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1. 发明申请

US20180277970A1 IMPLANTABLE CONNECTOR 审中-公开
公开(公告)号：US20180277970A1
公开(公告)日：2018-09-27
申请号：US15923490
申请日：2018-03-16
申请人： Verily Life Sciences LLC
发明人： Kedar Shah
IPC分类号： H01R12/52 , H01R13/24 , H01R13/52 , H01R43/20 , H05K1/14 , H05K1/11 , H05K5/00 , H05K3/40 , H05K3/36 , A61B5/00 , A61B5/04 , A61B17/34 , A61N1/05
CPC分类号： H01R12/52 , A61B5/0031 , A61B5/04001 , A61B5/14503 , A61B5/14532 , A61B5/6846 , A61B5/686 , A61B17/3468 , A61B2560/063 , A61B2562/0209 , A61B2562/16 , A61B2562/227 , A61N1/0551 , A61N1/3605 , A61N1/3752 , A61N1/3754 , H01R12/7082 , H01R12/714 , H01R13/2414 , H01R13/2421 , H01R13/521 , H01R13/5219 , H01R43/205 , H01R2201/12 , H05K1/02 , H05K1/112 , H05K1/144 , H05K3/368 , H05K3/4007 , H05K3/4015 , H05K3/4038 , H05K5/0056 , H05K5/006 , H05K5/0095 , H05K2201/0133 , H05K2201/042 , H05K2201/09163 , H05K2201/09409 , H05K2201/10265 , H05K2201/10371 , H05K2201/10393 , H05K2201/10409 , H05K2201/2018 , H05K2201/2036
摘要： An implantable connector for connecting an electronics package and a neural interface is described. The connection between the electronics package and the neural interface is made by way of a set of compressible contacts (e.g., springs) that physical contact a set of corresponding exposed bond pads. The compressible contacts are held in compression with the exposed bond pads using a mechanical coupler. The compressible contacts are physically separated and electrically isolated from each other by way of a compressible gasket. The compressible gasket is also held in compression using the mechanical coupler.

2. 发明授权

US09844144B1 Pogo pin integrated circuit package mount 有权
公开(公告)号：US09844144B1
公开(公告)日：2017-12-12
申请号：US15231018
申请日：2016-08-08
申请人： Intel Corporation
发明人： Emad Al-Momani , Jack Mumbo , Srikanth Mothukuri
IPC分类号： H05K1/18
CPC分类号： H05K1/181 , H01R13/2421 , H05K3/325 , H05K2201/10318 , H05K2201/10378 , H05K2201/10393 , H05K2201/10409 , H05K2201/1056 , H05K2201/10598 , H05K2201/10719 , H05K2201/10734
摘要： Apparatuses, systems and methods associated with electrical fast transient tolerant input/output (I/O) communication (e.g., universal serial bus (USB)) design are disclosed herein. In embodiments, an apparatus to mount an integrated circuit (IC) package, may include a printed circuit board (PCB), a plurality of pogo pins, and a mounting mechanism. The plurality of pogo pins may be mounted to electrical contacts of the PCB, the plurality of pogo pins may be coupled to the electrical contacts at first ends of the plurality of pogo pins and may be to couple to the IC package at second ends of the plurality of pogo pins. The mounting mechanism may position the IC package on the second ends of the plurality of pogo pins. Other embodiments may be described and/or claimed.

