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41. 发明申请

US20060134085A1 Compositions containing coenzyme q10 有权
标题翻译：含辅酶Q10的组合物
公开(公告)号：US20060134085A1
公开(公告)日：2006-06-22
申请号：US10542203
申请日：2004-01-15
申请人： Rumi Yamaguchi , Hiroaki Yamaguchi , Hironobu Nanbu , Lekh Juneja , Nagahiro Yamazaki
发明人： Rumi Yamaguchi , Hiroaki Yamaguchi , Hironobu Nanbu , Lekh Juneja , Nagahiro Yamazaki
IPC分类号： A61K38/43 , A61K31/22 , A61K31/225 , A61K31/12
CPC分类号： A61K9/107 , A23L2/52 , A23L29/10 , A23L33/10 , A23L33/105 , A23L33/145 , A23V2002/00 , A61K31/122 , A23V2250/314 , A23V2200/222
摘要： A coenzyme Q10-containing composition comprising a coenzyme Q10 and a hydrophilic fatty acid ester of a polyhydric alcohol; a coenzyme Q10-containing composition comprising a coenzyme Q10, a lipophilic fatty acid ester of a polyhydric alcohol and a hydrophilic fatty acid ester of a polyhydric alcohol; and a food or beverage comprising the coenzyme Q10-containing composition as defined above.
摘要翻译：一种含辅酶Q10的组合物，其包含辅酶Q10和多元醇的亲水性脂肪酸酯; 含辅酶Q10的组合物，其包含辅酶Q10，多元醇的亲脂性脂肪酸酯和多元醇的亲水性脂肪酸酯; 以及包含上述含有辅酶Q 10的组合物的食品或饮料。

42. 发明申请

US20050256230A1 Cationic polymerizable adhesive composition and anisotropically electroconductive adhesive composition 审中-公开
标题翻译：阳离子可聚合粘合剂组合物和各向异性导电粘合剂组合物
公开(公告)号：US20050256230A1
公开(公告)日：2005-11-17
申请号：US10502501
申请日：2003-02-19
申请人： Hiroaki Yamaguchi , Ryota Akiyama
发明人： Hiroaki Yamaguchi , Ryota Akiyama
IPC分类号： C08L63/00
CPC分类号： C08G59/687 , C08L71/12 , C08L2666/22 , C09J163/00
摘要： In a cationic polymerizable adhesive composition comprising (A) a cationic polymerizable monomer selected from an epoxy monomer, a vinyl ether monomer, or a mixture thereof; (B) a cationic polymerization catalyst; and (C) a solvent for the cationic polymerization catalyst, a mixture of a good solvent and a poor solvent for the cationic polymerization catalyst is used as the solvent.
摘要翻译：一种阳离子可聚合粘合剂组合物，其包含（A）选自环氧单体，乙烯基醚单体或其混合物的阳离子可聚合单体; （B）阳离子聚合催化剂; 和（C）用于阳离子聚合催化剂的溶剂，使用阳离子聚合催化剂的良溶剂和不良溶剂的混合物作为溶剂。

