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    • 33. 发明授权
    • Thermally conductive mounting element for attachment of printed circuit board to heat sink
    • 用于将印刷电路板连接到散热器的导热安装元件
    • US08410672B2
    • 2013-04-02
    • US12936547
    • 2009-04-10
    • Johannes Alexander Rebergen
    • Johannes Alexander Rebergen
    • H01J1/02
    • F21V29/70F21K9/00F21V19/004F21V19/045F21V29/004F21V29/763F21Y2115/10H01L23/4093H01L2924/0002H05K2201/10106Y10T29/49002H01L2924/00
    • An arrangement for heat dissipation for a heat generating electrical component (10) comprising a heat generating electrical component (10) arranged on the printed circuit board (20), in thermal contact with a thermally conductive layer (23) of the PCB. A thermally conductive mounting element (40) is attached to the thermally conductive layer (23) by means of soldering, and has a connecting portion (43) adapted to engage with a recess (31) in the heat sink (30); thereby enabling attachment of the printed circuit board (20) to the heat sink (30); wherein a thermal path is provided, from the heat generating electrical component (10), via the thermally conductive layer (23) and the mounting element (40), to the heat sink (30). By utilizing a thermally conductive mounting element, heat dissipation can be achieved with a PCB provided with a single thermally conductive layer, rather than the multi layer PCB required in prior art arrangements. As no screws and/or adhesives are used to attached the PCB to the heat sink, the PCB may easily be removed, and the problem of bending caused by differences in coefficient of thermal expansion is overcome.
    • 一种用于发热电气部件(10)的散热装置,包括布置在所述印刷电路板(20)上的与所述PCB的导热层(23)热接触的发热电气部件(10)。 通过焊接将导热安装元件(40)附接到导热层(23),并且具有适于与散热器(30)中的凹部(31)接合的连接部分(43); 从而能够将印刷电路板(20)附接到散热器(30); 其特征在于,从所述发热电气部件(10)经由所述导热层(23)和所述安装元件(40)向所述散热片(30)提供热路径。 通过使用导热安装元件,可以使用设置有单个导热层的PCB​​而不是现有技术中所需的多层PCB来实现散热。 由于没有使用螺钉和/或粘合剂将PCB连接到散热器,所以可以容易地去除PCB,并克服由热膨胀系数差异引起的弯曲问题。
    • 34. 发明授权
    • LED illumination apparatus
    • LED照明装置
    • US08405288B2
    • 2013-03-26
    • US12789355
    • 2010-05-27
    • Wen-Kuei Tsai
    • Wen-Kuei Tsai
    • H01J1/02
    • F21V29/70F21K9/232F21V19/0055F21V29/773F21Y2115/10
    • The present invention is directed to a light-emitting diode (LED) illumination apparatus. The apparatus includes a housing, an LED substrate, at least two electrical-insulation clamping members and associated screws, and a heat-conduction pad. At least one LED chip is fixed on the surface of the LED substrate. Each electrical-insulation clamping member has a threaded hole for screwing the screw in order to fasten the electrical-insulation clamping member to the housing; and each electrical-insulation clamping member has a recess for clamping the LED substrate. The heat-conduction pad is disposed between the housing and the LED substrate, and is used to conduct heat generated by the LED chip.
    • 本发明涉及一种发光二极管(LED)照明装置。 该装置包括壳体,LED基板,至少两个电绝缘夹紧构件和相关联的螺钉,以及导热垫。 至少一个LED芯片固定在LED基板的表面上。 每个电绝缘夹紧构件具有用于拧紧螺钉的螺纹孔,以将电绝缘夹紧构件紧固到壳体; 并且每个电绝缘夹紧构件具有用于夹持LED基板的凹部。 导热垫设置在壳体和LED基板之间,用于传导由LED芯片产生的热量。
    • 37. 发明授权
    • Lamp device of high heat dissipation efficiency
    • 灯具散热效率高
    • US08299693B2
    • 2012-10-30
    • US12967082
    • 2010-12-14
    • Shyh-Ming Chen
    • Shyh-Ming Chen
    • H01J1/02F21V29/00
    • F21V29/773F21K9/23F21Y2115/10
    • A lamp device comprises a lamp seat, having a body; a heat installed at an upper end of the body for electrically connecting to an external power source; an electric joint extending from the head; and a connecting shaft extending downwards; and a heat dissipation assembly including: a heat dissipating mask having an axial hole; the connecting shaft passing through the axial hole so that the heat dissipating mask is connected to the body; and the heat dissipating mask is rotatable; a conductive unit installed at an upper side of the heat dissipating mask; the conductive unit being electrically connected to the electric joint even the heat dissipating mask rotates with respect to the body; and a lamp set driven electrically and installed at a lower side of the heat dissipating mask; and the lamp set being retained to the conductive unit through the heat dissipating mask.
