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51. 发明申请

US20200222941A1 METHODS FOR MANUFACTURING ULTRASOUND TRANSDUCERS AND OTHER COMPONENTS 审中-公开
公开(公告)号：US20200222941A1
公开(公告)日：2020-07-16
申请号：US16827097
申请日：2020-03-23
申请人： FUJIFILM SONOSITE, INC.
发明人： N. Christopher Chaggares , Eric Rieder
IPC分类号： B06B1/06 , H01L41/047 , H01L41/293 , B06B1/02 , H05K1/02 , H05K3/06 , H05K3/32 , H05K1/18 , H05K3/02 , H05K3/30
摘要： The disclosed technology features methods for the manufacture of electrical components such as ultrasound transducers. In particular, the disclosed technology provides methods of creating an ultrasonic transducer by connecting one or more multi-layer printed circuits to an array of ultrasound transducer elements. In one embodiment, the printed circuits have traces in a single layer that are spaced by a distance that is greater than a pitch of the transducer elements to which the multi-layer printed circuit is to be connected. However the traces from all the layers in the multi-layer printed circuit are interleaved to have a pitch that is equal to the pitch of the transducer elements. The disclosed technology also features ultrasound transducers produced by the methods described herein.

52. 发明申请

US20200221580A1 LIQUID METAL FUSION WITH CONDUCTIVE INKS AND PASTES 审中-公开
公开(公告)号：US20200221580A1
公开(公告)日：2020-07-09
申请号：US16647083
申请日：2018-09-13
申请人： CARNEGIE MELLON UNIVERSITY , UNIVERSIDADE DE COIMBRA
发明人： Mahmoud TAVAKOLI , Hugo PAISANA , Anibal T. DE ALMEIDA , Carmel MAJIDI
IPC分类号： H05K3/24 , H05K1/09 , H05K1/03 , H05K3/02 , B41M3/00 , C09D11/52 , C09D11/322 , C09D11/037
摘要： Coating inkjet-printed traces of silver nanoparticles (AgNP) ink with a thin layer of eutectic gallium indium (EGaIn) increases the electrical conductivity and significantly improves tolerance to tensile strain. This enhancement is achieved through a room temperature “sintering” process in which the liquid-phase EGaIn alloy binds the AgNP particles to form a continuous conductive trace. These mechanically robust thin-film circuits are well suited for transfer to highly curved and non-developable 3D surfaces as well as skin and other soft deformable substrates.

53. 发明授权

US10701804B2 Copper nanoparticle application processes for low temperature printable, flexible/conformal electronics and antennas 有权
公开(公告)号：US10701804B2
公开(公告)日：2020-06-30
申请号：US14728970
申请日：2015-06-02
申请人： Kuprion Inc.
发明人： Alfred A. Zinn
IPC分类号： H05K1/09 , C09D11/322 , C09D11/52 , H05K3/12 , H05K1/02 , H05K3/14 , H05K3/02 , H05K3/40 , H01L27/12 , H01L21/48
摘要： An ink adapted for forming conductive elements is disclosed. The ink includes a plurality of nanoparticles and a carrier. The nanoparticles comprise copper and have a diameter of less than 20 nanometers. Each nanoparticle has at least a partial coating of a surfactant configured to separate adjacent nanoparticles. Methods of creating circuit elements from copper-containing nanoparticles by spraying, tracing, stamping, burnishing, or heating are disclosed.

54. 发明授权

US10687427B2 Wired circuit board including a conductive pattern having a wire and a dummy portion 有权
公开(公告)号：US10687427B2
公开(公告)日：2020-06-16
申请号：US15478711
申请日：2017-04-04
申请人： NITTO DENKO CORPORATION
发明人： Yuu Sugimoto , Hiroyuki Tanabe , Yoshito Fujimura
IPC分类号： H05K3/02 , G11B5/60 , H05K1/02 , H05K3/46 , H05K3/10
摘要： A method for producing a wired circuit board including an insulating layer and a conductive pattern, including (1), providing the insulating layer having an inclination face; (2), providing a metal thin film at least on the surface of the insulating layer; (3), providing a photoresist on the surface of the metal thin film; (4), disposing a photomask so that a first portion, where the conductive pattern is provided in the photoresist, is shielded from light, and the photoresist is exposed to light through the photomask; (5), removing the first portion to expose the metal thin film corresponding to the first portion; and (6), providing the conductive pattern on the surface of the metal thin film exposed from the photoresist. The inclination face has a second portion that allows the light reflected at the metal thin film to reach the first portion.

