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1. 发明授权

US08153458B2 Image sensing devices and methods for fabricating the same 有权
标题翻译：图像感测装置及其制造方法
公开(公告)号：US08153458B2
公开(公告)日：2012-04-10
申请号：US12407115
申请日：2009-03-19
申请人： Jui-Ping Weng , Tzu-Han Lin , Pai-Chun Peter Zung
发明人： Jui-Ping Weng , Tzu-Han Lin , Pai-Chun Peter Zung
IPC分类号： H01L21/70 , H01L31/0232 , H01L31/14
CPC分类号： H01L27/14687 , H01L27/14618 , H01L2224/05001 , H01L2224/05009 , H01L2224/05147 , H01L2224/05184 , H01L2224/05548 , H01L2224/0557 , H01L2224/10 , H01L2924/00014 , Y10S257/911 , H01L2224/05599
摘要： Image sensing devices and methods for fabricating the same are provided. An exemplary image sensing device comprises a first substrate having a first side and a second side opposing each other. A plurality of image sensing elements is formed in the first substrate at the first side. A conductive via is formed through the first substrate, having a first surface exposed by the first substrate at the first side and a second surface exposed by the first substrate at the second side. A conductive pad overlies the conductive via at the first side and is electrically connecting the image sensing elements. A conductive layer overlies the conductive via at the second side and electrically connects with the conductive pad. A conductive bump is formed over a portion of the conductive layer. A second substrate is bonded with the first substrate at the first side.
摘要翻译：提供了图像感测装置及其制造方法。示例性图像感测装置包括具有彼此相对的第一侧和第二侧的第一基板。在第一侧的第一基板中形成多个图像感测元件。通过第一基板形成导电通孔，其具有在第一侧被第一基板暴露的第一表面和在第二侧被第一基板暴露的第二表面。导电焊盘在第一侧覆盖导电通孔并且电连接图像感测元件。导电层位于第二侧的导电通孔上，并与导电焊盘电连接。在导电层的一部分上形成导电凸块。第二衬底在第一侧与第一衬底结合。

2. 发明授权

US07829966B2 Electronic assembly for image sensor device 有权
标题翻译：电子组装图像传感器装置
公开(公告)号：US07829966B2
公开(公告)日：2010-11-09
申请号：US11944558
申请日：2007-11-23
申请人： Jui-Ping Weng , Tzu-Han Lin
发明人： Jui-Ping Weng , Tzu-Han Lin
IPC分类号： H01L31/0232
CPC分类号： H01L27/14627 , H01L27/1462 , H01L27/14623 , H01L27/14685 , H04N5/2252 , H04N5/2257
摘要： An electronic assembly for an image sensor device is disclosed. The electronic assembly comprises a package module and a lens set mounted thereon. The package module comprises a device substrate comprising at least one grounding plug therein, in which the grounding plug is insulated from the device substrate and an array of optoelectronic devices therein. A transparent substrate comprises a dam portion attached to the device substrate to form a cavity between the device and transparent substrates. A micro-lens array is disposed within the cavity. A conductive layer is electrically connected to the grounding plug and covers the sidewalls of the lens set and the package module and the upper surface of the lens set. A method for fabricating the electronic assembly is also disclosed.
摘要翻译：公开了一种用于图像传感器装置的电子组件。电子组件包括安装在其上的封装模块和透镜组。封装模块包括其中包括至少一个接地插头的器件衬底，其中接地插头与器件衬底绝缘，并且其中的光电器件阵列。透明基板包括附接到装置基板的坝部，以在装置和透明基板之间形成空腔。微透镜阵列设置在腔内。导电层电连接到接地插头并且覆盖透镜组和封装模块的侧壁和透镜组的上表面。还公开了一种用于制造电子组件的方法。

3. 发明申请

US20100012957A1 LIGHT-EMITTING DIODE DEVICE AND METHOD FOR FABRICATING THE SAME 有权
标题翻译：发光二极管装置及其制造方法
公开(公告)号：US20100012957A1
公开(公告)日：2010-01-21
申请号：US12173565
申请日：2008-07-15
申请人： Tzu-Han LIN , Jui-Ping Weng , Shin-Chang Shiung
发明人： Tzu-Han LIN , Jui-Ping Weng , Shin-Chang Shiung
IPC分类号： H01L33/00
CPC分类号： H01L33/507 , H01L33/46 , H01L33/486 , H01L33/58 , H01L33/62 , H01L2224/48091 , H01L2924/10253 , H01L2924/00012 , H01L2924/00 , H01L2924/00014
摘要： A semiconductor device is disclosed. The semiconductor device comprises a light-emitting diode chip disposed in a cavity of a semiconductor substrate. At least two isolated outer wiring layers are disposed on the bottom surface of the semiconductor substrate and are electrically connected to the light-emitting diode chip, serving as input terminals. A lens module is adhered to the top surface of the semiconductor substrate to cap the cavity, in which the lens module comprises a molded lens and a molded fluorescent layer thereunder and the molded fluorescent layer faces the light-emitting diode chip. A method for fabricating the semiconductor devices is also disclosed.
摘要翻译：公开了一种半导体器件。半导体器件包括设置在半导体衬底的空腔中的发光二极管芯片。至少两个隔离的外部布线层设置在半导体衬底的底表面上，并且与用作输入端子的发光二极管芯片电连接。透镜模块粘附到半导体衬底的顶表面以盖住空腔，其中透镜模块包括模制透镜和其下的模制荧光层，并且模制的荧光层面向发光二极管芯片。还公开了一种用于制造半导体器件的方法。

