专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US10079422B2 Dual-circular polarized antenna system 有权
公开(公告)号：US10079422B2
公开(公告)日：2018-09-18
申请号：US14868627
申请日：2015-09-29
申请人： VIASAT, INC.
发明人： Donald L Runyon , Dominic Q Nguyen , James W Maxwell
IPC分类号： H01Q13/02 , H01P5/12 , H01Q1/02 , H01P11/00 , H01P1/00 , H01Q21/00 , H01Q1/28
CPC分类号： H01Q1/02 , H01P1/00 , H01P5/12 , H01P11/001 , H01Q1/28 , H01Q13/02 , H01Q21/0037 , H01Q21/0075 , Y10T29/49002 , Y10T29/49016
摘要： In an example embodiment, an azimuth combiner comprises: a septum layer comprising a plurality of septum dividers; first and second housing layers attached to first and second sides of the septum layer; a linear array of ports on a first end of the combiner; wherein the first and second housing layers each comprise waveguide H-plane T-junctions; wherein the waveguide T-junctions can be configured to perform power dividing/combining; and wherein the septum layer evenly bisects each port of the linear array of ports. A stack of such azimuth combiners can form a two dimensional planar array of ports to which can be added a horn aperture layer, and a grid layer, to form a dual-polarized, dual-BFN, dual-band antenna array.

2. 发明授权

US09985332B2 Waveguide comprising solid dielectrics surrounded by an outer conductor and having outwardly bulging long sides 有权
公开(公告)号：US09985332B2
公开(公告)日：2018-05-29
申请号：US15110862
申请日：2015-02-02
申请人： MOLEX INCORPORATED
发明人： Takeshi Tsukahara , Shigeyuki Hoshikawa , Mikiji Tanaka , Mio Tanaka
IPC分类号： H01P3/12 , H01P11/00 , G02B6/10 , H01P3/06
CPC分类号： H01P3/122 , G02B6/10 , H01P3/06 , H01P11/001 , H01P11/005
摘要： The waveguide is composed of a solid dielectric, and an outer conductor covering the periphery of the dielectric, the transverse section of the dielectric being rectangular and having a shape bulging outward on the pair of long sides, and the inner surface of the outer conductor adhering closely to the outer surface of the dielectric.

3. 发明授权

US09969001B2 Three-dimensional passive components 有权
公开(公告)号：US09969001B2
公开(公告)日：2018-05-15
申请号：US14964451
申请日：2015-12-09
申请人： Washington State University
发明人： Rahul P. Panat , Deuk H. Heo
IPC分类号： B22F3/105 , G06F1/16 , H01F27/24 , H01F27/28 , H01F41/02 , H01F41/04 , H01G4/12 , H01P11/00 , H05K1/02 , H05K1/03 , H05K1/09 , H05K3/14 , H05K3/22 , H05K3/46 , H01G4/002 , B22F3/00 , B33Y10/00 , B33Y50/02 , H05K1/16 , B33Y80/00 , B22F1/00
CPC分类号： B22F3/1055 , B22F1/0018 , B22F3/008 , B22F2003/1058 , B33Y10/00 , B33Y50/02 , B33Y80/00 , C22C2202/02 , G06F1/163 , H01F17/0006 , H01F17/0033 , H01F27/24 , H01F27/2804 , H01F41/0206 , H01F41/046 , H01G4/002 , H01G4/1218 , H01P11/001 , H05K1/028 , H05K1/0283 , H05K1/0296 , H05K1/0313 , H05K1/0393 , H05K1/09 , H05K1/165 , H05K3/14 , H05K3/22 , H05K3/4644 , H05K2201/0162
摘要： Three-dimensional inductors may comprise a passivation layer disposed on a substrate, a three-dimensional pillar comprising a ferromagnetic material disposed on the substrate or the passivation layer, and a conductive trace wound at least partially around the pillar. Three-dimensional capacitors may comprise a passivation layer disposed on a substrate, at least two support pillars comprising a polymeric material disposed on the passivation layer or the substrate, at least two electrodes disposed between the support pillars, a dielectric disposed between the electrodes, and a metal trace. Methods of manufacturing the three-dimensional passives, such as inductors and capacitors, may comprise direct writing the components and curing them for on-chip applications.

