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1. 发明授权

US10524355B2 Printed circuit board and method of manufacturing the same 有权
公开(公告)号：US10524355B2
公开(公告)日：2019-12-31
申请号：US15488808
申请日：2017-04-17
申请人： Nitto Denko Corporation
发明人： Daisuke Yamauchi , Hiroyuki Tanabe
IPC分类号： H05K1/02 , H05K1/11 , H05K1/09 , H05K3/46
摘要： In a suspension board, a ground layer and a first insulating layer are formed on a support substrate. The ground layer has electric conductivity higher than that of the support substrate. A power wiring trace is formed on the first insulating layer. A second insulating layer is formed on the support substrate to cover the ground layer and the first insulating layer. A write wiring trace is formed on the second insulating layer to at least partially overlap with the ground layer. A distance between the ground layer and the write wiring trace in a stacking direction of the support substrate, the first insulating layer and the second insulating layer is set larger than a distance between the power wiring trace and the write wiring trace in the stacking direction.

2. 发明授权

US10074389B2 Wired circuit board 有权
公开(公告)号：US10074389B2
公开(公告)日：2018-09-11
申请号：US15800692
申请日：2017-11-01
申请人： NITTO DENKO CORPORATION
发明人： Daisuke Yamauchi , Hiroyuki Tanabe
IPC分类号： G11B5/48 , H05K1/02
CPC分类号： G11B5/486 , G11B5/484 , H05K1/0242 , H05K1/028 , H05K2201/09236
摘要： A wired circuit board includes an insulating layer and a plurality of wires disposed at one-side surface in a thickness direction of the insulating layer at spaced intervals to each other. The plurality of wires have one pair of wires in parallel, the plurality of wires continuously have a first portion and a second portion in which the total sum of a line width of one wire of one pair of wires and an interval between one pair of wires is smaller than that of the first portion, and a thickness T1 of the first portion is large with respect to a thickness T2 of the second portion.

3. 发明授权

US10021780B2 Wired circuit board and producing method thereof 有权
公开(公告)号：US10021780B2
公开(公告)日：2018-07-10
申请号：US15800680
申请日：2017-11-01
申请人： NITTO DENKO CORPORATION
发明人： Daisuke Yamauchi , Hiroyuki Tanabe
IPC分类号： H05K1/03 , H05K1/02 , H05K3/06 , H05K3/18
CPC分类号： H05K1/028 , G11B5/484 , H05K1/056 , H05K3/064 , H05K3/18 , H05K3/243 , H05K2201/0191 , H05K2201/0347 , H05K2201/09736 , H05K2203/0353
摘要： A wired circuit board includes an insulating layer and a conductive layer. The insulating layer continuously has a first insulating portion, a second insulating portion having a thickness smaller than that of the first insulating portion, and a third insulating portion disposed between the first insulating portion and the second insulating portion and having a thickness that gradually becomes smaller from the first insulating portion toward the second insulating portion. The conductive layer continuously has a first conductive portion disposed at one-side surface of the first insulating portion and a second conductive portion disposed at one-side surface of the second insulating portion and having a thickness smaller than that of the first conductive portion. The first conductive portion is disposed at one-side surface of the second insulating portion and the third insulating portion or is disposed at one-side surface of the first insulating portion and the third insulating portion.

4. 发明授权

US09949370B2 Suspension board with circuit and producing method thereof 有权
公开(公告)号：US09949370B2
公开(公告)日：2018-04-17
申请号：US15373583
申请日：2016-12-09
申请人： NITTO DENKO CORPORATION
发明人： Hiroyuki Tanabe , Naohiro Terada , Yuu Sugimoto , Daisuke Yamauchi
IPC分类号： H05K1/03 , H05K1/05 , H05K3/22 , H05K3/46 , G11B5/48 , H05K1/11 , H05K3/34
CPC分类号： H05K1/05 , G11B5/483 , G11B5/4853 , H05K1/117 , H05K3/22 , H05K3/3442 , H05K3/4608 , H05K3/4644 , H05K2201/10151 , H05K2201/10227 , Y02P70/613
摘要： A suspension board with circuit includes a metal supporting board, a base insulating layer disposed at one side in a thickness direction of the metal supporting board, a conductor layer disposed at the one side of the base insulating layer and including a connecting terminal electrically connected to a slider, a cover insulating layer covering the conductor layer to expose the connecting terminal and disposed at the one side of the base insulating layer, and a plating layer covering the connecting terminal. The cover insulating layer includes a first cover insulating layer disposed at the one side of the base insulating layer and a second cover insulating layer disposed at the one side of the first cover insulating layer, and the thickness of the plating layer is not more than the total sum of the thickness of the first cover insulating layer and that of the second cover insulating layer.