55. 发明申请

US20200177181A1 FPC INTEGRATED CAPACITANCE SWITCH AND METHOD OF MANUFACTURING THE SAME 审中-公开
公开(公告)号：US20200177181A1
公开(公告)日：2020-06-04
申请号：US16780927
申请日：2020-02-04
申请人： Nissha Co., Ltd.
发明人： Takeshi NISHIMURA , Kenta UEDA , Shinya KAWAMURA
IPC分类号： H03K17/96 , H05K1/02 , H05K1/16 , H05K1/09 , H05K3/02 , H05K3/06 , H05K3/00
摘要： Object:To provide an FPC integrated capacitance switch and a method of manufacturing the same, which allow an FPC portion to have high electrical reliability when used in a bent manner and to have wiring lines to be densely arranged.Solution:The FPC integrated capacitance switch includes a transparent flexible substrate (1) including a sensor unit (11) and a tail portion (12), a plurality of electrodes (2) formed on a first main surface (1a) of the transparent flexible substrate (1) and in the sensor unit (11), a plurality of first electrode wiring lines (21), a plurality of second electrode wiring lines (22) arranged and formed in parallel in the tail portion (12) and made of a photoresist including conductive particles, an electromagnetic shield (3) formed on a second main surface (1b) of the transparent flexible substrate (1) overlapping in plan view a region including the plurality of electrodes (2), a pair of first electromagnetic shield wiring lines (31), a pair of second electromagnetic shield wiring lines (32) formed in the tail portion (12) to be arranged in plan view outward of a region including the plurality of second electrode wiring lines (22), the second electromagnetic shield wiring lines (32) being made of a photoresist including conductive particles, and an electromagnetic shield mask (33) formed on the second main surface (1b) of the transparent flexible substrate (1) overlapping in plan view the region including the plurality of second electrode wiring lines (22), the electromagnetic shield mask (33) including a light-shielding metal film.

56. 发明申请

US20200172786A1 HIGH THERMAL CONDUCTIVITY PREPREG AND USES OF THE SAME 审中-公开
公开(公告)号：US20200172786A1
公开(公告)日：2020-06-04
申请号：US16359825
申请日：2019-03-20
申请人： TAIWAN UNION TECHNOLOGY CORPORATION
发明人： Chih-Wei LIAO , Chen-Hua YU
IPC分类号： C09K5/14 , C08J5/24 , C08J5/08 , H05K1/02 , H05K3/02 , H05K1/03 , B32B5/02 , B32B15/092 , B32B15/20
摘要： A high thermal conductivity prepreg is provided. The high thermal conductivity prepreg includes a high thermal conductivity reinforcing material and a dielectric material layer formed on the surface of the high thermal conductivity reinforcing material, wherein the high thermal conductivity reinforcing material is prepared by a process which includes the following steps: (a) providing a precursor aqueous solution, the precursor aqueous solution includes a precursor selected from the group of organic salts, inorganic salts, and combinations thereof; (b) subjecting the precursor aqueous solution to a hydrolysis reaction to form an intermediate product aqueous solution; (c) subjecting the intermediate product aqueous solution to a condensation polymerization reaction to form a pretreatment solution; (d) impregnating a reinforcing material with the pretreatment solution; and (e) oven-drying the impregnated reinforcing material to obtain the high thermal conductivity reinforcing material.

