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51. 发明申请

US20130314841A1 Laminated Ceramic Capacitor 有权
标题翻译：层压陶瓷电容器
公开(公告)号：US20130314841A1
公开(公告)日：2013-11-28
申请号：US13957546
申请日：2013-08-02
申请人： MURATA MANUFACTURING CO., LTD.
发明人： Toshimi Oguni
IPC分类号： H01G4/018
CPC分类号： H01G4/30 , B32B18/00 , C04B35/4682 , C04B37/001 , C04B37/003 , C04B2235/3206 , C04B2235/3215 , C04B2235/3224 , C04B2235/3239 , C04B2235/3262 , C04B2235/3418 , C04B2235/5445 , C04B2235/6582 , C04B2235/6584 , C04B2235/6588 , C04B2237/346 , C04B2237/582 , C04B2237/704 , H01G4/008 , H01G4/012 , H01G4/018 , H01G4/1218 , H01G4/1227 , H01G4/1245 , H01G4/224
摘要： A laminated ceramic capacitor that includes dielectric layers stacked adjacent one another to form a laminated body; internal electrodes arranged between the dielectric layers; external electrodes along surfaces of the laminated body and connected to the internal electrodes; and a covering layer covering at least portions of sections of the laminated body between the laminated body and edges of the external electrodes. The external electrodes include a silver-containing layer containing at least Ag as its main constituent. The dielectric layers and the covering layer 30 contain, as their main constituent, a perovskite compound represented by a chemical formula ABO3, wherein A is at least one of Ba, Sr, and Ca, and B is at least one of Ti, Zr, and Hf. V is added to only the dielectric layers among the dielectric layers and the covering layer.
摘要翻译：一种层叠陶瓷电容器，其包括彼此相邻堆叠以形成层叠体的电介质层; 布置在电介质层之间的内部电极; 外部电极沿着层叠体的表面并连接到内部电极; 以及覆盖层，其覆盖层叠体与外部电极的边缘之间的层叠体的至少一部分。外部电极包括至少含有Ag作为其主要成分的含银层。电介质层和覆盖层30含有由化学式ABO3表示的钙钛矿化合物作为其主要成分，其中A为Ba，Sr和Ca中的至少一种，B为Ti，Zr，和Hf。 V仅添加到电介质层和覆盖层中的介电层。

52. 发明申请

US20130044404A1 Titanium-Based High-K Dielectric Films 有权
标题翻译：钛基高K介电薄膜
公开(公告)号：US20130044404A1
公开(公告)日：2013-02-21
申请号：US13657782
申请日：2012-10-22
申请人： Intermolecular, Inc.
发明人： Hanhong Chen , Nobumichi Fuchigami , Imran Hashim , Edward L. Haywood , Pragati KUMAR , Sandra G. Malhotra , Monica Sawkar Mathur , Prashant B. Phatak , Sunil Shanker
IPC分类号： H01G4/30 , H01G4/018
CPC分类号： H01G4/1218 , C23C16/405 , C23C16/45531 , C23C16/56 , H01G4/33 , H01L21/02186 , H01L21/022 , H01L21/0228 , H01L21/02312 , H01L21/02337 , H01L21/3141 , H01L21/3142 , H01L28/40
摘要： This disclosure provides (a) methods of making an oxide layer (e.g., a dielectric layer) based on titanium oxide, to suppress the formation of anatase-phase titanium oxide and (b) related devices and structures. A metal-insulator-metal (“MIM”) stack is formed using an ozone pretreatment process of a bottom electrode (or other substrate) followed by an ALD process to form a TiO2 dielectric, rooted in the use of an amide-containing precursor. Following the ALD process, an oxidizing anneal process is applied in a manner is hot enough to heal defects in the TiO2 dielectric and reduce interface states between TiO2 and electrode; the anneal temperature is selected so as to not be so hot as to disrupt BEL surface roughness. Further process variants may include doping the titanium oxide, pedestal heating during the ALD process to 275-300 degrees Celsius, use of platinum or ruthenium for the BEL, and plural reagent pulses of ozone for each ALD process cycle. The process provides high deposition rates, and the resulting MIM structure has substantially no x-ray diffraction peaks associated with anatase-phase titanium oxide.
摘要翻译：本公开内容提供（a）制造基于氧化钛的氧化物层（例如电介质层）的方法，以抑制锐钛矿相氧化钛的形成和（b）相关的器件和结构。使用底部电极（或其他基底）的臭氧预处理随后进行ALD工艺形成金属 - 绝缘体 - 金属（MIM）堆叠，以形成使用含酰胺前体的TiO 2电介质。在ALD工艺之后，氧化退火工艺的应用热度足以愈合TiO2电介质中的缺陷，并降低TiO2和电极之间的界面态; 选择退火温度以使其不那么热，以致破坏BEL表面粗糙度。进一步的工艺变型可以包括在ALD工艺期间掺杂氧化钛，基座加热至275-300摄氏度，对于BEL使用铂或钌，对于每个ALD工艺循环使用多个试剂脉冲的臭氧。该方法提供高沉积速率，并且所得MIM结构基本上没有与锐钛矿相氧化钛相关的x射线衍射峰。