4. 发明授权

US07595220B2 Image sensor package and fabrication method thereof 有权
标题翻译：图像传感器封装及其制造方法
公开(公告)号：US07595220B2
公开(公告)日：2009-09-29
申请号：US11822011
申请日：2007-06-29
申请人： Jui-Ping Weng , Jang-Cheng Hsieh , Tzu-Han Lin , Pai-Chun Peter Zung
发明人： Jui-Ping Weng , Jang-Cheng Hsieh , Tzu-Han Lin , Pai-Chun Peter Zung
IPC分类号： H01L21/00 , H01L23/02
CPC分类号： H01L27/14618 , H01L27/14683 , H01L2224/10
摘要： The invention provides an image sensor package and method for fabricating the same. The image sensor package comprises a first substrate comprising a sensor device thereon and a hole therein. A bonding pad comprising a first opening is formed on an upper surface of the first substrate. A second substrate comprising a spacer element with a second opening therein is disposed on the first substrate. A conductive plug is formed in the hole and passes through the first and second openings to the second substrate to electrically contact with the bonding pad. A conductive layer is formed on a lower surface of the first substrate and electrically connects to the conductive plug. A solder ball is formed on the conductive layer and electrically connects to the bonding pad by the conductive plug. The image sensor package further comprises a second substrate bonding to the first substrate. The image sensor package is relatively less thick, thus, the dimensions thereof are relatively reduced.
摘要翻译：本发明提供一种图像传感器封装及其制造方法。图像传感器封装包括其上包括传感器装置的第一基板和其中的孔。包括第一开口的焊盘形成在第一基板的上表面上。包括其中具有第二开口的间隔元件的第二基板设置在第一基板上。导电插塞形成在孔中，并通过第一和第二开口到第二基板，以与接合焊盘电接触。导电层形成在第一基板的下表面上并电连接到导电插塞。在导电层上形成焊球，并通过导电插塞与焊盘电连接。图像传感器封装还包括与第一基板结合的第二基板。图像传感器封装相对较薄，因此其尺寸相对减小。

5. 发明申请

US20090134483A1 ELECTRONIC ASSEMBLY FOR IMAGE SENSOR DEVICE 有权
标题翻译：用于图像传感器装置的电子组件
公开(公告)号：US20090134483A1
公开(公告)日：2009-05-28
申请号：US11944558
申请日：2007-11-23
申请人： Jui-Ping Weng , Tzu-Han Lin
发明人： Jui-Ping Weng , Tzu-Han Lin
IPC分类号： H01L31/0232
CPC分类号： H01L27/14627 , H01L27/1462 , H01L27/14623 , H01L27/14685 , H04N5/2252 , H04N5/2257
摘要： An electronic assembly for an image sensor device is disclosed. The electronic assembly comprises a package module and a lens set mounted thereon. The package module comprises a device substrate comprising at least one grounding plug therein, in which the grounding plug is insulated from the device substrate and an array of optoelectronic devices therein. A transparent substrate comprises a dam portion attached to the device substrate to form a cavity between the device and transparent substrates. A micro-lens array is disposed within the cavity. A conductive layer is electrically connected to the grounding plug and covers the sidewalls of the lens set and the package module and the upper surface of the lens set. A method for fabricating the electronic assembly is also disclosed.
摘要翻译：公开了一种用于图像传感器装置的电子组件。电子组件包括安装在其上的封装模块和透镜组。封装模块包括其中包括至少一个接地插头的器件衬底，其中接地插头与器件衬底绝缘，并且其中的光电器件阵列。透明基板包括附接到装置基板的坝部，以在装置和透明基板之间形成空腔。微透镜阵列设置在腔内。导电层电连接到接地插头并且覆盖透镜组和封装模块的侧壁和透镜组的上表面。还公开了一种用于制造电子组件的方法。

