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41. 发明授权

US09893428B2 Direct transition from a waveguide to a buried chip 有权
公开(公告)号：US09893428B2
公开(公告)日：2018-02-13
申请号：US15606756
申请日：2017-05-26
申请人： SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
发明人： Danny Elad , Noam Kaminski , Ofer Markish
IPC分类号： H01Q13/00 , H01P3/12 , H01P3/16 , H01P5/08 , H01P5/107 , H01Q1/50 , H01Q15/14 , H01Q19/10 , H01Q19/30 , H01Q13/02
CPC分类号： H01Q13/00 , H01P3/12 , H01P3/16 , H01P5/08 , H01P5/107 , H01Q1/50 , H01Q13/02 , H01Q13/0283 , H01Q15/141 , H01Q19/10 , H01Q19/30
摘要： An assembly for confining electromagnetic radiation in a waveguide. The assembly comprises a waveguide, comprising walls surrounding a cavity and an aperture in the walls that opens to the cavity, and a substrate assembly disposed in the aperture. The substrate assembly comprises a substrate comprising an antenna, wherein the antenna is located within the cavity and is configured for transmission of radiation within the cavity. The substrate assembly comprises an integrated circuit (IC) electrically connected to the substrate, where the IC comprises semi-conductor components and a ground plane on one side of the IC. The ground plane is located between the IC semi-conductor components and the antenna. The ground plane is located across the aperture to reduce the area of the aperture and to reflect some of the radiation directed to the aperture back into the cavity.

42. 发明授权

US09893406B2 Method of forming a waveguide interface by providing a mold to form a support block of the interface 有权
公开(公告)号：US09893406B2
公开(公告)日：2018-02-13
申请号：US14803652
申请日：2015-07-20
申请人： Vubiq Incorporated
发明人： Michael Gregory Pettus
IPC分类号： H01P5/107 , H01P1/04
CPC分类号： H01P5/107 , H01P1/042
摘要： A waveguide interface comprising a support block configured to support a printed circuit board assembly. An interface is coupled to an end portion of the support block and extends from the support block. The interface includes a slot positioned to receive at least a portion of the printed circuit board assembly and one or more holes positioned to receive attachment devices to secure the interface to a waveguide component. The support block and interface are molded as a monolithic device. A method of forming the waveguide interface, a waveguide assembly including the waveguide interface, and a method of making the waveguide assembly including the waveguide interface are also disclosed.

43. 发明授权

US09893405B2 Input/output coupling structure of dielectric waveguide 有权
公开(公告)号：US09893405B2
公开(公告)日：2018-02-13
申请号：US15211185
申请日：2016-07-15
申请人： TOKO, INC.
发明人： Yukikazu Yatabe
IPC分类号： H01P5/107 , H01P5/08 , H01P3/16 , H05K1/02 , H05K1/11 , H01P3/12
CPC分类号： H01P5/087 , H01P3/122 , H01P3/16 , H01P5/107 , H05K1/0242 , H05K1/115
摘要： Dielectric waveguide comprising dielectric body having an exterior coated with an electrically conductive film. Region in one side surface couples to another dielectric waveguide, and slot in bottom surface exposes the dielectric body in an L-shape in two adjacent side surfaces, except for the one side surface. Front surface of printed circuit board has a ground pattern opposed to the slot, which includes opening with outer shape greater than slot, and a back surface having a ground pattern surrounding a strip line disposed to cross through the slot. A distal end of the strip line and the front surface-side ground pattern are coupled together by a via hole. The opening is surrounded by a via hole group which couples the front and the back surface-side ground patterns together. The dielectric waveguide is disposed to allow the opening and the slot to be opposed to each other.

44. 发明授权

US09812755B2 Mode converter between a plane circuit and a substrate waveguide including a pin having a land and an anti-pad 有权
公开(公告)号：US09812755B2
公开(公告)日：2017-11-07
申请号：US14749839
申请日：2015-06-25
申请人： FUJIKURA LTD.
发明人： Yusuke Uemichi
IPC分类号： H01P5/107 , H01P5/103 , H01P3/12 , H01P3/00
CPC分类号： H01P5/107 , H01L2224/16227 , H01L2224/48091 , H01L2224/48227 , H01L2924/15153 , H01L2924/15311 , H01P3/003 , H01P3/121 , H01P5/103
摘要： A mode converter includes a substrate including a first main surface and a second main surface, a first ground conductor layer formed on the first main surface, a second ground conductor layer formed on the second main surface, a plane circuit that is formed on the first main surface and propagates a high frequency, a pin that is connected to the plane circuit, is formed inside a through-hole which penetrate from the first main surface to the second main surface, and communicates with the first main face and the second main surface, and an anti-pad that is formed between an end portion of the pin exposed in the second main surface and the second ground conductor layer.