53. 发明授权

US08248750B2 Electroactive polymer transducers 有权
标题翻译：电活性聚合物换能器
公开(公告)号：US08248750B2
公开(公告)日：2012-08-21
申请号：US12234023
申请日：2008-09-19
申请人： Silmon James Biggs , Edward F. Johnson , Gordon Russell , Luther Lawford White, III
发明人： Silmon James Biggs , Edward F. Johnson , Gordon Russell , Luther Lawford White, III
IPC分类号： H01G4/018
CPC分类号： H01L41/0986 , H01L41/0533 , H01L41/45 , Y10T29/49007
摘要： Dielectric elastomer or electroactive polymer film transducers configured to minimize high electrical field gradients that can lead to partial discharge and corona.
摘要翻译：电介质弹性体或电活性聚合物膜换能器被配置为最小化可导致局部放电和电晕的高电场梯度。

54. 发明申请

US20110010905A1 Capacitor forming method 有权
公开(公告)号：US20110010905A1
公开(公告)日：2011-01-20
申请号：US12458549
申请日：2009-07-15
申请人： Richard J. Sturzebecher
发明人： Richard J. Sturzebecher
IPC分类号： H01G4/018
CPC分类号： H01G4/129 , H01G7/06 , H01G13/00 , Y10T29/417 , Y10T29/43 , Y10T29/435 , Y10T29/49108 , Y10T29/49115
摘要： The capacitor forming method utilizes a plurality of metal sheet manipulating rollers and a glass supply, which, in combination, make a metal-glass laminate and glass or devitrifying glass dielectric to form a capacitor. Several embodiments of the method manufacture ferroelectric crystal dielectrics by utilizing heat-treatment and annealing to form and devitrify glass while the glass is in a metal-glass spool or flat form.