6. 发明申请

US20090032893A1 Image sensor package and fabrication method thereof 有权
标题翻译：图像传感器封装及其制造方法
公开(公告)号：US20090032893A1
公开(公告)日：2009-02-05
申请号：US11882441
申请日：2007-08-01
申请人： Jui-Ping Weng , Jang-Cheng Hsieh , Tzu-Han Lin , Pai-Chung Peter Zung
发明人： Jui-Ping Weng , Jang-Cheng Hsieh , Tzu-Han Lin , Pai-Chung Peter Zung
IPC分类号： H01L31/0203 , H01L31/0232 , H01L31/18
CPC分类号： H01L27/14683 , H01L21/304 , H01L21/76898 , H01L24/06 , H01L24/11 , H01L24/17 , H01L24/81 , H01L25/50 , H01L27/14618 , H01L27/14621 , H01L27/14625 , H01L27/14627 , H01L27/14636 , H01L27/1464 , H01L27/14685 , H01L27/14687 , H01L27/1469 , H01L2224/10
摘要： An image sensor package and method for fabricating the same is provided. The image sensor package includes a first substrate comprising a via hole therein, a driving circuit and a first conductive pad thereon. A second substrate comprising a photosensitive device and a second conductive pad thereon is bonded to the first substrate, so that the driving circuit, formed on the first substrate, can electrically connect to and further control the photosensitive device, formed on the second substrate. A solder ball is formed on a backside of the first substrate and electrically connects to the via hole for transmitting a signal from the driving circuit. Because the photosensitive device and the driving circuit are fabricated individually on the different substrates, fabrication and design thereof is more flexible. Moreover, the image sensor package is relatively less thick, thus, the dimensions thereof are reduced.
摘要翻译：提供了一种图像传感器封装及其制造方法。图像传感器封装包括其中包括通孔的第一基板，驱动电路和其上的第一导电焊盘。包括其上的光敏器件和第二导电焊盘的第二衬底被结合到第一衬底，使得形成在第一衬底上的驱动电路可以电连接到并进一步控制形成在第二衬底上的光敏器件。在第一基板的背面上形成焊球，并且电连接到用于传输来自驱动电路的信号的通孔。由于感光装置和驱动电路分别制造在不同的基板上，所以其制造和设计更灵活。此外，图像传感器封装相对较薄，因此其尺寸减小。

7. 发明申请

US20050286110A1 MEMS optical switch with self-assembly structure 失效
标题翻译：具有自组装结构的MEMS光开关
公开(公告)号：US20050286110A1
公开(公告)日：2005-12-29
申请号：US10929074
申请日：2004-08-27
申请人： Shih-Yi Wen , Hsiao-Wen Lee , Jui-Ping Weng , Wu-Cheng Kuo , Chen-Yu Weng , Yu-Han Chieh
发明人： Shih-Yi Wen , Hsiao-Wen Lee , Jui-Ping Weng , Wu-Cheng Kuo , Chen-Yu Weng , Yu-Han Chieh
IPC分类号： G02B6/26 , G02B6/35 , G02B26/00 , G02B26/08
CPC分类号： G02B6/3572 , G02B6/3516 , G02B6/3518 , G02B6/3566 , G02B6/3576 , G02B6/3584 , G02B26/085
摘要： A self-assembly structure of micro electromechanical optical switch utilizes residual stresses of three curved beams. The first curved beam pushes the base plate away from the substrate. The second curved beam lifts up the mirror slightly. Then, the third curved beam rotates the mirror vertical to the base plate and achieves self-assembly. In another embodiment, magnetic force and magnetic-activated elements are used.
摘要翻译：微机电光开关的自组装结构利用三个弯曲梁的残余应力。第一弯曲梁将基板推离基板。第二弯曲梁稍微升起镜子。然后，第三弯曲梁将镜子垂直于基板旋转并实现自组装。在另一个实施例中，使用磁力和磁激元件。

8. 发明授权

US06950224B1 Electrostatic movable micro mirror chip 失效
标题翻译：静电可移动微镜芯片
公开(公告)号：US06950224B1
公开(公告)日：2005-09-27
申请号：US10922265
申请日：2004-08-18
申请人： Bing-Ru Chen , Wu-Cheng Kuo , Ming-Hung Chen , Jui-Ping Weng , Yeh-I Su , Hsiao-Wen Lee
发明人： Bing-Ru Chen , Wu-Cheng Kuo , Ming-Hung Chen , Jui-Ping Weng , Yeh-I Su , Hsiao-Wen Lee
IPC分类号： B81B3/00 , G02B26/00 , G02B26/08
CPC分类号： G02B26/0841
摘要： An electrostatic movable micro mirror chip includes an upper mirror plate and a lower electrode plate positioned and jointed together via pairs of fitting solder and positioning grooves. It improves the optical quality of the mirror chip by a lower joining temperature. The fitting and jointing achieves easy positioning and interconnection. The fabrication time and cost is less. The mirror in the mirror chip is plated with metallic coating on both sides so as to balance the stress and improve its flatness.
摘要翻译：静电可移动微镜芯片包括上镜面板和下电极板，通过一对装配焊料和定位槽定位和接合在一起。它通过较低的接合温度提高了镜片的光学质量。装配和接合实现了容易的定位和互连。制造时间和成本较低。镜片中的镜子在两面镀金属涂层，以平衡应力并提高其平整度。