3. 发明授权

US09572244B1 Latch device for heat dissipation component 有权
标题翻译：用于散热部件的锁定装置
公开(公告)号：US09572244B1
公开(公告)日：2017-02-14
申请号：US14882390
申请日：2015-10-13
申请人： ASIA VITAL COMPONENTS CO., LTD.
发明人： Sheng-Huang Lin
IPC分类号： H05K1/02
CPC分类号： H05K1/0203 , H01L23/4006 , H01L2023/405 , H01L2023/4062 , H01L2023/4081 , H05K1/0209 , H05K2201/066 , H05K2201/10393 , H05K2201/10598
摘要： A latch device for heat dissipation component includes a main body, a first and a second elastic member, a first and a second rotary unit. Two sides of the main body are respectively formed with a first and a second perforation. The first and second elastic members are fixedly disposed on one face of a motherboard. A first and a second hook/latch section respectively protrude from the first and the second elastic members corresponding to the first and second perforations. By means of a first and a second hook/latch member, the first and second rotary units are correspondingly hooked/latch with the first and second hook/latch sections. Then, the first and second rotary units are rotated to pull upward the first and second hook/latch members; further the first and second hook/latch sections can fix the main body. Hence, a user can assemble/detach the main body without using any hand tool.
摘要翻译：用于散热部件的闩锁装置包括主体，第一和第二弹性部件，第一和第二旋转单元。主体的两侧分别形成有第一和第二穿孔。第一和第二弹性构件固定地设置在主板的一个面上。第一和第二钩/闩锁部分分别从对应于第一和第二穿孔的第一和第二弹性部件伸出。通过第一和第二钩/闩构件，第一和第二旋转单元相应地与第一和第二钩/闩锁部分钩挂/锁定。然后，第一和第二旋转单元被旋转以向上拉第一和第二钩/闩构件; 此外，第一和第二钩/闩锁部分可以固定主体。因此，用户可以在不使用任何手动工具的情况下组装/拆卸主体。

4. 发明授权

US09510455B2 Electronic component embedded substrate and manufacturing method thereof 有权
标题翻译：电子元件嵌入式基板及其制造方法
公开(公告)号：US09510455B2
公开(公告)日：2016-11-29
申请号：US14219768
申请日：2014-03-19
申请人： SAMSUNG ELECTRO-MECHANICS CO., LTD.
发明人： Bong-Soo Kim
IPC分类号： H05K1/18 , H05K3/46
CPC分类号： H05K1/186 , H05K3/4673 , H05K2201/10393 , Y10T29/49139
摘要： The present invention discloses an electronic component embedded substrate and a manufacturing method thereof. The electronic component embedded substrate in accordance with an embodiment of the present invention includes: a core board having a cavity formed therein; an electronic component being embedded in the cavity; and a circuit pattern formed on one surface of the core board and configured for fixing the electronic component in the cavity by pressing the electronic component.
摘要翻译：本发明公开了一种电子部件嵌入式基板及其制造方法。根据本发明实施例的电子部件嵌入式基板包括：形成有腔的芯板; 电子部件嵌入在所述腔中; 以及电路图案，其形成在所述芯板的一个表面上并且被构造用于通过按压所述电子部件来将所述电子部件固定在所述空腔中。

5. 发明申请

US20160043485A1 ELECTRICAL CONNECTION ARRANGEMENT 有权
标题翻译：电气连接装置
公开(公告)号：US20160043485A1
公开(公告)日：2016-02-11
申请号：US14817791
申请日：2015-08-04
申请人： Delphi International Operations Luxembourg S.A.R.L.
发明人： Peter Stoermer
IPC分类号： H01R12/70
CPC分类号： H01R12/7076 , H01R12/7088 , H01R12/714 , H01R12/75 , H01R12/88 , H05K1/0204 , H05K1/0209 , H05K1/0263 , H05K1/117 , H05K2201/066 , H05K2201/10356 , H05K2201/10393 , H05K2201/10598 , H05K2201/10969
摘要： A connection arrangement includes a printed circuit board, a semiconductor component arranged on a first surface, a first side, of the printed circuit board, a connection means arranged on a second surface, a second side, of the printed circuit board, a contact element contactable with the connection means and an electrical line, wherein the connection means is arranged opposite the semiconductor component.
摘要翻译：连接装置包括印刷电路板，布置在印刷电路板的第一表面，第一侧的半导体部件，布置在印刷电路板的第二表面，第二侧上的连接装置，接触元件可与所述连接装置和电线接触，其中所述连接装置布置成与所述半导体部件相对。

