting the finish polishing sequence based on the pad-to-pad variance of the polishing pad are disclosed.

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