43. 发明授权

US06955739B2 Method for adhering substrates using ultraviolet activatable adhesive film and an ultraviolet irradiation apparatus 有权
标题翻译：使用紫外线可激活粘合剂膜和紫外线照射装置粘附基底的方法
公开(公告)号：US06955739B2
公开(公告)日：2005-10-18
申请号：US10480218
申请日：2002-05-24
申请人： Hiroaki Yamaguchi , Tetsu Kitamura
发明人： Hiroaki Yamaguchi , Tetsu Kitamura
IPC分类号： C09J5/06 , H05K3/32 , H05K3/36 , B32B27/04 , B32B27/38 , B32B31/12 , C09J163/00 , C09J163/02
CPC分类号： H05K3/323 , C09J5/06 , H05K3/361 , H05K2203/1121
摘要： The invention provides a method for adhering two substrates comprising: providing an adhesive film having a first surface and a second surface; irradiating the adhesive film with ultraviolet radiation to provide an activated adhesive film having a first activated surface and a second activated surface; cooling the activated adhesive film either while irradiating or immediately after irradiating the film; contacting the first activated surface with a first substrate; contacting the second activated surface with a second substrate; and applying heat and pressure to the first and second substrates to cure the activated adhesive film and to bond the substrates to one another.
摘要翻译：本发明提供一种用于粘合两个基底的方法，包括：提供具有第一表面和第二表面的粘合剂膜; 用紫外线辐射照射粘合剂膜以提供具有第一活化表面和第二活化表面的活化粘合剂膜; 在照射或在照射膜之后立即冷却活化的粘合剂膜; 使第一活化表面与第一基底接触; 使所述第二活化表面与第二基底接触; 并向第一和第二基板施加热和压力以固化活化的粘合剂膜并将基板彼此粘合。

44. 发明申请

US20050074592A1 Easily slidable polyimide film and substrate employing it 有权
标题翻译：易于滑动的聚酰亚胺薄膜和使用它的基材
公开(公告)号：US20050074592A1
公开(公告)日：2005-04-07
申请号：US10952219
申请日：2004-09-28
申请人： Masafumi Hashimoto , Toshiyuki Nishino , Toshihiko Anno , Hiroaki Yamaguchi
发明人： Masafumi Hashimoto , Toshiyuki Nishino , Toshihiko Anno , Hiroaki Yamaguchi
IPC分类号： B32B15/08 , B32B27/34 , C08J5/18 , C08L79/08 , H05K1/03 , B32B27/06
CPC分类号： B32B15/08 , B32B15/20 , B32B27/281 , B32B27/34 , C08J5/18 , C08J2379/08 , C08L79/08 , H05K1/0346 , H05K1/036 , H05K2201/0154 , H05K2201/0212 , Y10T428/25 , Y10T428/254 , Y10T428/26 , Y10T428/269 , Y10T428/31678 , Y10T428/31681 , Y10T428/31721
摘要： An easily slidable polyimide film having a polyimide surface layer comprising a polyimide which is thermoplastic and has a glass transition temperature of 190-450° C., wherein there are dispersed in the polyimide of the polyimide surface layer, in a proportion of approximately 0.5-10 mass % based on the polyimide of the polyimide surface layer, wholly aromatic polyimide particles made of a polyimide comprising at least 80 mass % of a pyromellitic acid component and a p-phenylenediamine component, and having a median size of 0.3-0.8 μm and a maximum size of no greater than 2 μm, in at least about 1 μm of the polyimide surface layer.
摘要翻译：一种容易滑动的聚酰亚胺膜，其具有聚酰亚胺表面层，该聚酰亚胺表面层包含热塑性聚酰亚胺，玻璃化转变温度为190-450℃，其中分散在聚酰亚胺表面层的聚酰亚胺中的比例约为0.5〜基于聚酰亚胺表面层的聚酰亚胺为10质量％，由包含至少80质量％的均苯四酸酸组分和对苯二胺组分的聚酰亚胺制成的全芳香族聚酰亚胺颗粒，中值粒径为0.3-0.8μm，最大尺寸不大于2μm，至少约1μm的聚酰亚胺表面层。