55. 发明申请

US20100020467A1 MLCC module 有权
标题翻译： MLCC模块
公开(公告)号：US20100020467A1
公开(公告)日：2010-01-28
申请号：US12230189
申请日：2008-08-26
申请人： Jung Rag Yoon , Kyung Min Lee , Bong Wha Moon , Sang Won Lee , Min Kee Kim
发明人： Jung Rag Yoon , Kyung Min Lee , Bong Wha Moon , Sang Won Lee , Min Kee Kim
IPC分类号： H01G4/008 , H01G4/018
CPC分类号： H01G4/232 , H01G4/224 , H01G4/2325 , Y02T10/7022
摘要： Provided is a MLCC module used as a direct current (DC) link capacitor that is included in an inverter of a hybrid vehicle. The MLCC module includes: a plurality of first ceramic sheets 10, each including a plurality of first internal electrode portions 20; a plurality of second ceramic sheets 30, each being disposed between the plurality of first ceramic sheets 10 respectively to include a plurality of second internal electrode portions 40; a plurality of external electrode portions 50 being connected to the plurality of first internal electrode portions 20, respectively; a plurality of clamp lead electrode portions 60 being connected to the plurality of external electrode portions 50 to input and output electrical signals, respectively; and an epoxy molding compound (EMC) molding member sealing the plurality of first ceramic sheets 10, the plurality of second ceramic sheets 30, and the plurality of external electrode portions 50 to expose one ends of the plurality of clamp lead electrode portions 50, respectively.
摘要翻译：提供了一种用作混合动力车辆的逆变器中的直流（DC）链路电容器的MLCC模块。 MLCC模块包括：多个第一陶瓷片10，每个第一陶瓷片10包括多个第一内部电极部分20; 多个第二陶瓷片30分别设置在多个第一陶瓷片10之间，以包括多个第二内部电极部分40; 多个外部电极部分50分别连接到多个第一内部电极部分20; 多个夹持引线电极部分60分别连接到多个外部电极部分50以输入和输出电信号; 和密封多个第一陶瓷片10，多个第二陶瓷片30和多个外部电极部分50的环氧树脂模塑料（EMC）模塑件，以分别暴露多个夹持引线电极部分50的一端。

56. 发明授权

US06137671A Embedded energy storage device 失效
标题翻译：嵌入式储能装置
公开(公告)号：US06137671A
公开(公告)日：2000-10-24
申请号：US015735
申请日：1998-01-29
申请人： Donald T. Staffiere
发明人： Donald T. Staffiere
IPC分类号： H01L27/08 , H01M2/10 , H01M6/40 , H05K1/00 , H05K1/16 , H01G4/005 , H01G4/018
CPC分类号： H01L27/0805 , H01M2/1066 , H05K1/162 , H01M6/40 , H05K1/0298 , H05K1/16 , H05K2201/0175 , H05K2201/0179 , H05K2201/09309 , H05K2201/09318 , H05K2201/09509 , H05K2201/10037
摘要： The present invention is directed towards an embedded electrical storage device in a layered electrical device, such as a printed circuit board or integrated circuit chip. An electrical energy storage device, having an outer surface, is embedded in the layered electrical device, either partially or fully is formed of at least two electrical conducting layers sandwiching a high capacity dielectric, and is connected to other circuitry on the layered electrical device. This arrangement may be used in numerous applications including use as storage and filter capacitors for power conditioning.
摘要翻译：本发明涉及分层电气装置中的嵌入式电气存储装置，例如印刷电路板或集成电路芯片。具有外表面的电能存储装置被部分地或全部地嵌入到层状电气装置中，该至少两个导电层夹着大容量电介质，并且连接到分层电气装置上的其它电路。这种布置可以用于许多应用中，包括用作用于功率调节的存储和滤波电容器。

57. 发明授权

US5469324A Integrated decoupling capacitive core for a printed circuit board and method of making same 失效
标题翻译：用于印刷电路板的集成去耦电容芯及其制造方法
公开(公告)号：US5469324A
公开(公告)日：1995-11-21
申请号：US319651
申请日：1994-10-07
申请人： Watson R. Henderson , Floyd G. Paurus , Stanley R. Szerlip
发明人： Watson R. Henderson , Floyd G. Paurus , Stanley R. Szerlip
IPC分类号： H05K1/03 , H05K1/16 , H05K3/46 , H01G4/018
CPC分类号： H05K1/162 , H05K1/03 , H05K2201/0187 , H05K2201/0355 , H05K2201/09309 , H05K3/4611 , Y10T29/435
摘要： A printed circuit board includes a planar first outer layer, a planar second outer layer, and a planar capacitive power distribution core disposed between the first and second outer layers. The capacitive core is formed from first and second electrically conductive layers with a dielectric layer disposed therebetween. The dielectric layer is made from a high dielectric constant material such as a ceramic in the form of a perforated sheet. The perforations permit the electrically conductive layers to be bound to the dielectric layer without significantly increasing the separation between the conductive layers. Each perforation allows a column of adhesive to collect therein to bond the power distribution core together. The resulting capacitance is typically sufficient to eliminate the need for decoupling capacitors.
摘要翻译：印刷电路板包括平面第一外层，平面第二外层和设置在第一和第二外层之间的平面电容配电芯。电容芯由第一和第二导电层形成，其间设置介电层。电介质层由高介电常数材料制成，例如陶瓷形式的多孔板。穿孔允许导电层与介电层结合，而不显着增加导电层之间的间隔。每个穿孔允许一列粘合剂收集在其中以将配电芯片结合在一起。所得到的电容通常足以消除对去耦电容器的需要。

