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1. 发明授权

US09245730B2 Apparatus and methods for generating electromagnetic radiation 有权
标题翻译：用于产生电磁辐射的装置和方法
公开(公告)号：US09245730B2
公开(公告)日：2016-01-26
申请号：US14379470
申请日：2012-02-24
申请人： Amar B. Kamdar , David Malcolm Camm , Mladen Bumbulovic , Peter Lembesis
发明人： Amar B. Kamdar , David Malcolm Camm , Mladen Bumbulovic , Peter Lembesis
IPC分类号： H01J1/02 , H01J61/10 , H01J61/52 , H01J61/84
CPC分类号： H01J61/10 , H01J61/52 , H01J61/523 , H01J61/84
摘要： An apparatus for generating electromagnetic radiation includes an envelope, a vortex generator configured to generate a vortexing flow of liquid along an inside surface of the envelope, first and second electrodes within the envelope configured to generate a plasma arc therebetween, and an insulative housing associated surrounding at least a portion of an electrical connection to one of the electrodes. The apparatus further includes a shielding system configured to block electromagnetic radiation emitted by the arc to prevent the electromagnetic radiation from striking all inner surfaces of the insulative housing. The apparatus further includes a cooling system configured to cool the shielding system.
摘要翻译：一种用于产生电磁辐射的装置包括一个外壳，一个涡流发生器，其配置成沿着该外壳的内表面产生液体的涡旋流，该外壳内的第一和第二电极构造成在其间产生等离子体电弧，至少一部分电连接到一个电极。该装置还包括屏蔽系统，其构造成阻挡由电弧发射的电磁辐射，以防止电磁辐射撞击绝缘外壳的所有内表面。该装置还包括被配置为冷却屏蔽系统的冷却系统。

2. 发明授权

US08693857B2 Irradiance pulse heat-treating methods and apparatus 有权
标题翻译：辐射脉冲热处理方法和装置
公开(公告)号：US08693857B2
公开(公告)日：2014-04-08
申请号：US13182341
申请日：2011-07-13
申请人： David Malcolm Camm , Steve McCoy , Greg Stuart
发明人： David Malcolm Camm , Steve McCoy , Greg Stuart
IPC分类号： F26B19/00
CPC分类号： H01L21/324 , C21D1/34 , C21D11/00 , H01L21/26513 , H01L21/268 , H01L21/2686 , H01L21/67115
摘要： A method of heat-treating a workpiece includes generating an initial heating portion and a subsequent sustaining portion of an irradiance pulse incident on a target surface area of the workpiece. A combined duration of the initial heating portion and the subsequent sustaining portion is less than a thermal conduction time of the workpiece. The initial heating portion heats the target surface area to a desired temperature and the subsequent sustaining portion maintains the target surface area within a desired range from the desired temperature. Another method includes generating such an initial heating portion and subsequent sustaining portion of an irradiance pulse, monitoring at least one parameter indicative of a presently completed amount of a desired thermal process during the irradiance pulse, and modifying the irradiance pulse in response to deviation of the at least one parameter from an expected value.
摘要翻译：对工件进行热处理的方法包括产生入射到工件的目标表面区域上的辐照脉冲的初始加热部分和随后的维持部分。初始加热部分和随后的维持部分的组合持续时间小于工件的热传导时间。初始加热部分将目标表面积加热至所需温度，随后的维持部分将目标表面积保持在所需温度的期望范围内。另一种方法包括生成辐照度脉冲的这种初始加热部分和随后的维持部分，在辐照脉冲期间监测指示目前完成的期望热处理量的至少一个参数，以及响应于辐射脉冲的偏差来修改辐照度脉冲来自预期值的至少一个参数。

