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41. 发明授权

US07994598B2 Electronic assembly for image sensor device 有权
标题翻译：电子组装图像传感器装置
公开(公告)号：US07994598B2
公开(公告)日：2011-08-09
申请号：US12897176
申请日：2010-10-04
申请人： Jui-Ping Weng , Tzu-Han Lin
发明人： Jui-Ping Weng , Tzu-Han Lin
IPC分类号： H01L31/0232
CPC分类号： H01L27/14627 , H01L27/1462 , H01L27/14623 , H01L27/14685 , H04N5/2252 , H04N5/2257
摘要： An electronic assembly for an image sensor device is disclosed. The electronic assembly comprises a package module and a lens set mounted thereon. The package module comprises a device substrate comprising at least one grounding plug therein, in which the grounding plug is insulated from the device substrate and an array of optoelectronic devices therein. A transparent substrate comprises a dam portion attached to the device substrate to form a cavity between the device and transparent substrates. A micro-lens array is disposed within the cavity. A conductive layer is electrically connected to the grounding plug and covers the sidewalls of the lens set and the package module and the upper surface of the lens set. A method for fabricating the electronic assembly is also disclosed.
摘要翻译：公开了一种用于图像传感器装置的电子组件。电子组件包括安装在其上的封装模块和透镜组。封装模块包括其中包括至少一个接地插头的器件衬底，其中接地插头与器件衬底绝缘，并且其中的光电器件阵列。透明基板包括附接到装置基板的坝部，以在装置和透明基板之间形成空腔。微透镜阵列设置在腔内。导电层电连接到接地插头并且覆盖透镜组和封装模块的侧壁和透镜组的上表面。还公开了一种用于制造电子组件的方法。

42. 发明授权

US07964936B2 Electronic device package with electromagnetic compatibility (EMC) coating thereon 有权
标题翻译：具有电磁兼容性（EMC）涂层的电子器件封装
公开(公告)号：US07964936B2
公开(公告)日：2011-06-21
申请号：US12170857
申请日：2008-07-10
申请人： Shin-Chang Shiung , Tzu-Han Lin , Chieh-Yuan Cheng , Li-Hsin Tseng
发明人： Shin-Chang Shiung , Tzu-Han Lin , Chieh-Yuan Cheng , Li-Hsin Tseng
IPC分类号： H01L23/552
CPC分类号： H01L27/14618 , H01L27/14625 , H01L2224/0554 , H01L2224/05548 , H01L2224/05573 , H01L2224/13 , H01L2924/00014 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： Electronic device packages with electromagnetic compatibility (EMC) coating thereon are presented. An electronic device package includes a chip scale package having a CMOS image sensor (CIS) array chip and a set of lenses configured with an aperture. An encapsulation is molded overlying the chip scale package. A shield is atop the encapsulation. A frame fixes the set of lenses to the encapsulation. An electromagnetic compatibility (EMC) coating is formed on the encapsulation to prevent electromagnetic interference.
摘要翻译：提供了具有电磁兼容性（EMC）涂层的电子器件封装。一种电子器件封装包括具有CMOS图像传感器（CIS）阵列芯片的芯片级封装以及配置有孔径的一组透镜。将封装模制在芯片级封装上。屏蔽是封装的顶部。一个框架将该组透镜固定到封装。在封装上形成电磁兼容（EMC）涂层，以防止电磁干扰。

43. 发明授权

US07928458B2 Light-emitting diode device and method for fabricating the same 有权
标题翻译：发光二极管装置及其制造方法
公开(公告)号：US07928458B2
公开(公告)日：2011-04-19
申请号：US12173565
申请日：2008-07-15
申请人： Tzu-Han Lin , Jui-Ping Weng , Shin-Chang Shiung
发明人： Tzu-Han Lin , Jui-Ping Weng , Shin-Chang Shiung
IPC分类号： H01L33/00
CPC分类号： H01L33/507 , H01L33/46 , H01L33/486 , H01L33/58 , H01L33/62 , H01L2224/48091 , H01L2924/10253 , H01L2924/00012 , H01L2924/00 , H01L2924/00014
摘要： A semiconductor device is disclosed. The semiconductor device comprises a light-emitting diode chip disposed in a cavity of a semiconductor substrate. At least two isolated outer wiring layers are disposed on the bottom surface of the semiconductor substrate and are electrically connected to the light-emitting diode chip, serving as input terminals. A lens module is adhered to the top surface of the semiconductor substrate to cap the cavity, in which the lens module comprises a molded lens and a molded fluorescent layer thereunder and the molded fluorescent layer faces the light-emitting diode chip. A method for fabricating the semiconductor devices is also disclosed.
摘要翻译：公开了一种半导体器件。半导体器件包括设置在半导体衬底的空腔中的发光二极管芯片。至少两个隔离的外部布线层设置在半导体衬底的底表面上，并且与用作输入端子的发光二极管芯片电连接。透镜模块粘附到半导体衬底的顶表面以盖住空腔，其中透镜模块包括模制透镜和其下的模制荧光层，并且模制的荧光层面向发光二极管芯片。还公开了一种用于制造半导体器件的方法。