4. 发明申请

US20180123217A1 STRUCTURES AND METHODS FOR INTERCONNECTS AND ASSOCIATED ALIGNMENT AND ASSEMBLY MECHANISMS FOR AND BETWEEN CHIPS, COMPONENTS, AND 3D SYSTEMS 审中-公开
公开(公告)号：US20180123217A1
公开(公告)日：2018-05-03
申请号：US15861283
申请日：2018-01-03
申请人： Nuvotronics, INC
发明人： Jean-Marc Rollin , J. Robert Reid , David Sherrer , Will Stacy , Ken Vanhille , J. Marcus Oliver , Tim Smith
IPC分类号： H01P11/00 , H01P5/107 , H05K1/00 , H01P1/04 , H01P5/02 , H01P3/06
CPC分类号： H01P5/02 , H01P1/045 , H01P3/00 , H01P3/06 , H01P3/18 , H01P5/107 , H01P11/001 , H05K1/00
摘要： Structures and methods for interconnects and associated alignment and assembly mechanisms for and between chips, components, and 3D systems.

5. 发明授权

US09947986B1 Reactive power combiners and dividers including nested coaxial conductors 有权
公开(公告)号：US09947986B1
公开(公告)日：2018-04-17
申请号：US15582533
申请日：2017-04-28
申请人： David B. Aster
发明人： David B. Aster
IPC分类号： H01P5/12 , H01P5/19 , H01P3/06 , H01P11/00
CPC分类号： H01P5/19 , H01P3/06 , H01P5/12 , H01P11/00 , H01P11/001
摘要： A power divider/combiner includes a main conductor defining an axis and having an outer surface; an input connector, at a front end, having a center conductor, electrically coupled to the main conductor and having an axis aligned with the main conductor axis; a first hollow cylindrical conductor having an open end facing rearwardly, having an inner cylindrical surface, the main conductor being received in and spaced apart from the inner cylindrical surface, the first hollow cylindrical conductor being electrically coupled to the second conductor of the input connector; a second hollow cylindrical conductor having an open end facing forwardly, the first cylindrical conductor being received in and spaced apart from the inner cylindrical surface of the second cylindrical conductor; a third hollow cylindrical conductor having an open back end facing rearwardly, the second cylindrical conductor being received in and spaced apart from the inner cylindrical surface of the third cylindrical conductor; and a plurality of output connectors having respective axes that are perpendicular to the main conductor axis, the output connectors being angularly spaced apart relative to each other, the output connectors having center conductors electrically coupled to the third cylindrical conductor. Methods are also provided.

6. 发明授权

US09825353B2 Antenna device and method of setting resonant frequency of antenna device 有权
公开(公告)号：US09825353B2
公开(公告)日：2017-11-21
申请号：US14921185
申请日：2015-10-23
申请人： Murata Manufacturing Co., Ltd.
发明人： Noboru Kato , Katsumi Taniguchi , Jun Sasaki , Naoki Gochi
IPC分类号： H01Q1/24 , H01Q1/38 , H01Q7/00 , G06K19/077 , H01Q7/04 , H04B5/00 , H01P11/00 , H01Q1/22 , H01Q1/36 , H01Q7/06 , H01Q1/48 , H01Q1/52 , H01Q19/06 , H01Q19/02
CPC分类号： H01Q1/2216 , G06K19/07779 , H01P11/00 , H01P11/001 , H01Q1/22 , H01Q1/2225 , H01Q1/2291 , H01Q1/243 , H01Q1/36 , H01Q1/38 , H01Q1/48 , H01Q1/52 , H01Q7/00 , H01Q7/04 , H01Q7/06 , H01Q19/02 , H01Q19/062 , H04B5/0081 , Y10T29/49016
摘要： In antenna device, a coil conductor of an antenna coil module and a conductor layer at least partially overlap. A current flows in the conductor layer to block a magnetic field generated by a current flowing in the coil conductor. A current flows along the periphery of a slit and around the periphery of the conductor layer due to a cut-edge effect. Since magnetic flux does not pass through the conductor layer, magnetic flux attempts to bypass the conductor layer along a path in which the conductor opening of the conductor layer is on the inside and the outer edge of the conductor layer is on the outside. As a result, the magnetic flux generates large loops that link the inside and the outside of a coil conductor of an antenna on a reader/writer side to couple an antenna device and the antenna on the reader/writer side.