3. 发明授权

US07781947B2 Apparatus and methods for producing electromagnetic radiation 有权
标题翻译：用于产生电磁辐射的装置和方法
公开(公告)号：US07781947B2
公开(公告)日：2010-08-24
申请号：US10777995
申请日：2004-02-12
申请人： David Malcolm Camm , Chee Chin , Rick Doolan , Tony Hewett , Arne Kjorvel , Tony Komasa , Mike Krasnich , Steve McCoy , Joseph Reyers , Igor Rudic , Ludmila Shepelev , Greg Stuart , Tilman Thrum , Alex Viel
发明人： David Malcolm Camm , Chee Chin , Rick Doolan , Tony Hewett , Arne Kjorvel , Tony Komasa , Mike Krasnich , Steve McCoy , Joseph Reyers , Igor Rudic , Ludmila Shepelev , Greg Stuart , Tilman Thrum , Alex Viel
IPC分类号： H01J61/52 , H01J1/02
CPC分类号： H01J61/90 , H01J9/38 , H01J61/24 , H01J61/52
摘要： An apparatus for producing electromagnetic radiation includes a flow generator configured to generate a flow of liquid along an inside surface of an envelope, first and second electrodes configured to generate an electrical arc within the envelope to produce the electromagnetic radiation, and an exhaust chamber extending outwardly beyond one of the electrodes, configured to accommodate a portion of the flow of liquid. In another aspect, the flow generator is electrically insulated. In another aspect, the electrodes are configured to generate an electrical discharge pulse to produce an irradiance flash, and the apparatus includes a removal device configured to remove particulate contamination from the liquid, the particulate contamination being released during the flash and being different than that released by the electrodes during continuous operation.
摘要翻译：一种用于产生电磁辐射的装置包括：流动发生器，其被配置成沿着外壳的内表面产生液体流;第一和第二电极，被配置为在外壳内产生电弧以产生电磁辐射;以及排气室向外延伸超过一个电极，被配置为容纳液体流的一部分。在另一方面，流动发生器是电绝缘的。在另一方面，电极被配置为产生放电脉冲以产生辐照闪光，并且该装置包括被配置为从液体中除去微粒污染物的去除装置，微粒污染在闪光期间被释放，并且与释放的不同通过电极连续运行。

4. 发明申请

US20080273867A1 IRRADIANCE PULSE HEAT-TREATING METHODS AND APPARATUS 有权
标题翻译：辐射脉冲热处理方法和装置
公开(公告)号：US20080273867A1
公开(公告)日：2008-11-06
申请号：US12053102
申请日：2008-03-21
申请人： David Malcolm Camm , Steve McCoy , Greg Stuart
发明人： David Malcolm Camm , Steve McCoy , Greg Stuart
IPC分类号： A21B2/00
CPC分类号： H01L21/324 , C21D1/34 , C21D11/00 , H01L21/26513 , H01L21/268 , H01L21/2686 , H01L21/67115
摘要： A method of heat-treating a workpiece includes generating an initial heating portion and a subsequent sustaining portion of an irradiance pulse incident on a target surface area of the workpiece. A combined duration of the initial heating portion and the subsequent sustaining portion is less than a thermal conduction time of the workpiece. The initial heating portion heats the target surface area to a desired temperature and the subsequent sustaining portion maintains the target surface area within a desired range from the desired temperature. Another method includes generating such an initial heating portion and subsequent sustaining portion of an irradiance pulse, monitoring at least one parameter indicative of a presently completed amount of a desired thermal process during the irradiance pulse, and modifying the irradiance pulse in response to deviation of the at least one parameter from an expected value.
摘要翻译：对工件进行热处理的方法包括产生入射到工件的目标表面区域上的辐照脉冲的初始加热部分和随后的维持部分。初始加热部分和随后的维持部分的组合持续时间小于工件的热传导时间。初始加热部分将目标表面积加热至所需温度，随后的维持部分将目标表面积保持在所需温度的期望范围内。另一种方法包括生成辐照度脉冲的这种初始加热部分和随后的维持部分，在辐照脉冲期间监测指示目前完成的期望热处理量的至少一个参数，以及响应于辐射脉冲的偏差来修改辐照度脉冲来自预期值的至少一个参数。

5. 发明申请

US20080157452A1 SYSTEMS AND METHODS FOR SUPPORTING A WORKPIECE DURING HEAT-TREATING 有权
标题翻译：用于在热处理过程中支撑工件的系统和方法
公开(公告)号：US20080157452A1
公开(公告)日：2008-07-03
申请号：US11940983
申请日：2007-11-15
申请人： David Malcolm Camm , Joseph Cibere , Mladen Bumbulovic
发明人： David Malcolm Camm , Joseph Cibere , Mladen Bumbulovic
IPC分类号： B23Q1/25
CPC分类号： H01L21/68735 , F27D5/0037 , H01L21/6875
摘要： An apparatus for supporting a workpiece during heat-treating includes a support plate having a non-planar upper surface, and a support system. The support system is configured to support the workpiece above the support plate during heat-treating of the workpiece, such that a lower surface of an initial shape of the workpiece is supported at a non-uniform spacing above the non-planar upper surface of the support plate, said non-uniform spacing including an edge gap beneath an outer perimeter of the workpiece, and a central gap at a central axis of the workpiece.
摘要翻译：用于在热处理期间支撑工件的装置包括具有非平面上表面的支撑板和支撑系统。支撑系统构造成在工件的热处理期间将支撑板上方的工件支撑，使得工件的初始形状的下表面以不均匀的间隔被支撑在非平面上表面上方支撑板，所述不均匀间隔包括在工件的外周边下方的边缘间隙，以及在工件的中心轴线处的中心间隙。