58. 发明授权

US10910155B2 Electronic component 有权
公开(公告)号：US10910155B2
公开(公告)日：2021-02-02
申请号：US16202058
申请日：2018-11-27
申请人： SAMSUNG ELECTRO-MECHANICS CO., LTD.
发明人： Won Chul Sim , Ho Yoon Kim , Sang Soo Park , Woo Chul Shin
IPC分类号： H01G2/06 , H01G4/232 , H01G4/018 , H01G4/30 , H05K3/30 , H05K1/18 , H01G4/012
摘要： An electronic component includes a multilayer capacitor comprising a capacitor body, and an external electrode disposed on an end of the capacitor body, and an interposer comprising an interposer body, and an external terminal disposed on an end of the interposer body. The external terminal includes a connection portion disposed on a first surface of the interposer body and connected to the external electrode, a mounting portion disposed on a second surface of the interposer body opposing the first surface, and a side connection portion disposed on the first and second surfaces and a side surface of the interposer to connect the connection portion and the mounting portion. The side connection portion includes a cutting portion.

59. 发明申请

US20210013318A1 ELECTRODE FORMATION 有权
公开(公告)号：US20210013318A1
公开(公告)日：2021-01-14
申请号：US16509204
申请日：2019-07-11
申请人： Micron Technology, Inc.
发明人： An-Jen B. Cheng , Brenda D. Kraus , Sanket S. Kelkar , Matthew N. Rocklein , Christopher W. Petz , Richard Beeler , Dojun Kim
IPC分类号： H01L29/51 , H01G4/018 , H01L21/02 , H01L21/28
摘要： Apparatuses, methods, and systems related to electrode formation are described. A first portion of a top electrode is formed over a dielectric material of a storage node. A metal oxide is formed over the first portion of the electrode. A second portion of the electrode is formed over the metal oxide.

60. 发明授权

US10685784B2 Back-end-of-the line capacitor 有权
公开(公告)号：US10685784B2
公开(公告)日：2020-06-16
申请号：US16667347
申请日：2019-10-29
申请人： International Business Machines Corporation
发明人： Chih-Chao Yang
IPC分类号： H01G4/33 , H01G4/30 , H01L23/522 , H01G4/018 , H01G4/008 , H01G4/005 , H01G4/224
摘要： A back-end-of-the-line (BEOL) metal-insulator-metal (MIM) capacitor is provided that includes three electrode plates in which the first electrode plate of the MIM capacitor is an electrically conductive interconnect structure embedded in a first interconnect dielectric material layer. The other two electrode plates are located in a second interconnect dielectric material layer that is located above the first interconnect dielectric material layer. A first contact structure is present in the second interconnect dielectric material layer and contacts a surface of the first interconnect dielectric material layer, wherein the first contact structure passes through the second electrode plate. A second contact structure is also present in the second interconnect dielectric material layer and contacts a surface of the first electrode plate, wherein the second contact structure passes through the third electrode plate. Capacitor dielectric materials are located between each of the electrode plates.

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