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    • 58. 发明授权
    • Solid electrolytic capacitor
    • 固体电解电容器
    • US5410445A
    • 1995-04-25
    • US235808
    • 1994-04-29
    • Yasuo Kanetake
    • Yasuo Kanetake
    • H01G4/252H01G9/00H01G9/004H01G9/012H01G9/08
    • H01G9/012H01G9/08
    • A solid electrolytic capacitor is provided which comprises a capacitor element including a chip and an anode wire projecting from the chip, an anode lead electrically connected to the anode wire, a cathode lead electrically connected to the chip, and a resin package enclosing the capacitor element together with part of the anode and cathode leads. The resin package has a first end face from which the cathode lead projects out, and a second end face located adjacent to the anode lead. Each of the anode and cathode leads is bent outside the package toward the underside thereof. The resin package includes a larger width portion adjacent to the first end face and a smaller width portion adjacent to the second end face. The anode lead extends transversely of the anode wire and projects laterally from the smaller width portion.
    • 提供一种固体电解电容器,其包括电容器元件,该电容器元件包括芯片和从该芯片突出的阳极引线,阳极引线与阳极引线电连接,阴极引线与芯片电连接,以及封装电容元件 以及阳极和阴极引线的一部分。 树脂封装具有第一端面,阴极引线从该第一端面突出,以及位于阳极引线附近的第二端面。 阳极和阴极引线中的每一个朝向其下侧弯曲。 树脂封装包括与第一端面相邻的较大宽度部分和与第二端面相邻的较小宽度部分。 阳极引线横向于阳极引线延伸并从较小宽度部分横向突出。
    • 59. 发明授权
    • Chip-type solid electrolytic capacitor
    • 片式固体电解电容器
    • US5349496A
    • 1994-09-20
    • US25874
    • 1993-03-03
    • Hiromichi TaniguchiYoshihiko Saiki
    • Hiromichi TaniguchiYoshihiko Saiki
    • H01G9/012H01G9/00H01G9/004H01G9/04
    • H01G9/012
    • The invention relates to a chip-type solid elelctrolytic capacitor which uses a capacitor element having an anode lead protruding from one end face of an anode body of a valve metal. The capacitor element is covered by an insulating resin cover layer except a cathode end face and the protruding part of the anode lead. A cathode terminal is formed on the cathode end face and the resin cover layer in an area near the cathode end face, and an anode terminal is formed on the resin cover layer so as to make contact with the protruding anode lead. The anode terminal is made up of a conductive layer which is formed on the resin cover layer only in a limited area so as not to make contact with the anode lead and has a microscopically rough surface, a plating layer which is formed on the conductive layer and the resin cover layer in the area over the aforementioned end face of the anode body and covers the protruding anode lead and a solder layer formed on the plating layer. In the anode terminal the rough surface of the conductive layer enhances the adhesion of the overlaid plating layer, and the separation of the conductive layer from the anode lead eliminates the problem about different thermal expansion coefficients of the conductive layer and the anode lead. Therefore, when the chip-type capacitor is mounted on a printed circuit board the bonding strength is enhanced.
    • 本发明涉及一种芯片式固体电解电容器,其使用具有从阀金属的阳极体的一个端面突出的阳极引线的电容器元件。 除了阴极端面和阳极引线的突出部分之外,电容器元件被绝缘树脂覆盖层覆盖。 阴极端子形成在阴极端面附近的阴极端面和树脂覆盖层上,阳极端子形成在树脂覆盖层上,以与突出的阳极引线接触。 阳极端子由仅在有限的区域形成在树脂覆盖层上的导体层构成,以便不与阳极引线接触并且具有微观粗糙的表面,形成在导电层上的镀层 以及在阳极体的上述端面上方的区域中的树脂覆盖层,并且覆盖突出的阳极引线和形成在镀层上的焊料层。 在阳极端子中,导电层的粗糙表面增强了覆盖的镀层的粘附性,并且导电层与阳极引线的分离消除了导电层和阳极引线的不同热膨胀系数的问题。 因此,当将片式电容器安装在印刷电路板上时,结合强度提高。