6. 发明授权

US06963692B2 Heat-treating methods and systems 有权
标题翻译：热处理方法和系统
公开(公告)号：US06963692B2
公开(公告)日：2005-11-08
申请号：US10427094
申请日：2003-04-30
申请人： David Malcolm Camm , J. Kiefer Elliot
发明人： David Malcolm Camm , J. Kiefer Elliot
IPC分类号： H01L21/265 , C30B31/12 , F27D19/00 , F27D99/00 , H01L21/00 , H01L21/26 , H01L21/268 , H01L21/324 , F26B19/00
CPC分类号： H01L21/324 , C30B31/12 , F27D19/00 , F27D2019/0003 , F27D2099/0026 , H01L21/268 , H01L21/2686 , H01L21/67115 , Y10S438/928
摘要： A method involves increasing a temperature of a workpiece over a first time period to an intermediate temperature, and heating a surface of the workpiece to a desired temperature greater than the intermediate temperature, the heating commencing within less time following the first time period than the first time period. Another method involves pre-heating the workpiece from an initial temperature to an intermediate temperature, and heating a surface of the workpiece to a desired temperature greater than the intermediate temperature by an amount less than or equal to about one-fifth of a difference between the intermediate and initial temperatures. Another method involves irradiating a first side of the workpiece to pre-heat the workpiece to an intermediate temperature, and irradiating a second side of the workpiece to heat the second side to a desired temperature greater than the intermediate temperature.
摘要翻译：一种方法包括将工件的温度在第一时间段内增加到中间温度，并且将工件的表面加热到大于中间温度的期望温度，加热开始于第一时间段之后的时间内比第一时间段时间段。另一种方法包括将工件从初始温度预热到中间温度，并且将工件的表面加热到大于中间温度的期望温度，其量小于或等于中间和初始温度。另一种方法包括照射工件的第一面以将工件预加热到中间温度，并且照射工件的第二侧以将第二侧加热至大于中间温度的所需温度。

7. 发明授权

US06941063B2 Heat-treating methods and systems 有权
公开(公告)号：US06941063B2
公开(公告)日：2005-09-06
申请号：US10005186
申请日：2001-12-04
申请人： David Malcolm Camm , J. Kiefer Elliott
发明人： David Malcolm Camm , J. Kiefer Elliott
IPC分类号： H01L21/265 , C30B31/12 , F27D19/00 , F27D99/00 , H01L21/00 , H01L21/26 , H01L21/268 , H01L21/324 , F26B19/00
CPC分类号： H01L21/324 , C30B31/12 , F27D19/00 , F27D2019/0003 , F27D2099/0026 , H01L21/268 , H01L21/2686 , H01L21/67115 , Y10S438/928
摘要： A method involves pre-heating a workpiece to an intermediate temperature, heating a surface of the workpiece to a desired temperature greater than the intermediate temperature, and enhancing cooling of the workpiece. Enhancing cooling may involve absorbing radiation thermally emitted by the workpiece. An apparatus includes a first heating source for heating a first surface of a semiconductor wafer, a second heating source for heating a second surface of the semiconductor wafer, and a first cooled window disposed between the first heating source and the semiconductor wafer.

8. 发明授权

US06303411B1 Spatially resolved temperature measurement and irradiance control 有权
标题翻译：空间分辨温度测量和辐照度控制
公开(公告)号：US06303411B1
公开(公告)日：2001-10-16
申请号：US09303512
申请日：1999-05-03
申请人： David Malcolm Camm , Marcel Edmond Lefrancois , Brendon James Hickson
发明人： David Malcolm Camm , Marcel Edmond Lefrancois , Brendon James Hickson
IPC分类号： H01L2100
CPC分类号： H01L21/67115 , Y10T29/41
摘要： A method, apparatus and system for producing a desired spatial temperature distribution across a workpiece. The method includes irradiating a plurality of areas on a surface of the workpiece to create localized heating of the workpiece in those areas, to produce the desired spatial temperature distribution in the workpiece, and the apparatus includes means for carrying out the method. The system includes a locator for locating the workpiece in a desired position relative to an energy source, and an irradiance system for carrying out the method. The system further includes a processor circuit in communication with the irradiance system, and a radiation-absorbing environment. The irradiance system includes a measuring system and at least one energy source for directing radiation to the surface of the workpiece.
摘要翻译：一种用于在工件上产生期望的空间温度分布的方法，装置和系统。该方法包括照射工件的表面上的多个区域以在这些区域中产生工件的局部加热，以在工件中产生所需的空间温度分布，并且该装置包括用于执行该方法的装置。该系统包括用于将工件定位在相对于能量源的期望位置的定位器，以及用于执行该方法的辐照系统。该系统还包括与辐照系统通信的处理器电路和辐射吸收环境。辐照系统包括测量系统和用于将辐射引导到工件表面的至少一个能量源。