7. 发明授权

US09780429B2 3D-microstrip branchline coupler 有权
公开(公告)号：US09780429B2
公开(公告)日：2017-10-03
申请号：US14885393
申请日：2015-10-16
申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION
发明人： Barbara S. DeWitt , Essam Mina , B M Farid Rahman , Guoan Wang
IPC分类号： H01P5/12 , H01P3/08 , H01P11/00
CPC分类号： H01L23/481 , G06F17/5077 , H01P3/003 , H01P3/026 , H01P3/081 , H01P11/001 , H01P11/007 , H01Q1/2283 , H01Q13/106
摘要： The disclosure is directed to semiconductor structures and, more particularly, to a three dimensional microstrip branchline coupler and methods of manufacture. The structure includes a plurality of through silicon vias and conductive lines electrically connected to a first end and a second end of respective ones of the plurality of through silicon vias. A first through silicon via of the plurality of through silicon vias forms a first port of a three dimensional (3D) branchline coupler. A second through silicon via of the plurality of through silicon vias forms a second port of the 3D branchline coupler. A third through silicon via of the plurality of through silicon vias forms a third port of the 3D branchline coupler. A fourth through silicon via of the plurality of through silicon vias forms a fourth port of the 3D branchline coupler.

8. 发明授权

US09755288B2 Methods and devices for integrating radio frequency and other signals within a conductor 有权
公开(公告)号：US09755288B2
公开(公告)日：2017-09-05
申请号：US14499909
申请日：2014-09-29
申请人： Radio Frequency Systems, Inc.
发明人： Teppo M. Lukkarila
IPC分类号： H01P1/205 , H01P1/207 , H01P11/00 , H01P7/04 , H01P1/208 , H01P5/02 , H01P1/20
CPC分类号： H01P1/2053 , H01P1/2007 , H01P1/207 , H01P1/208 , H01P5/02 , H01P7/04 , H01P11/001
摘要： Non-coaxial conductors, such as direct current power conductors, may be inserted into, or separated from, a central section of a radio frequency (RF) coaxial conductor that is supplying RF signals.

9. 发明申请

US20170214556A1 EMBEDDED WIRE FEED FORWARD EQUALIZATION 有权
公开(公告)号：US20170214556A1
公开(公告)日：2017-07-27
申请号：US15004851
申请日：2016-01-22
申请人： International Business Machines Corporation
发明人： Thomas W. LIANG , Matthew S. DOYLE , John R. DANGLER , Manuel OROZCO , Layne A. BERGE
IPC分类号： H04L25/03
CPC分类号： H04L25/03076 , H01P3/003 , H01P11/001 , H04L25/03885 , H04L2025/03433
摘要： Embodiments of the present disclosure provide methods and apparatus for providing feed forward equalization to a communication line by providing a resistance and a capacitance to the communication line. The method includes determining the resistance based on a desired value of feed forward equalization to provide to a communication line, determining the capacitance based on the desired value of feed forward equalization to provide to the communication line, providing a layer of resistive material between a first conductor and a second conductor of the communication line, wherein a dimension of the layer of resistive material is determined based on the determined resistance and providing a layer of dielectric material between the first conductor and the second conductor, wherein a dimension of the layer of dielectric material is determined based on the determined capacitance.

10. 发明申请

US20170207510A1 PRINTED CIRCUIT BOARD STRUCTURE HAVING ELECTROMAGNETIC-TUNNEL EMBEDDED ARCHITECTURE AND METHOD FOR MANUFACTURING THE SAME 审中-公开
公开(公告)号：US20170207510A1
公开(公告)日：2017-07-20
申请号：US15043288
申请日：2016-02-12
申请人： Korea Advanced Institute of Science and Technology
发明人： Hyo Hoon Park , Hyeon Min Bae , Tae Woo Lee
IPC分类号： H01P5/107 , H01P5/08 , H05K1/02 , H01P11/00 , H01P3/16 , H01P5/02
CPC分类号： H01P3/165 , H01P1/042 , H01P3/122 , H01P5/02 , H01P5/087 , H01P5/107 , H01P11/001 , H01P11/006 , H05K1/0243
摘要： Disclosed is a printed-circuit board (PCB) structure having an electromagnetic-tunnel-embedded architecture, the PCB structure including a PCB, and an EM-tunnel-embedded in the PCB, wherein the EM-tunnel includes a dielectric core and a metal clad which surrounds the dielectric core and has at least one port exposed to a surface of the PCB.

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式