5. 发明授权

US09940957B2 Printed circuit board and method of manufacturing the same 有权
公开(公告)号：US09940957B2
公开(公告)日：2018-04-10
申请号：US15223241
申请日：2016-07-29
申请人： Nitto Denko Corporation
发明人： Daisuke Yamauchi , Hiroyuki Tanabe
IPC分类号： H05K1/09 , H05K1/05 , G11B5/48 , H05K1/11 , H05K3/24 , H05K3/38
CPC分类号： G11B5/4833 , G11B5/484 , H05K1/056 , H05K1/09 , H05K1/111 , H05K3/244 , H05K3/388 , H05K2201/0341 , H05K2201/0347 , H05K2201/05 , Y02P70/611
摘要： A conductor trace is formed on a base insulating layer. The conductor trace includes two terminal portions and one wiring portion. The wiring portion is formed to connect the two terminal portions to each other and extend from each terminal portion. A metal cover layer is formed to cover the terminal portion and the wiring portion of the conductor trace and continuously extend from a surface of the terminal portion to a surface of the wiring portion. The metal cover layer is made of metal having magnetism lower than magnetism of nickel, and is made of gold, for example. A cover insulating layer is formed on the base insulating layer to cover a portion, of the metal cover layer formed on the conductor trace, covering the wiring portion and not to cover a portion of the metal cover layer covering the terminal portion.

6. 发明授权

US09532445B2 Suspension board with circuit and producing method thereof 有权
标题翻译：具有电路的悬挂板及其制造方法
公开(公告)号：US09532445B2
公开(公告)日：2016-12-27
申请号：US14519636
申请日：2014-10-21
申请人： NITTO DENKO CORPORATION
发明人： Hiroyuki Tanabe
IPC分类号： H05K1/00 , H05K1/03 , G11B5/48 , G11B21/16 , H05K1/02 , H05K1/05 , H05K3/44
CPC分类号： H05K1/0245 , G11B5/484 , H05K1/056 , H05K3/44 , H05K2201/09245 , H05K2201/09254
摘要： A suspension board with circuit includes a metal supporting layer and an insulating layer formed on the metal supporting layer. The insulating layer is made of a single layer, a concave portion is formed in the insulating layer, an opening portion that exposes the metal supporting layer is formed in the concave portion, and an electrically conductive metal portion is formed in the opening portion.
摘要翻译：具有电路的悬挂板包括金属支撑层和形成在金属支撑层上的绝缘层。绝缘层由单层制成，在绝缘层中形成凹部，在凹部形成露出金属支撑层的开口部，在开口部形成导电性金属部。

7. 发明授权

US09502058B2 Suspension board with circuit 有权
标题翻译：悬挂板带电路
公开(公告)号：US09502058B2
公开(公告)日：2016-11-22
申请号：US14878319
申请日：2015-10-08
申请人： NITTO DENKO CORPORATION
发明人： Yoshito Fujimura , Hiroyuki Tanabe , Saori Kanezaki , Naohiro Terada , Yuu Sugimoto
IPC分类号： G11B5/48
CPC分类号： G11B5/4853 , G11B5/4826 , G11B5/484
摘要： A suspension board with circuit includes a metal supporting layer, an insulating base layer on one side thereof in a thickness direction, a conductive pattern disposed on the insulating base layer, an insulating cover layer disposed on the insulating base layer so as to cover the conductive pattern, and a pedestal for supporting a slider which includes a thin pedestal portion. The thin pedestal portion includes a pedestal base layer included in the insulating base layer, a pedestal conductive layer included in the conductive pattern which extends over the pedestal base layer, and a pedestal cover layer included in the insulating cover layer and disposed on the pedestal conductive layer. The conductive pattern includes a first wire placed to extend over the insulating base layer which has a narrower portion, and a dimension of the pedestal conductive layer is 0.5 to 3 times the dimension of the narrower portion.
摘要翻译：具有电路的悬挂板包括金属支撑层，在其一个厚度方向上的绝缘基底层，设置在绝缘基底层上的导电图案，设置在绝缘基底层上以覆盖导电性的绝缘覆盖层图案，以及用于支撑包括薄基座部分的滑块的基座。薄基座部分包括基底绝缘层中包括的基座基层，包括在基座基层上的导电图案中的基座导电层，以及包括在绝缘覆盖层中并设置在基座导电层。导电图案包括放置成在具有较窄部分的绝缘基底层上延伸的第一线，并且基座导电层的尺寸为较窄部分的尺寸的0.5至3倍。