45. 发明授权

US09793590B2 Coaxial wiring device and transmission/reception integrated splitter 有权
公开(公告)号：US09793590B2
公开(公告)日：2017-10-17
申请号：US15027506
申请日：2014-10-03
申请人： NEC Corporation
发明人： Takahiro Miyamoto , Norihisa Shiroyama , Kiyotake Sasaki , Sumio Ueda
IPC分类号： H01P3/06 , H01P3/08 , H01P1/209 , H01P5/103 , H01P1/213 , H01P11/00 , H01P1/203 , H01P5/107
CPC分类号： H01P3/08 , H01P1/203 , H01P1/209 , H01P1/213 , H01P1/2135 , H01P3/085 , H01P3/087 , H01P5/103 , H01P5/107 , H01P11/00
摘要： The first member and the second member include, when a line that connects a first port and a second port is denoted by a reference line, a first groove that has a central point on the reference line and extends in a direction that intersects with the reference line; a second groove that connects one end of the first groove and the first port; a third groove that connects the other end of the first groove and the first port and has a shape that is line symmetrical to the second groove with respect to the reference line; a fourth groove that connects the other end (FN2) of the first groove and the second port; and a fifth groove that connects one end (FN1) of the first groove and the second port and has a shape that is line symmetrical to the fourth groove with respect to the reference line.

46. 发明授权

US09705169B2 Waveguide device, communication module, method of producing waveguide device, and electronic device 有权
公开(公告)号：US09705169B2
公开(公告)日：2017-07-11
申请号：US14974513
申请日：2015-12-18
申请人： Sony Corporation
发明人： Sho Ohashi , Kenji Komori , Takahiro Takeda
IPC分类号： H01P5/107 , H01P1/04 , H01P5/00 , H01P11/00 , H01P5/02
CPC分类号： H01P1/047 , H01P5/00 , H01P5/02 , H01P5/107 , H01P11/001 , Y10T29/49016
摘要： An electronic device includes a central control unit and a waveguide device. The waveguide device includes a high-frequency signal waveguide for transmitting a high-frequency signal emitted from a communication module having a communication function, and an attachment/detachment unit capable of attaching/detaching the communication module so that coupling between the high-frequency signal waveguide and the high-frequency signal is possible. The communication module includes a communication device and a transfer structure configured to cause the high-frequency signal emitted from the communication device to be transferred to the high-frequency signal waveguide of the waveguide device.

47. 发明授权

US09666931B2 Radio frequency electric power conversion mechanism 有权
公开(公告)号：US09666931B2
公开(公告)日：2017-05-30
申请号：US14833313
申请日：2015-08-24
申请人： NIDEC ELESYS CORPORATION
发明人： Jun Suzuki
IPC分类号： H01P3/12 , H01P5/107 , H01P5/08
CPC分类号： H01P5/107 , H01P3/121
摘要： A radio frequency electric power conversion mechanism of the present invention includes a circuit board including a fiber reinforced resin board, instead of an expensive ceramic circuit board. The radio frequency electric power conversion mechanism has a combined configuration of a plurality of fiber reinforced resin boards laminated to each other with a conductive foil therebetween, a via hole array made of an electric conductor passing through the boards, a transmission line closely adhered to the surface of a board, and a waveguide having a notch in a part of the waveguide on the aperture side. The radio frequency electric power conversion mechanism further has other structural features.