45. 发明授权

US06824827B2 Method of making a polyimide film having a thin metal layer 有权
标题翻译：制造具有薄金属层的聚酰亚胺膜的方法
公开(公告)号：US06824827B2
公开(公告)日：2004-11-30
申请号：US10681179
申请日：2003-10-09
申请人： Shozo Katsuki , Toshihiko Anno , Osamu Nakayama , Hiroaki Yamaguchi
发明人： Shozo Katsuki , Toshihiko Anno , Osamu Nakayama , Hiroaki Yamaguchi
IPC分类号： B05D310
CPC分类号： B32B15/08 , B32B27/34 , B32B2377/00 , C23C14/021 , C23C14/20 , H05K1/0346 , H05K3/381 , Y10T428/12569 , Y10T428/31681
摘要： A method of surface treating a polyimide film to impart improved adhesion to metal which comprises treating the surface of a polyimide film having a biphenyltetracarboxylic acid component by contact to a solution containing potassium permanganate and/or sodium permanganate and potassium hydroxide and/or sodium hydroxide and treating said surface with an acid.
摘要翻译：一种表面处理聚酰亚胺膜以赋予金属粘附性的方法，其包括通过与包含高锰酸钾和/或高锰酸钠和氢氧化钾和/或氢氧化钠的溶液接触来处理具有联苯四羧酸组分的聚酰亚胺膜的表面，以及用酸处理所述表面。

46. 发明授权

US06699351B2 Anisotropically conductive adhesive composition and anisotropically conductive adhesive film formed from it 失效
标题翻译：各向异性导电粘合剂组合物和由其形成的各向异性导电粘合剂膜
公开(公告)号：US06699351B2
公开(公告)日：2004-03-02
申请号：US10239375
申请日：2002-09-19
申请人： Hiroaki Yamaguchi , Yuji Hiroshige , Michiru Hata , Tetsu Kitamura
发明人： Hiroaki Yamaguchi , Yuji Hiroshige , Michiru Hata , Tetsu Kitamura
IPC分类号： B32B3128
CPC分类号： H01B1/24 , C08G59/226 , C08G59/24 , C09J7/10 , C09J163/00 , C09J2201/602 , C09J2463/00 , H01B1/22 , H05K3/323
摘要： To provide an anisotropically conductive adhesive composition that can be rapidly cured at a low temperature during thermocompression bonding and has a sufficiently long working life, while also exhibiting excellent mutual connection stability after connection between substrates. The anisotropically conductive adhesive composition comprises an epoxy resin comprising a cycloaliphatic epoxy resin and a glycidyl group-containing epoxy resin, an ultraviolet activatable cationic polymerization catalyst and a cationic polymerization retarder, and conductive particles.
摘要翻译：提供可以在热压接期间在低温下快速固化并具有足够长的工作寿命的各向异性导电粘合剂组合物，同时在基材连接之后也表现出优异的相互连接稳定性。各向异性导电性粘合剂组合物包含环氧树脂，其包含环脂族环氧树脂和含缩水甘油基的环氧树脂，可紫外线活化的阳离子聚合催化剂和阳离子聚合缓凝剂，以及导电颗粒。

47. 发明授权

US06613449B2 Underfill material for COF mounting and electronic components 失效
公开(公告)号：US06613449B2
公开(公告)日：2003-09-02
申请号：US10058112
申请日：2002-01-29
申请人： Hiroaki Yamaguchi , Masafumi Kohda
发明人： Hiroaki Yamaguchi , Masafumi Kohda
IPC分类号： H01L2912
CPC分类号： H01L21/563 , C08G59/4042 , H01L23/293 , H01L24/29 , H01L2224/16225 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2924/00014 , H01L2924/01029 , H01L2924/01078 , H01L2924/14 , Y10T428/12528 , Y10T428/31511 , H01L2924/00 , H01L2224/0401
摘要： A solventless non-filler underfill material for COF mounting comprising an organic material, which is used to fill the gap between an FPC having a polyimide film substrate and a copper circuit layer having a thickness of 9 &mgr;m or smaller and an IC chip mounted on the FPC, exhibits such adhesion as to destroy a silicon wafer in a polyimide film/silicon wafer adhesion test, and provides a cured film having a tensile modulus of 150 kg/mm2 or less.