44. 发明申请

US20110037081A1 WHITE LIGHT-EMITTING DIODE PACKAGES WITH TUNABLE COLOR TEMPERATURE 审中-公开
标题翻译：白色发光二极管封装，带有可调色温
公开(公告)号：US20110037081A1
公开(公告)日：2011-02-17
申请号：US12540145
申请日：2009-08-12
申请人： Wu-Cheng Kuo , Tzu-Han Lin
发明人： Wu-Cheng Kuo , Tzu-Han Lin
IPC分类号： H01L33/00
CPC分类号： H01L25/0753 , H01L33/504 , H01L33/54 , H01L2224/48091 , H01L2224/48247 , H01L2924/181 , H01L2924/00014 , H01L2924/00012
摘要： A white light-emitting diode package with tunable color temperature is provided, including a package substrate with a first light emitting diode (first LED) disposed over a first portion of the substrate and a second light emitting diode (second LED) disposed over a second portion different from the first portion of the substrate. A phosphor layer is coated around the first and second LED, wherein the phosphor layer is formed by blending at least one colored phosphor grain with a transparent optical resin, and the at least one colored phosphor grain in the transparent optical resin is excited by light from the first and second LED to react and emit white light. In one embodiment, the first and second LED are both blue LEDs for emitting blue light of different wavelengths or ultraviolet (UV) LEDs for emitting UV light of different wavelengths.
摘要翻译：提供了具有可调色温的白色发光二极管封装，包括具有设置在衬底的第一部分上的第一发光二极管（第一LED）的封装衬底和设置在衬底的第二部分上的第二发光二极管（第二LED）部分不同于基板的第一部分。荧光体层被涂覆在第一和第二LED周围，其中荧光体层通过将至少一个着色荧光体晶粒与透明光学树脂共混而形成，并且透明光学树脂中的至少一个着色荧光体颗粒被来自第一和第二LED反应并发出白光。在一个实施例中，第一和第二LED都是用于发射不同波长的蓝光的蓝色LED或用于发射不同波长的UV光的紫外线（UV）LED。

45. 发明申请

US20100237379A1 LIGHT EMITTING DEVICE 审中-公开
标题翻译：发光装置
公开(公告)号：US20100237379A1
公开(公告)日：2010-09-23
申请号：US12407385
申请日：2009-03-19
申请人： Wu-Cheng KUO , Jui-Ping Weng , Tzu-Han Lin
发明人： Wu-Cheng KUO , Jui-Ping Weng , Tzu-Han Lin
IPC分类号： H01L33/00
CPC分类号： H01L33/486 , H01L33/62 , H01L2924/0002 , H01L2924/00
摘要： An embodiment of the invention provides a light emitting device, which includes: a first substrate made of a semiconductor material or a ceramic material; a first hole having extending direction from a first side toward an opposite second side and from a first surface toward an opposite second surface of the first substrate; a second hole having extending direction from the first side toward the second side and from the first surface toward the second surface; a light emitting element disposed overlying the first surface and having a first electrode and a second electrode; a first conducting layer overlying a first sidewall of the first hole and electrically connected to the first electrode; and a second conducting layer overlying a second sidewall of the second hole and electrically connected to the second electrode.
摘要翻译：本发明的实施例提供了一种发光器件，其包括：由半导体材料或陶瓷材料制成的第一衬底; 第一孔，其具有从第一侧朝向相反的第二侧的延伸方向以及从第一基板的第一表面朝向相反的第二表面; 第二孔，从第一侧向第二侧延伸，从第一面向第二面延伸; 设置在所述第一表面上并具有第一电极和第二电极的发光元件; 覆盖所述第一孔的第一侧壁并电连接到所述第一电极的第一导电层; 以及覆盖所述第二孔的第二侧壁并电连接到所述第二电极的第二导电层。