    • 灯装置包括具有主体的灯座; 安装在主体的上端的用于电连接到外部电源的热量; 从头部延伸的电接头; 和连接轴向下延伸; 以及散热组件,包括:具有轴向孔的散热掩模; 所述连接轴穿过所述轴向孔,使得所述散热掩模连接到所述主体; 散热面罩可旋转; 安装在散热掩模的上侧的导电单元; 导电单元电连接到电接头,即使散热掩模相对于主体旋转; 以及电驱动并安装在散热掩模的下侧的灯组; 并且灯组通过散热掩模保持到导电单元。
    • 38. 发明授权
    • Heat dissipating lamp structure
    • 散热灯结构
    • US08292477B2
    • 2012-10-23
    • US12786441
    • 2010-05-25
    • Jia-Yi JuangYao-Sheng Liu
    • Jia-Yi JuangYao-Sheng Liu
    • B60Q1/06H01J1/02
    • F21V29/20F21K9/233F21V23/002F21V25/00F21V29/15F21V29/713F21V29/773F21V29/86F21Y2115/10
    • A lamp structure includes a transparent cap, a lamp housing, a ring section, a separating pad, and a lamp board. The lamp housing has heat dissipating fins annularly arranged around the lamp housing. An end of each of the heat dissipating fins adjacent to the transparent cap has a groove, and the transparent cap covers the top of the groove. The ring section connects the end of each of the heat dissipating fins adjacent to the transparent cap. The separating pad is disposed on the bottom of the groove and extends along a sidewall of the groove to a region below the transparent cap to form a separating wall. The lamp board having light emitting diode devices is disposed in a containing space between the transparent cap and the separating pad to preclude damages caused by electrostatic discharge.
    • 灯结构包括透明盖,灯壳,环形部分,分离垫和灯板。 灯壳体具有环形布置在灯壳体周围的散热片。 与透明盖相邻的每个散热片的端部具有凹槽,并且透明盖覆盖凹槽的顶部。 环形部分连接与透明盖相邻的每个散热片的端部。 分离垫设置在凹槽的底部并且沿着凹槽的侧壁延伸到透明盖下方的区域以形成分隔壁。 具有发光二极管器件的灯板设置在透明盖和分离垫之间的容纳空间中,以防止由静电放电引起的损坏。
    • 39. 发明授权
    • Surface emission type electron source and drawing device
    • 表面发射型电子源和拉丝装置
    • US08232711B2
    • 2012-07-31
    • US12597035
    • 2008-04-23
    • Akira KojimaHideyuki Ohyi
    • Akira KojimaHideyuki Ohyi
    • H01J1/02
    • H01J37/073B82Y10/00B82Y40/00H01J1/312H01J37/06H01J37/3174H01J2201/312H01J2237/0635
    • A surface emission type electron source including a first electrode having a planar form, a second electrode having a planar form facing the first electrode, an electron passage layer disposed between the first electrode and the second electrode, an insulator or semiconductor layer between the second electrode and the electron passage layer, and a power source part configured to apply a voltage to the second electrode and the first electrode. The electron passage layer includes plural quantum wires extending in a first direction from the first electrode to the second electrode. The quantum wires are made of silicon and spaced apart from each other at predetermined intervals, and electrons are emitted from a front surface of the second electrode. Protrusions protruding toward leading ends of the quantum wires are formed on a back surface of the second electrode at positions corresponding to the quantum wires.
    • 一种表面发射型电子源,包括具有平面形状的第一电极,具有面向第一电极的平面形状的第二电极,设置在第一电极和第二电极之间的电子通过层,位于第二电极之间的绝缘体或半导体层 和电子通过层,以及构成为向第二电极和第一电极施加电压的电源部。 电子通过层包括从第一电极延伸到第二电极的第一方向上的多个量子线。 量子线由硅制成并且以预定间隔彼此间隔开,电子从第二电极的前表面发射。 在与量子线对应的位置处,在第二电极的背面上形成向量子线的前端突出的突起。
    • 40. 发明授权
    • LED lamp
    • 点灯
    • US08212460B1
    • 2012-07-03
    • US13095271
    • 2011-04-27
    • Duan-Cheng Hsieh
    • Duan-Cheng Hsieh
    • H01J1/02F21V29/00
    • F21V19/042F21K9/23F21V19/045F21V23/06F21Y2115/10
    • A LED lamp includes: a first base body including a first mating portion; alight emitting unit including a printed circuit board and a LED chip; a second base body including a second mating portion; a plug disposed in the first base body, and including an insulating tube, a first electrical contact formed on an inner surface of the insulating tube, and a second electrical contact formed on an outer surface of the insulating tube; a socket formed in the second base body and including a third electrical contact to electrically contact the first electrical contact, and a fourth electrical contact to electrically contact the second electrical contact; a first wire electrically connecting a positive electrode of the LED chip to the first electrical contact; and a second wire electrically connecting a negative electrode of the LED chip to the second electrical contact.
    • 一种LED灯包括:第一基体,包括第一配合部分; 包括印刷电路板和LED芯片的发光单元; 第二基体,包括第二配合部分; 插塞,其设置在所述第一基体中,并且包括绝缘管,形成在所述绝缘管的内表面上的第一电触点和形成在所述绝缘管的外表面上的第二电接触; 形成在所述第二基体中并且包括用于电接触所述第一电触点的第三电接触件的第一电接触件和与所述第二电接触件电接触的第四电触头; 将所述LED芯片的正极与所述第一电触头电连接的第一线; 以及将LED芯片的负极电连接到第二电接触点的第二线。