57. 发明申请

US20200165501A1 FLUOROCARBON RESIN COMPOSITION AND PREPREG AND COPPER FOIL SUBSTRATE USING THE SAME 审中-公开
公开(公告)号：US20200165501A1
公开(公告)日：2020-05-28
申请号：US16202173
申请日：2018-11-28
申请人： NAN YA PLASTICS CORPORATION
发明人： Te-Chao LIAO , Hao-Sheng CHEN , Chih-Kai CHANG , Hung-Yi CHANG
IPC分类号： C09K5/14 , C08L27/18 , C08J5/24 , H05K1/03 , H05K1/02 , H05K3/02 , B32B15/082 , B32B15/20
摘要： A fluorocarbon resin composition is applicable to produce high-frequency circuit boards including a polytetrafluoroethylene resin; a fluorine-containing copolymer such as poly fluoroalkoxy and fluorinated ethylene propylene; low molecular-weight PTFE micro-powders and inorganic powders; in particular the temperature of pressing copper foil substrates is lowered from 350° C. to 250° C. via a lowering temperature rate of 1 to 4° C./min to improve the crystallinity of the fluorocarbon resin composition as well as improve the copper foil substrate with a high thermal conductivity and a wide range of dielectric constant.

58. 发明授权

US10660213B2 Adhesive-attached copper foil, copper-clad laminate, and wiring substrate 有权
公开(公告)号：US10660213B2
公开(公告)日：2020-05-19
申请号：US16584733
申请日：2019-09-26
申请人： KYOCERA Corporation
发明人： Kazumichi Uchida
IPC分类号： H05K3/02 , H05K3/38
摘要： There are provided a wiring substrate having a low dielectric constant and a low dielectric loss tangent, and an adhesive-attached copper foil and a copper-clad laminate that are suitable for manufacture of the wiring substrate and have improved adhesiveness to a copper foil. An adhesive-attached copper foil includes: a copper foil on one surface; and an adhesive layer provided on one surface of the copper foil, in which this copper foil has a roughened surface that is surface-treated by methacrylic silane, acrylic silane, or isocyanurate silane, and the adhesive layer is formed on the roughened surface and is made of a resin composition containing, as a main component thereof, modified polyphenylene ether resulting from modification of a hydroxyl group present at the end of the main chain with an ethylenically unsaturated compound.

59. 发明申请

US20200150426A1 INCONSPICUOUS NEAR-EYE ELECTRICAL CIRCUITS 审中-公开
公开(公告)号：US20200150426A1
公开(公告)日：2020-05-14
申请号：US16224554
申请日：2018-12-18
申请人： Facebook Technologies, LLC
发明人： Karol Constantine Hatzilias , Robin Sharma , Christopher Yuan Ting Liao , Andrew Ouderkirk
IPC分类号： G02B27/00 , H05K1/02 , H05K1/09 , H05K3/02 , H05K1/18 , H05K3/12 , G02B27/01 , H05K1/11
摘要： A near-eye optic includes a substrate having a clear aperture for propagating light. An inconspicuous electrical circuit is supported by the substrate in the clear aperture of the substrate. The inconspicuous electrical circuit includes a plurality of inconspicuous conductive traces disposed in an inconspicuous pattern and electrically coupled to a plurality of inconspicuous electrical components. The inconspicuous pattern may include e.g. an asymmetric pattern, an aperiodic pattern, a pseudo-random pattern, a meandering pattern, a periodic pattern modulated with pseudo-random perturbations, or a non-rectangular pattern modulated with pseudo-random perturbations.

60. 发明授权

US10653007B2 Flexible printed circuit board 有权
公开(公告)号：US10653007B2
公开(公告)日：2020-05-12
申请号：US15738301
申请日：2016-06-22
申请人： SUMITOMO ELECTRIC PRINTED CIRCUITS, INC. , AutoNetworks Technologies, Ltd. , Sumitomo Electric Industries, Ltd. , Sumitomo Wiring Systems, Ltd.
发明人： Takayuki Tsumagari , Yoshifumi Uchita , Shinichi Takase , Hirohisa Saito
IPC分类号： H05K1/02 , H05K1/03 , H01H85/046 , H01H85/02 , H01H69/02 , H05K3/06 , H05K3/00 , H01H85/10 , H05K3/02
摘要： A flexible printed circuit board according to an aspect of the present invention includes a base film having insulating properties and a conductive pattern laminated to one surface side of the base film. The conductive pattern forms part of a circuit and includes at least one fuse portion having a cross section smaller than the other part. The flexible printed circuit board includes at least one opening passing through front and rear surfaces on at least one of the right and left sides of the fuse portion in a two-dimensional view.

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