9. 发明授权

US09231012B2 Image sensor package 有权
标题翻译：图像传感器封装
公开(公告)号：US09231012B2
公开(公告)日：2016-01-05
申请号：US11882441
申请日：2007-08-01
申请人： Jui-Ping Weng , Jang-Cheng Hsieh , Tzu-Han Lin , Pai-Chun Peter Zung
发明人： Jui-Ping Weng , Jang-Cheng Hsieh , Tzu-Han Lin , Pai-Chun Peter Zung
IPC分类号： H01L31/0203 , H01L31/0232 , H01L31/062 , H01L27/146
CPC分类号： H01L27/14683 , H01L21/304 , H01L21/76898 , H01L24/06 , H01L24/11 , H01L24/17 , H01L24/81 , H01L25/50 , H01L27/14618 , H01L27/14621 , H01L27/14625 , H01L27/14627 , H01L27/14636 , H01L27/1464 , H01L27/14685 , H01L27/14687 , H01L27/1469 , H01L2224/10
摘要： An image sensor package and method for fabricating the same is provided. The image sensor package includes a first substrate comprising a via therein, a driving circuit and a first conductive pad thereon. A second substrate comprising a photosensitive device and a second conductive pad thereon is bonded to the first substrate, so that the driving circuit, formed on the first substrate, can electrically connect to and further control the photosensitive device, formed on the second substrate. A solder ball is formed on a backside of the first substrate and electrically connects to the via for transmitting a signal from the driving circuit. Because the photosensitive device and the driving circuit are fabricated individually on the different substrates, fabrication and design thereof is more flexible. Moreover, the image sensor package is relatively less thick, thus, the dimensions thereof are reduced.
摘要翻译：提供了一种图像传感器封装及其制造方法。图像传感器封装包括其中包括通孔的第一基板，驱动电路和其上的第一导电焊盘。包括其上的光敏器件和第二导电焊盘的第二衬底被结合到第一衬底，使得形成在第一衬底上的驱动电路可以电连接到并进一步控制形成在第二衬底上的光敏器件。在第一基板的背面上形成焊球，并电连接到用于传输来自驱动电路的信号的通路。由于感光装置和驱动电路分别制造在不同的基板上，所以其制造和设计更灵活。此外，图像传感器封装相对较薄，因此其尺寸减小。

10. 发明授权

US07898070B2 Image sensor package and fabrication method thereof 有权
标题翻译：图像传感器封装及其制造方法
公开(公告)号：US07898070B2
公开(公告)日：2011-03-01
申请号：US12543804
申请日：2009-08-19
申请人： Jui-Ping Weng , Jang-Cheng Hsieh , Tzu-Han Lin , Pai-Chun Peter Zung
发明人： Jui-Ping Weng , Jang-Cheng Hsieh , Tzu-Han Lin , Pai-Chun Peter Zung
IPC分类号： H01L23/02 , H01L21/00
CPC分类号： H01L27/14618 , H01L27/14683 , H01L2224/10
摘要： The invention provides an image sensor package and method for fabricating the same. The image sensor package comprises a first substrate comprising a sensor device thereon and a hole therein. A bonding pad comprising a first opening is formed on an upper surface of the first substrate. A second substrate comprising a spacer element with a second opening therein is disposed on the first substrate. A conductive plug is formed in the hole and passes through the first and second openings to the second substrate to electrically contact with the bonding pad. A conductive layer is formed on a lower surface of the first substrate and electrically connects to the conductive plug. A solder ball is formed on the conductive layer and electrically connects to the bonding pad by the conductive plug. The image sensor package further comprises a second substrate bonding to the first substrate. The image sensor package is relatively less thick, thus, the dimensions thereof are relatively reduced.
摘要翻译：本发明提供一种图像传感器封装及其制造方法。图像传感器封装包括其上包括传感器装置的第一基板和其中的孔。包括第一开口的焊盘形成在第一基板的上表面上。包括其中具有第二开口的间隔元件的第二基板设置在第一基板上。导电插塞形成在孔中，并通过第一和第二开口到第二基板，以与接合焊盘电接触。导电层形成在第一基板的下表面上并电连接到导电插塞。在导电层上形成焊球，并通过导电插塞与焊盘电连接。图像传感器封装还包括与第一基板结合的第二基板。图像传感器封装相对较薄，因此其尺寸相对减小。

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