6. 发明授权

US09258881B2 SMT heat sink anchor 有权
标题翻译： SMT散热器锚
公开(公告)号：US09258881B2
公开(公告)日：2016-02-09
申请号：US14161618
申请日：2014-01-22
申请人： HON HAI PRECISION INDUSTRY CO., LTD.
发明人： Hao-Yun Ma
IPC分类号： H01L23/40 , H05K7/20 , H05K1/02 , H01L23/34 , H05K3/30
CPC分类号： H05K1/0203 , H01L23/34 , H01L23/40 , H01L23/4093 , H01L2924/0002 , H05K3/301 , H05K2201/066 , H05K2201/10393 , H05K2201/2045 , H05K2201/2072 , H01L2924/00
摘要： An electronic device includes a printed circuit board having a top surface, a clip member, a heat sink mounted on the top surface of the printed circuit board, and an anchor having a mounting portion with a solder surface for soldering to the top surface of the printed circuit board and a hook portion used to lock the clip member assembled to the heat sink. The solder surface is mounted to the top surface of the printed circuit board by surface mount technique (SMT).
摘要翻译：一种电子设备包括具有顶表面，夹子构件，安装在印刷电路板的顶表面上的散热器的印刷电路板，以及具有焊接表面的安装部分的锚固件，该焊接表面用于焊接到印刷电路板的顶表面印刷电路板和用于锁定组装到散热器上的夹子构件的钩部。焊接表面通过表面贴装技术（SMT）安装到印刷电路板的顶表面。

7. 发明授权

US09230763B2 Relay assembly with fastening clip 有权
标题翻译：带紧固夹的继电器组件
公开(公告)号：US09230763B2
公开(公告)日：2016-01-05
申请号：US14186401
申请日：2014-02-21
申请人： Johnson Electric S.A.
发明人： Joerg Gassmann , Soeren Heinrich
IPC分类号： H01H45/04 , H01H50/04 , H01H50/14 , H05K3/30 , H01H1/58 , H01H9/26
CPC分类号： H01H45/04 , H01H1/5805 , H01H9/26 , H01H50/047 , H01H50/14 , H05K3/301 , H05K2201/10393 , H05K2201/10568 , H05K2201/2036
摘要： A relay assembly comprises a relay mounted on a board. The relay may be a single or individual relay or a polyphasic relay. The relay has a housing and at least one dip solder pin extending from the housing and soldered to a circuit board. The relay is mounted on the circuit board via at least one fastening clip having a fitting part fitted into a hole in the housing, a latching part latched to a bore in the board, and a central flange between the fitting part and the latching part.
摘要翻译：继电器组件包括安装在电路板上的继电器。继电器可以是单个或单独的继电器或多相继电器。继电器具有壳体和至少一个从壳体延伸并焊接到电路板的浸焊管脚。继电器通过至少一个紧固夹安装在电路板上，紧固夹具具有装配在壳体中的孔中的配合部分，闩锁在板中的孔中的闩锁部分和配合部分和闩锁部分之间的中心凸缘。

8. 发明申请

US20150345766A1 ELECTRIC CONNECTING MEMBER AND LED LAMP USING THE SAME 有权
标题翻译：电连接器和使用其的LED灯
公开(公告)号：US20150345766A1
公开(公告)日：2015-12-03
申请号：US14653945
申请日：2013-12-16
申请人： Linhua WANG , Xiaolei ZHU , Lin ZHOU , Han ZHAO
发明人： Linhua Wang , Xiaolei Zhu , Lin Zhou , Han Zhao
IPC分类号： F21V23/06 , H01R33/22 , H01R33/18 , F21K99/00 , F21V23/00
CPC分类号： F21V23/06 , F21K9/23 , F21K9/232 , F21K9/238 , F21V23/00 , F21V23/006 , F21Y2115/10 , H01R33/18 , H01R33/225 , H05K3/308 , H05K3/366 , H05K2201/10106 , H05K2201/10189 , H05K2201/10318 , H05K2201/10333 , H05K2201/10393 , H05K2201/1059 , H05K2201/10878
摘要： An electric connecting member and an LED lamp using the electric connecting member are provided. The electric connecting member is used for the electric connection between a light source substrate and a driving board of the LED lamp, and comprises an input terminal and an output terminal. The LED lamp comprises the driving board and the light source substrate. The output terminal is provided on the driving board of the LED lamp. The input terminal is disposed upon the light source substrate and is electrically connected to the light source substrate. The output terminal comprises two contacts, and one end of each of the two contacts is electrically connected to the driving board respectively. The input terminal comprises two connection heads which are respectively provided corresponding to the two contacts. One end of each of the two connection heads is electrically connected to the light source substrate respectively.
摘要翻译：提供使用电连接构件的电连接构件和LED灯。电连接构件用于光源基板和LED灯的驱动板之间的电连接，并且包括输入端子和输出端子。 LED灯包括驱动板和光源基板。输出端子设置在LED灯的驱动板上。输入端子设置在光源基板上并与光源基板电连接。输出端子包括两个触点，两个触点中的每一个的一端分别电连接到驱动板。输入端子包括分别对应于两个触头设置的两个连接头。两个连接头中的每一个的一端分别电连接到光源基板。