48. 发明申请

US20170141450A1 MICROSTRIP CIRCUIT AND APPARATUS FOR CHIP-TO-CHIP INTERFACE COMPRISING THE SAME 审中-公开
公开(公告)号：US20170141450A1
公开(公告)日：2017-05-18
申请号：US15342551
申请日：2016-11-03
申请人： Korea Advanced Institute of Science and Technology
发明人： Hyeon Min BAE , Ha II SONG , HuXian JIN , Joon Yeong LEE , Hyo Sup WON , Tae Hoon YOON
IPC分类号： H01P5/107 , H01P3/16 , H01P5/08 , H01P3/08
CPC分类号： H01P5/087 , H01P3/081 , H01P3/122 , H01P3/16 , H01P5/107
摘要： The present invention relates to a microstrip circuit and a chip-to-chip interface apparatus comprising the same. According to one aspect of the invention, there is provided a microstrip circuit. The microstrip circuit includes a feeding line providing a signal, a probe being connected to one end of the feeding line, and a patch emitting the signal to a waveguide. The patch is disposed in a layer opposite to a layer in which the feeding line and the probe are disposed, with a core substrate being positioned therebetween. At least one of length of the probe, thickness of the core substrate, and permittivity of the core substrate is determined based on bandwidth of a transition between the microstrip circuit and the waveguide.

49. 发明授权

US09538658B2 Compact low loss transition with an integrated coupler 有权
标题翻译：具有集成耦合器的紧凑型低损耗转换
公开(公告)号：US09538658B2
公开(公告)日：2017-01-03
申请号：US13944764
申请日：2013-07-17
申请人： ZTE (USA) Inc.
发明人： Ying Shen , Peng Gao
IPC分类号： H05K1/18 , H05K1/02 , H01P5/107
CPC分类号： H05K1/18 , H01P5/107 , H05K1/0239 , H05K1/025 , H05K2201/09618 , H05K2201/0969 , H05K2201/10098
摘要： A compact transition structure includes a printed circuit board, wherein there is a rectangular region on one side of the printed circuit board and the rectangular region has a pair of long edges and a pair of short edges; a transition probe on the one side of the printed circuit board, wherein the transition probe extends into the rectangular region through a long edge of the rectangular region and has a terminal near a center of the rectangular region; and a coupler probe on the one side the printed circuit board, wherein the coupler probe extends into the rectangular region through a short edge of the rectangular region and has a terminal before the center of the rectangular region such that the coupler probe is electrically insulated from the transition probe.
摘要翻译：紧凑的过渡结构包括印刷电路板，其中在印刷电路板的一侧上具有矩形区域，并且矩形区域具有一对长边缘和一对短边缘; 在所述印刷电路板的一侧上的过渡探针，其中所述过渡探针通过所述矩形区域的长边延伸到所述矩形区域中，并且在所述矩形区域的中心附近具有端子; 以及在印刷电路板的一侧上的耦合器探针，其中耦合器探针通过矩形区域的短边缘延伸到矩形区域中，并且在矩形区域的中心之前具有端子，使得耦合器探针与过渡探针。

50. 发明授权

US09520635B2 RF system-in-package with microstrip-to-waveguide transition 有权
标题翻译：带微带至波导转换的RF系统封装
公开(公告)号：US09520635B2
公开(公告)日：2016-12-13
申请号：US13870457
申请日：2013-04-25
申请人： Mohammad Fakharzadeh , Mihai Tazlauanu
发明人： Mohammad Fakharzadeh , Mihai Tazlauanu
IPC分类号： H01P5/08 , H01P11/00 , H01P5/107 , H01Q21/00 , H01Q13/02
CPC分类号： H01P5/08 , H01P5/107 , H01P11/00 , H01P11/001 , H01Q13/02 , H01Q21/0075 , Y10T29/49016
摘要： An apparatus includes an IC package comprising a substrate having a first metal layer, a second metal layer, and a dielectric layer disposed between the first and second metal layers. The IC package further comprises an IC die disposed at a surface of the substrate and comprising RF circuitry. The first metal layer comprises a microstrip feedline extending from a pin of the IC die. The microstrip feedline includes a conductive trace having a probe element at a tip distal from the pin. The first metal layer further comprises a waveguide opening comprising a region surrounding the probe element, the region being substantially devoid of conductive material. The substrate further comprises a plurality of metal vias disposed at the perimeter of the region, the metal vias extending from the first metal layer to the second metal layer.
摘要翻译：一种装置包括IC封装，其包括具有第一金属层，第二金属层和设置在第一和第二金属层之间的介电层的基板。 IC封装还包括设置在衬底的表面上并包括RF电路的IC管芯。第一金属层包括从IC芯片的引脚延伸的微带馈线。微带馈线包括导电迹线，该导电迹线在远离销的尖端处具有探针元件。第一金属层还包括波导开口，其包括围绕探针元件的区域，该区域基本上不含导电材料。衬底还包括设置在该区域的周边的多个金属通孔，金属通孔从第一金属层延伸到第二金属层。

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