46. 发明申请

US20060019480A1 Method for fabricating pad redistribution layer 有权
公开(公告)号：US20060019480A1
公开(公告)日：2006-01-26
申请号：US10896831
申请日：2004-07-22
申请人： Chia-Jen Cheng , Hui-Mei Yu , Li-Hsin Tseng , Tzu-Han Lin , Ching-Chiang Wu , Chun-Yen Lo , Li-Chuan Huang , Boe Su
发明人： Chia-Jen Cheng , Hui-Mei Yu , Li-Hsin Tseng , Tzu-Han Lin , Ching-Chiang Wu , Chun-Yen Lo , Li-Chuan Huang , Boe Su
IPC分类号： H01L21/44
CPC分类号： H01L24/12 , H01L23/3114 , H01L23/525 , H01L23/53238 , H01L24/11 , H01L2224/0231 , H01L2224/0401 , H01L2224/05147 , H01L2224/05166 , H01L2224/05171 , H01L2224/13099 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01022 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01075 , H01L2924/01076 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/04941 , H01L2924/14 , H01L2924/00014
摘要： A method for fabricating a pad redistribution layer. First, at least one bonding pad exposed by a first passivation layer is provided. A diffusion barrier layer and a seed layer are then formed over the first passivation layer and the bonding pad. A patterned mask layer is then formed over the seed layer to expose a portion thereof over the bonding pad, and a metal layer is then formed thereon. A sacrificial layer is then formed over the substrate and the sacrificial layer over the patterned mask layer is removed. The conductive film exposed by the metal layer and the remaining sacrificial layer is then removed, leaving a pad redistribution layer for the bonding pad.

47. 发明授权

US08399969B2 Chip package and fabricating method thereof 有权
标题翻译：芯片封装及其制造方法
公开(公告)号：US08399969B2
公开(公告)日：2013-03-19
申请号：US12844590
申请日：2010-07-27
申请人： Kuo-Ching Chang , Wu-Cheng Kuo , Tzu-Han Lin
发明人： Kuo-Ching Chang , Wu-Cheng Kuo , Tzu-Han Lin
IPC分类号： H01L23/495 , H01L21/00
CPC分类号： H01L24/33 , H01L23/49827 , H01L23/49838 , H01L24/29 , H01L24/32 , H01L24/48 , H01L24/73 , H01L24/83 , H01L33/62 , H01L2224/04042 , H01L2224/26175 , H01L2224/27013 , H01L2224/291 , H01L2224/29111 , H01L2224/32225 , H01L2224/32238 , H01L2224/32506 , H01L2224/335 , H01L2224/48091 , H01L2224/48227 , H01L2224/48235 , H01L2224/73265 , H01L2224/83192 , H01L2224/83805 , H01L2224/83815 , H01L2924/00014 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01079 , H01L2924/0132 , H01L2924/01322 , H01L2924/014 , H01L2924/12035 , H01L2924/12041 , H01L2924/14 , H01L2924/15747 , H01L2924/15787 , H01L2924/1579 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A chip package and a fabrication method thereof are provided. The chip package includes a substrate and a chip disposed over the substrate. A solder layer is disposed between the chip and the substrate. A conductive pad is disposed between the solder layer and the substrate, wherein the conductive pad includes a first portion disposed under the solder layer, a second portion disposed away from the first portion and a connective portion disposed between the first portion and the second portion. The connective portion has a width which is narrower than a width of the first portion along a first direction perpendicular to a second direction extending from the first portion to the connective portion.
摘要翻译：提供了芯片封装及其制造方法。芯片封装包括衬底和布置在衬底上的芯片。焊料层设置在芯片和衬底之间。导电焊盘设置在焊料层和衬底之间，其中导电焊盘包括布置在焊料层下方的第一部分，远离第一部分设置的第二部分和设置在第一部分和第二部分之间的连接部分。连接部分的宽度比沿着从第一部分延伸到连接部分的第二方向垂直的第一方向的第一部分的宽度窄。

48. 发明申请

US20100090235A1 LIGHT-EMITTING DIODE DEVICE AND METHOD FOR FABRICATING THE SAME 有权
标题翻译：发光二极管装置及其制造方法
公开(公告)号：US20100090235A1
公开(公告)日：2010-04-15
申请号：US12251957
申请日：2008-10-15
申请人： Wei-Ko WANG , Tzu-Han Lin
发明人： Wei-Ko WANG , Tzu-Han Lin
IPC分类号： H01L33/00 , H01L21/00
CPC分类号： H01L33/486 , H01L25/0753 , H01L33/507 , H01L33/58 , H01L2224/48091 , H01L2224/48227 , H01L2224/48237 , H01L2924/10253 , Y10S438/979 , H01L2924/00014 , H01L2924/00
摘要： A light-emitting diode (LED) device is disclosed. The LED device includes a semiconductor substrate with a light-emitting diode chip disposed thereon. At least two isolated outer wiring layers are disposed on the bottom surface of the semiconductor substrate and are electrically connected to the light-emitting diode chip, serving as input terminals. A lens module is adhered to the top surface of the semiconductor substrate to cap the light-emitting diode chip. In one embodiment, the lens module comprises a glass substrate having a first cavity formed at a first surface thereof, a fluorescent layer formed over a portion of a first surface exposed by the first cavity, facing the light-emitting diode chip, and a molded lens formed over a second surface of the glass carrier opposing to the first surface.
摘要翻译：公开了一种发光二极管（LED）装置。 LED装置包括其上设置有发光二极管芯片的半导体衬底。至少两个隔离的外部布线层设置在半导体衬底的底表面上，并且与用作输入端子的发光二极管芯片电连接。透镜模块粘附到半导体衬底的顶表面以盖住发光二极管芯片。在一个实施例中，透镜模块包括玻璃基板，其具有在其第一表面形成的第一空腔，形成在由第一腔暴露的第一表面的暴露于面向发光二极管芯片的部分上的荧光层，透镜形成在玻璃载体的与第一表面相对的第二表面上。

