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61. 发明申请

US20100213257A1 OPTICAL SENSING DEVICE 审中-公开
标题翻译：光学传感器件
公开(公告)号：US20100213257A1
公开(公告)日：2010-08-26
申请号：US12465661
申请日：2009-05-14
申请人： Shang-Ho Hung , Chun-Chih Liang
发明人： Shang-Ho Hung , Chun-Chih Liang
IPC分类号： G06K7/10
CPC分类号： G06K7/10702
摘要： An optical sensing device is suitable for detecting information on an information plane. The optical sensing device includes a light source, an optical grating and an optical detector. The light source is suitable for providing a light beam along a first axis. The light beam is illuminated on the information plane and is converted into an optical signal exiting the information plane. The optical grating has at least a split. The optical detector is suitable for receiving the optical signal to generate the information. The optical signal passes through the split of the grating and reaches the optical detector along a second axis that is positioned at an angle with respect to the first axis.
摘要翻译：光学感测装置适用于检测信息平面上的信息。光学感测装置包括光源，光栅和光学检测器。光源适于沿着第一轴提供光束。光束在信息平面上被照亮，并被转换成离开信息平面的光信号。光栅至少有一个分裂。光学检测器适用于接收光信号以产生信息。光信号通过光栅的分割并沿着相对于第一轴线成一定角度的第二轴线到达光学检测器。

62. 发明申请

US20100200876A1 MULTI-CHIP LIGHT EMITTING DIODE AND METHOD FOR FABRICATING THE SAME 有权
标题翻译：多芯片发光二极管及其制造方法
公开(公告)号：US20100200876A1
公开(公告)日：2010-08-12
申请号：US12700102
申请日：2010-02-04
申请人： Ke-Hao Pan , Chun-Cheng Lin
发明人： Ke-Hao Pan , Chun-Cheng Lin
IPC分类号： H01L33/00
CPC分类号： H01L25/0753 , H01L2924/0002 , H01L2933/0091 , H01L2924/00
摘要： Multi-chip light emitting diodes and method for fabricating the same are provided. The multi-chip light emitting diode includes a lead frame including a carrier part. A plurality of chips is disposed on the carrier part, wherein the plurality of chips includes a first chip and a second chip. A first scattering layer is conformally covering the first chip to expose electrodes thereof, wherein the first scattering layer consists of a first scattering material. A second scattering layer is conformally covering the second chip to expose electrodes thereof, wherein the second scattering layer consists of a second scattering material.
摘要翻译：提供了多芯片发光二极管及其制造方法。多芯片发光二极管包括具有载体部分的引线框架。多个芯片设置在载体部分上，其中多个芯片包括第一芯片和第二芯片。第一散射层保形地覆盖第一芯片以暴露其电极，其中第一散射层由第一散射材料组成。第二散射层保形地覆盖第二芯片以暴露其电极，其中第二散射层由第二散射材料组成。

63. 发明申请

US20100188857A1 OPTICAL LENS STRUCTURE 审中-公开
标题翻译：光学镜片结构
公开(公告)号：US20100188857A1
公开(公告)日：2010-07-29
申请号：US12402503
申请日：2009-03-12
申请人： Jen-Ta Chiang , Chia-Hao Liang
发明人： Jen-Ta Chiang , Chia-Hao Liang
IPC分类号： F21V3/00
CPC分类号： G02B3/00 , H01L33/54 , H01L33/58
摘要： An optical lens structure is disclosed. The optical lens structure is suitable to cover a light emitting source, wherein the light emitting source is suitable to provide an illumination light. The optical lens structure includes a trench structure and two optical light-emitting surfaces. The two optical light-emitting surfaces are located at both sides opposite to each other of the trench structure and physically connect the trench structure. The illumination light from the light emitting source is transmitted from the optical light-emitting surfaces to a direction far away from the light emitting source.
摘要翻译：公开了一种光学透镜结构。光学透镜结构适于覆盖发光源，其中发光源适于提供照明光。光学透镜结构包括沟槽结构和两个光发射表面。两个光发射表面位于沟槽结构的彼此相对的两侧并物理地连接沟槽结构。来自发光源的照明光从光发射表面传送到远离发光源的方向。

64. 发明申请

US20100187551A1 LIGLIGHT EMITTING DIODE PACKAGE STRUCTURE 审中-公开
标题翻译：发光二极管封装结构
公开(公告)号：US20100187551A1
公开(公告)日：2010-07-29
申请号：US12604376
申请日：2009-10-22
申请人： Yen-Fu Chou
发明人： Yen-Fu Chou
IPC分类号： H01L33/00
CPC分类号： H01L33/486 , H01L33/52 , H01L33/56 , H01L2224/48091 , H01L2224/48247 , H01L2924/00014
摘要： An LED package structure includes a carrier, a housing, an LED chip, a encapsulant and a surface treatment layer. The housing is disposed on the carrier and has an upper surface, wherein the housing and the carrier together form a chip-containing cavity. The LED chip is disposed on the carrier and located in the chip-containing cavity. The encapsulant is disposed in the chip-containing cavity and encapsulates the LED chip. The surface treatment layer is disposed on the upper surface of the housing to prevent the encapsulant from adhering to the upper surface of the housing.
摘要翻译： LED封装结构包括载体，壳体，LED芯片，密封剂和表面处理层。壳体设置在载体上并具有上表面，其中壳体和载体一起形成含芯片的腔体。 LED芯片设置在载体上并且位于包含芯片的腔中。密封剂设置在含芯片的腔中并封装LED芯片。表面处理层设置在壳体的上表面上，以防止密封剂粘附到壳体的上表面。