9. 发明授权

US09482468B2 Repeatable heat-treating methods and apparatus 有权
标题翻译：可重复的热处理方法和装置
公开(公告)号：US09482468B2
公开(公告)日：2016-11-01
申请号：US11521074
申请日：2006-09-14
申请人： David Malcolm Camm , Sergiy Dets , Kevin McDonnell , Greg Stuart , Tilman Thrum , Igor Rudic , Ljubomir Kaludjercic
发明人： David Malcolm Camm , Sergiy Dets , Kevin McDonnell , Greg Stuart , Tilman Thrum , Igor Rudic , Ljubomir Kaludjercic
IPC分类号： G01J5/00 , G01J5/58 , F27B17/00 , H01L21/67 , H01L21/66
CPC分类号： F27B17/0025 , H01L21/67115 , H01L21/67248 , H01L22/20
摘要： A first heat-treating method involves monitoring at least one thermal efficiency parameter associated with an irradiance system configured to produce an irradiance flash incident on a surface of a workpiece, and automatically updating control information used by the irradiance system to produce the irradiance flash, in response to the monitoring of the thermal efficiency parameter. A second method involves predicting a heating effect of an irradiance flash to be incident upon a surface of a workpiece, in response to a measurement of a heating parameter of the surface, and pre-adjusting the irradiance flash, in response to the predicted heating effect. A third method involves measuring a temperature of a surface of a workpiece during an initial portion of an irradiance flash incident on the surface, and controlling a power of a remaining portion of the irradiance flash, in response to the temperature.
摘要翻译：第一热处理方法包括监测与被配置为产生入射在工件表面上的辐照闪光相关联的辐射系统的至少一个热效率参数，并且自动更新由辐照系统使用的控制信息以产生辐照闪光，响应于热效率参数的监测。第二种方法包括响应于表面的加热参数的测量以及响应于预测的加热效应来预先调节辐照度闪光来预测辐射闪光的加热效应入射到工件的表面上。第三种方法包括测量在入射到表面上的辐照闪光的初始部分期间工件表面的温度，以及响应于温度来控制辐照闪光的剩余部分的功率。

10. 发明授权

US09279727B2 Methods, apparatus and media for determining a shape of an irradiance pulse to which a workpiece is to be exposed 有权
标题翻译：用于确定要暴露工件的辐照脉冲的形状的方法，装置和介质
公开(公告)号：US09279727B2
公开(公告)日：2016-03-08
申请号：US13824269
申请日：2011-10-14
申请人： Joseph Cibere , David Malcolm Camm
发明人： Joseph Cibere , David Malcolm Camm
IPC分类号： G01J5/02 , H01L21/67 , H01L21/66
CPC分类号： G01J5/02 , H01L21/67115 , H01L21/67248 , H01L22/12 , H01L22/20
摘要： A method and system for determining a shape of an irradiance pulse to which a semiconductor wafer is to be exposed during a thermal cycle are disclosed. The method includes receiving, with a processor circuit, thermal cycle parameters specifying requirements of the thermal cycle, and determining, with the processor circuit, a shape of a heating portion of the irradiance pulse. Determining includes optimizing at least one parameter of a flux profile model of the heating portion of the irradiance pulse to satisfy the requirements while minimizing frequency-domain energy spectral densities of the flux profile model at resonant frequencies of the wafer, to minimize vibration of the wafer at the resonant frequencies when the wafer is exposed to the irradiance pulse.
摘要翻译：公开了一种在热循环期间确定半导体晶片将被暴露的辐照脉冲的形状的方法和系统。该方法包括使用处理器电路接收指定热循环的要求的热循环参数，以及利用处理器电路确定辐照脉冲的加热部分的形状。确定包括优化辐照脉冲的加热部分的通量分布模型的至少一个参数以满足要求，同时使晶片的谐振频率处的通量分布模型的频域能量密度最小化，以最小化晶片的振动当晶片暴露于辐照度脉冲时的谐振频率。

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