8. 发明授权

US08927870B2 Suspension board with circuit and producing method thereof 有权
标题翻译：具有电路的悬挂板及其制造方法
公开(公告)号：US08927870B2
公开(公告)日：2015-01-06
申请号：US13763232
申请日：2013-02-08
申请人： Nitto Denko Corporation
发明人： Yasushi Tamura , Ryouji Suezaki , Tetsuya Ohsawa , Hiroyuki Tanabe , Hitoki Kanagawa
IPC分类号： H05K1/00 , H05K3/28 , G11B5/48 , G03F7/20 , G03F1/00 , H05K3/00 , H05K1/05
CPC分类号： G03F7/2022 , G03F1/144 , G03F1/70 , G11B5/4846 , H05K1/056 , H05K3/0023 , H05K3/28 , H05K2201/0191 , H05K2203/0505 , H05K2203/0588 , Y10T29/49155 , Y10T29/49156
摘要： A suspension board with circuit includes a metal supporting board, an insulating base layer formed on the metal supporting board, a conductive pattern formed on the insulating base layer, an insulating cover layer formed on the insulating base layer so as to cover the conductive pattern, and an insertion portion to be inserted into an E-block. A thickness of the insulating cover layer in the insertion portion is larger than a thickness of the insulating cover layer in a portion other than the insertion portion.
摘要翻译：具有电路的悬挂板包括金属支撑板，形成在金属支撑板上的绝缘基底层，形成在绝缘基底层上的导电图案，形成在绝缘基底层上以覆盖导电图案的绝缘覆盖层，以及插入到E块中的插入部。插入部中的绝缘覆盖层的厚度比除了插入部以外的部分的绝缘覆盖层的厚度大。

9. 发明授权

US10524363B2 Method for producing wired circuit board 有权
公开(公告)号：US10524363B2
公开(公告)日：2019-12-31
申请号：US15628059
申请日：2017-06-20
申请人： NITTO DENKO CORPORATION
发明人： Yuu Sugimoto , Hiroyuki Tanabe , Yoshito Fujimura
IPC分类号： H05K3/20 , H05K3/18 , G03F7/20 , G03F7/26 , H05K3/10
摘要： A method includes the following steps: S1, providing the insulating layer having an inclined face; S4, disposing a photomask so that in the photoresist, first and second exposure portions are exposed to light, and exposing the photoresist is to light through the photomask; S5, removing the first and the second exposure portions of the photoresist. On the assumption that in S4, light reflected at the metal thin film is focused between the first and the second exposure portions of the photoresist, the inclined face has a bending portion bending in one direction, the portion removed in S5 in the photoresist due to light focus being continuous with the first and the second exposure portions. The second exposure portion includes continuously an avoidance portion that avoids the bending portion and an overlapping portion that overlaps with at least a portion other than the bending portion in the inclined face.

10. 发明授权

US10201077B2 Suspension board assembly sheet having circuits, method of manufacturing the same and method of inspecting the same 有权
公开(公告)号：US10201077B2
公开(公告)日：2019-02-05
申请号：US15208655
申请日：2016-07-13
申请人： Nitto Denko Corporation
发明人： Yuu Sugimoto , Hiroyuki Tanabe , Naohiro Terada
IPC分类号： H05K1/14 , H01L23/522 , H05K1/02 , H05K1/11 , H05K3/42 , H05K3/00 , G01R1/04 , G11B5/48
摘要： A suspension board and an inspection substrate are integrally supported by a support frame. In the suspension board, first and second insulating layers are laminated on a support substrate in this order. Part of a line is formed on the first insulating layer, and the remaining line is formed on the second insulating layer. A via connecting the part of the line to the remaining line is formed in the second insulating layer. In the inspection substrate, the first and second insulating layers are laminated on the support substrate in this order. A first inspection conductor layer is formed on the first insulating layer, and a second inspection conductor layer is formed on the second insulating layer. A via connecting the first inspection conductor layer to the second inspection conductor layer is formed in the second insulating layer.

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