48. 发明授权

US06576683B2 Aromatic polyimide foam 有权
公开(公告)号：US06576683B2
公开(公告)日：2003-06-10
申请号：US09895513
申请日：2001-06-28
申请人： Hiroaki Yamaguchi , Shigeru Yamamoto
发明人： Hiroaki Yamaguchi , Shigeru Yamamoto
IPC分类号： C08J900
CPC分类号： C08J9/24 , C08J2379/08
摘要： A flexible polyimide foam having an apparent density of 70 kg/m3 or less and a glass transition temperature of 300° C. or higher can be prepared by mixing an aromatic tetracarboxylic acid comprising 2,3,3′,4′-biphenyltetracarboxylic dianhydride a portion of which is converted into its mono- or di-lower primary alcohol ester with an aromatic polyamine containing diaminodisiloxane in an amount of 0.1 to 10 mol. %, based on the amount of total amine compounds, to give a solid of polyimide precursor; and heating the solid of polyimide precursor to a temperature of 300° C. to 500° C.

49. 发明授权

US06281323B1 Terminal-modified imide oligomers and cured products thereof 有权
标题翻译：末端改性酰亚胺低聚物及其固化产物
公开(公告)号：US06281323B1
公开(公告)日：2001-08-28
申请号：US09443885
申请日：1999-11-19
申请人： Rikio Yokota , Masatoshi Hasegawa , Hiroaki Yamaguchi
发明人： Rikio Yokota , Masatoshi Hasegawa , Hiroaki Yamaguchi
IPC分类号： C08G7310
CPC分类号： C07D209/48 , C08G73/1014 , Y10T428/31504 , Y10T428/31721
摘要： Terminal-modified imide oligomers with an inherent viscosity of 0.05-1 obtained by reacting 2,3,3′,4′-biphenyltetracarboxylic dianhydride, an aromatic diamine compound and 4-(2-phenylethynyl)phthalic anhydride, and their cured products. There are provided highly practical terminal-modified imide oligomers and their cured products, which cured products have satisfactory heat resistance and mechanical properties.
摘要翻译：通过使2,3,3'，4'-联苯四羧酸二酐，芳族二胺化合物和4-（2-苯基乙炔基）邻苯二甲酸酐反应得到的特性粘度为0.05-1的末端改性酰亚胺低聚物及其固化产物。提供了高度实用的末端改性酰亚胺低聚物及其固化产物，其固化产物具有令人满意的耐热性和机械性能。

50. 发明授权

US06188589B1 Inverter 有权
标题翻译：逆变器
公开(公告)号：US06188589B1
公开(公告)日：2001-02-13
申请号：US09489022
申请日：2000-01-21
申请人： Hideo Okayama , Taichiro Tsuchiya , Hiroaki Yamaguchi
发明人： Hideo Okayama , Taichiro Tsuchiya , Hiroaki Yamaguchi
IPC分类号： H02H7122
CPC分类号： H02M1/34 , H02M7/487 , H02M7/521 , H02M2001/346 , Y02B70/1491
摘要： An inverter having a large-capacity self-arc-extinguishing semiconductor element. Recovery capacitors recover energy stored in groups of elements for suppressing the rate of change in current, and are provided within a two-level or three-level inverter bridge. The thus-recovered energy is fed back to a d.c. voltage circuit by an energy regenerative circuit. The energy regenerative circuit controls the charging voltage of the recovery capacitors in proportion to the magnitude of a load current. In a case where the inverter includes inverter bridges connected to a single d.c. voltage circuit, the inverter bridges are divided into groups. A different energy regenerative circuit is connected to the inverter bridge on a per-group basis, and each of the energy regenerative circuits feeds power back to the d.c. voltage circuit.
摘要翻译：具有大容量自熄灭半导体元件的逆变器。恢复电容器恢复存储在元件组中的能量，用于抑制电流变化率，并且设置在二电平或三电平逆变桥内。这样回收的能量被反馈到直流电。电压电路由能量再生电路。能量再生电路根据负载电流的大小控制回收电容器的充电电压。在逆变器包括连接到单个直流电的逆变器桥的情况下。电压电路，逆变桥分为组。不同的能量再生电路以每组的形式连接到逆变桥，并且每个能量再生电路将功率馈送回直流。电压电路。

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