49. 发明申请

US20100006965A1 ELECTRONIC DEVICE PACKAGE WITH ELECTROMAGNETIC COMPATIBILITY (EMC) COATING THEREON 有权
标题翻译：具有电磁兼容性（EMC）涂层的电子器件封装
公开(公告)号：US20100006965A1
公开(公告)日：2010-01-14
申请号：US12170857
申请日：2008-07-10
申请人： Shin-Chang Shiung , Tzu-Han Lin , Chieh-Yuan Cheng , Li-Hsin Tseng
发明人： Shin-Chang Shiung , Tzu-Han Lin , Chieh-Yuan Cheng , Li-Hsin Tseng
IPC分类号： H01L31/0203
CPC分类号： H01L27/14618 , H01L27/14625 , H01L2224/0554 , H01L2224/05548 , H01L2224/05573 , H01L2224/13 , H01L2924/00014 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： Electronic device packages with electromagnetic compatibility (EMC) coating thereon are presented. An electronic device package includes a chip scale package having a CMOS image sensor (CIS) array chip and a set of lenses configured with an aperture. An encapsulation is molded overlying the chip scale package. A shield is atop the encapsulation. A frame fixes the set of lenses to the encapsulation. An electromagnetic compatibility (EMC) coating is formed on the encapsulation to prevent electromagnetic interference.
摘要翻译：提供了具有电磁兼容性（EMC）涂层的电子器件封装。一种电子器件封装包括具有CMOS图像传感器（CIS）阵列芯片的芯片级封装以及配置有孔径的一组透镜。将封装模制在芯片级封装上。屏蔽是封装的顶部。一个框架将该组透镜固定到封装。在封装上形成电磁兼容（EMC）涂层，以防止电磁干扰。

50. 发明授权

US08502257B2 Light-emitting diode package 有权
标题翻译：发光二极管封装
公开(公告)号：US08502257B2
公开(公告)日：2013-08-06
申请号：US12613003
申请日：2009-11-05
申请人： Kuo-Ching Chang , Wu-Cheng Kuo , Tzu-Han Lin
发明人： Kuo-Ching Chang , Wu-Cheng Kuo , Tzu-Han Lin
IPC分类号： H01L27/15 , H01L29/267 , H01L31/12 , H01L33/00 , H01L31/0203
CPC分类号： H01L33/62 , H01L24/32 , H01L24/48 , H01L24/49 , H01L24/83 , H01L24/85 , H01L33/486 , H01L2224/05554 , H01L2224/29111 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/49113 , H01L2224/73265 , H01L2224/83815 , H01L2224/85439 , H01L2224/85444 , H01L2224/92247 , H01L2924/00014 , H01L2924/01004 , H01L2924/01006 , H01L2924/01013 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01042 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01073 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/01322 , H01L2924/014 , H01L2924/12041 , H01L2924/15153 , H01L2924/157 , H01L2924/15747 , H01L2924/15787 , H01L2924/1579 , H01L2924/00 , H01L2924/00012 , H01L2924/00015 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A light-emitting diode package is provided. The light-emitting diode package comprises a substrate and a first metal layer disposed over the substrate. A solder layer is disposed on the first metal layer and a light-emitting diode chip is disposed on the solder layer, wherein the light-emitting diode chip comprises a conductive substrate and a multilayered epitaxial structure formed on the conductive substrate, and wherein the conductive substrate is adjacent to the solder layer.
摘要翻译：提供了一种发光二极管封装。发光二极管封装包括衬底和设置在衬底上的第一金属层。焊料层设置在第一金属层上，并且发光二极管芯片设置在焊料层上，其中发光二极管芯片包括形成在导电衬底上的导电衬底和多层外延结构，并且其中导电衬底与焊料层相邻。

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