9. 发明申请

US20150260932A1 CIRCUIT MODULE 有权
标题翻译：电路模块
公开(公告)号：US20150260932A1
公开(公告)日：2015-09-17
申请号：US14727040
申请日：2015-06-01
申请人： HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
发明人： Terrel MORRIS
IPC分类号： G02B6/42 , H05K3/32 , H05K3/34 , H01L23/40
CPC分类号： G02B6/4269 , G02B6/4261 , G02B6/428 , G02B6/4285 , H01L23/4006 , H01L23/4093 , H01L23/42 , H01L24/16 , H01L25/167 , H01L27/14618 , H01L2224/16225 , H01L2924/14 , H01L2924/1433 , H01L2924/1434 , H01L2924/15192 , H01L2924/15311 , H01L2924/15312 , H01L2924/15313 , H04N5/2253 , H04N5/335 , H05K3/325 , H05K3/34 , H05K2201/10121 , H05K2201/10393 , Y10T29/49126 , Y10T29/49144
摘要： A circuit module can include a substrate, a photonic conversion unit placed on the substrate; and a retention assembly. The retention assembly can include a heat sink in thermal contact with the photonic conversion unit and a fastener. The fastener can be mechanically coupled to both the substrate and the heat sink, and configured to press the heat sink against the photonic conversion unit. The photonic conversion unit is removably secured to the substrate by the retention assembly without the use of a bonding material.
摘要翻译：电路模块可以包括衬底，放置在衬底上的光子转换单元; 和保持组件。保持组件可以包括与光子转换单元和紧固件热接触的散热器。紧固件可以机械地耦合到基板和散热器两者，并且被配置为将散热器压靠光子转换单元。光子转换单元通过保持组件可移除地固定到基板上，而不使用粘结材料。

10. 发明申请

US20150144386A1 ELECTRONIC COMPONENT EMBEDDED SUBSTRATE AND MANUFACTURING METHOD THEREOF 有权
标题翻译：电子元件嵌入式基板及其制造方法
公开(公告)号：US20150144386A1
公开(公告)日：2015-05-28
申请号：US14219768
申请日：2014-03-19
申请人： SAMSUNG ELECTRO-MECHANICS CO., LTD.
发明人： Bong-Soo KIM
IPC分类号： H05K1/18 , H05K3/30 , H05K3/40 , H05K3/10
CPC分类号： H05K1/186 , H05K3/4673 , H05K2201/10393 , Y10T29/49139
摘要： The present invention discloses an electronic component embedded substrate and a manufacturing method thereof. The electronic component embedded substrate in accordance with an embodiment of the present invention includes: a core board having a cavity formed therein; an electronic component being embedded in the cavity; and a circuit pattern formed on one surface of the core board and configured for fixing the electronic component in the cavity by pressing the electronic component.
摘要翻译：本发明公开了一种电子部件嵌入式基板及其制造方法。根据本发明实施例的电子部件嵌入式基板包括：形成有腔的芯板; 电子部件嵌入在所述腔中; 以及电路图案，其形成在所述芯板的一个表面上并且被构造用于通过按压所述电子部件来将所述电子部件固定在所述空腔中。

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