65. 外观设计

USD618636S1 Light emitting diode lamp 有权
公开(公告)号：USD618636S1
公开(公告)日：2010-06-29
申请号：US29345871
申请日：2009-10-23
申请人： Chung-Chuan Hsieh
设计人： Chung-Chuan Hsieh

66. 外观设计

USD616386S1 Housing of a light emitting diode package 有权
标题翻译：外壳的发光二极管封装
公开(公告)号：USD616386S1
公开(公告)日：2010-05-25
申请号：US29341474
申请日：2009-08-06
申请人： Chung-Han Sheng , Yi-Wen Chen
设计人： Chung-Han Sheng , Yi-Wen Chen

67. 外观设计

USD598582S1 Lamp 有权
公开(公告)号：USD598582S1
公开(公告)日：2009-08-18
申请号：US29332905
申请日：2009-02-27
申请人： Chien-Chang Pei , Yi-Hung Chen , Yu-Ju Liu
设计人： Chien-Chang Pei , Yi-Hung Chen , Yu-Ju Liu

68. 发明申请

US20090090927A1 Structure of light emitted diode package 审中-公开
标题翻译：发光二极管封装的结构
公开(公告)号：US20090090927A1
公开(公告)日：2009-04-09
申请号：US12003835
申请日：2008-01-02
申请人： Peter Pan , Abram Chang , Yu-Feng Lin
发明人： Peter Pan , Abram Chang , Yu-Feng Lin
IPC分类号： H01L33/00
CPC分类号： H01L33/54
摘要： A structure of light emitted diode package including a lead frame, a holder coupled on an end of the lead frame, a LED chip disposed on the holder, a lower sealing portion made by injection molding a first resin material to grab one end of lead frame with the LED chip in order to hold the lead frame and an upper sealing portion made by casting by a second resin material to dispose on the top of the lower sealing portion.
摘要翻译：发光二极管封装的结构，包括引线框架，耦合在引线框架的端部上的保持器，设置在保持器上的LED芯片，通过注射成型第一树脂材料以抓住引线框架的一端而制成的下封装部分 LED芯片为了保持引线框架和通过第二树脂材料浇注而制成的上部密封部分以配置在下部密封部分的顶部上。

69. 发明申请

US20090045417A1 LIGHT EMITTING SEMICONDUCTOR DEVICE 有权
标题翻译：发光半导体器件
公开(公告)号：US20090045417A1
公开(公告)日：2009-02-19
申请号：US12057382
申请日：2008-03-28
申请人： Tzu-Hao Chao , Chun-Peng Chen
发明人： Tzu-Hao Chao , Chun-Peng Chen
IPC分类号： H01L33/00
CPC分类号： H01L25/0753 , F21K9/00 , H01L33/642 , H01L2224/48091 , H01L2924/01322 , H01L2924/00 , H01L2924/00014
摘要： A light emitting semiconductor device is provided, wherein the light emitting semiconductor device comprises a substrate, a plurality of flip chips, a heat conductive board and an insulating board. These flip chips are electrically connected on the substrate. The heat conductive board has a protruding portion used to support the substrate. The insulating board has a plurality of connecting pads and an opening, wherein the protruding portion is sheathed in the opening, so as to expose the substrate. The exposed substrate is then electrically connected to the connecting pads.
摘要翻译：提供一种发光半导体器件，其中发光半导体器件包括衬底，多个倒装芯片，导热板和绝缘板。这些倒装芯片电连接在基板上。导热板具有用于支撑基板的突出部分。绝缘板具有多个连接焊盘和开口，其中突出部分被套在开口中，以露出基板。暴露的基板然后电连接到连接焊盘。

70. 发明申请

US20080291360A1 Light emitting diode back light module 失效
标题翻译：发光二极管背光模块
公开(公告)号：US20080291360A1
公开(公告)日：2008-11-27
申请号：US11890722
申请日：2007-08-07
申请人： Chieng-Chang Pei
发明人： Chieng-Chang Pei
IPC分类号： F21V7/04 , G02F1/1335
CPC分类号： H05K3/0061 , F21K9/00 , F21V19/003 , F21V29/503 , F21V29/89 , F21Y2103/10 , F21Y2115/10 , G02F2001/133628 , H05K2201/10106 , H05K2201/10393
摘要： An LED back light module includes a metal support, a thermal conductive material, a circuit board and at least one light emitting diode. The metal support has a recess and a plurality of holes. The thermal conductive material has a first surface in contact with a bottom of the recess. The circuit board is disposed on a second surface of the thermal conductive material, in which the circuit board has a plurality of flanges lodged into the holes of the metal support for compacting the circuit board, the thermal conductive material and the metal support. The light emitting diode is disposed on the circuit board, in which the thermal energy generated by the light emitting diode is delivered to the metal support through the circuit board and the thermal conductive material.
摘要翻译： LED背光模块包括金属支架，导热材料，电路板和至少一个发光二极管。金属支撑件具有凹部和多个孔。导热材料具有与凹部的底部接触的第一表面。所述电路板设置在所述导热材料的第二表面上，其中所述电路板具有多个凸缘，所述多个凸缘嵌入所述金属支撑件的孔中，用于压缩所述电路板，所述导热材料和所述金属支撑。发光二极管设置在电路板上，其中由发光二极管产生的热能通过电路板和导热材料传送到金属支架。

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