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    • 67. 发明授权
    • Semiconductor device and method of fabricating the same
    • 半导体装置及其制造方法
    • US06680230B2
    • 2004-01-20
    • US10201111
    • 2002-07-24
    • Norihisa AraiFumitaka AraiSeiichi AritomeAkira ShimizuRiichiro Shirota
    • Norihisa AraiFumitaka AraiSeiichi AritomeAkira ShimizuRiichiro Shirota
    • H01L21336
    • H01L27/11526H01L27/105H01L27/11546
    • A method of fabricating a semiconductor device which has a cell array with non-volatile memory transistors and a peripheral circuit including a first transistor and a second transistor as driven by a lower voltage than the first transistor is disclosed. The method includes the steps of forming over a semiconductor substrate a first gate dielectric film for use in the first transistor, selectively etching the first gate dielectric film in the cell array region to expose the substrate, forming over the exposed substrate a second gate dielectric film which is for use as a tunnel dielectric film of the memory transistors, forming a first gate electrode material film over the first and second gate dielectric films, selectively etching the first gate electrode material film and its underlying first gate dielectric film in the second transistor region, forming over the exposed substrate a third gate dielectric film which is for use in the second transistor, forming a second gate electrode material film over the third gate dielectric film, and forming gates of the respective transistors while letting the gates at least partly include the first and second gate electrode material films.
    • 公开了一种制造半导体器件的方法,该半导体器件具有具有非易失性存储晶体管的单元阵列和包括由比第一晶体管低的电压驱动的第一晶体管和第二晶体管的外围电路。 该方法包括以下步骤:在半导体衬底上形成用于第一晶体管的第一栅极电介质膜,选择性地蚀刻电池阵列区域中的第一栅极电介质膜以暴露衬底,在暴露的衬底上形成第二栅极电介质膜 其用作存储晶体管的隧道电介质膜,在第一和第二栅极电介质膜上形成第一栅电极材料膜,在第二晶体管区域中选择性地蚀刻第一栅电极材料膜及其下面的第一栅极电介质膜 在暴露的衬底上形成用于第二晶体管的第三栅极电介质膜,在第三栅极电介质膜上形成第二栅电极材料膜,并且在使栅极至少部分地包括 第一和第二栅电极材料膜。
    • 68. 发明授权
    • Semiconductor integrated circuit device with high and low voltage wells
    • 具有高低压井的半导体集成电路器件
    • US06495896B1
    • 2002-12-17
    • US09407401
    • 1999-09-28
    • Toshitake YaegashiSeiichi AritomeYuji TakeuchiKazuhiro Shimizu
    • Toshitake YaegashiSeiichi AritomeYuji TakeuchiKazuhiro Shimizu
    • H01L2900
    • H01L27/11526H01L21/761H01L21/823878H01L27/11531
    • A semiconductor integrated circuit device comprises an n-type well 8-1 formed in a p-type silicon substrate 1, an n-type well 8-2 formed so as to surround a part of the substrate 1, in which a p−-type well is formed, a p−-type well 15-1 formed in the substrate 1, a p−-type well 15-2 formed in a part of the substrate 1, which is surrounded by the n-type well, an embedded n-type well 12-1 formed below the p−-type well 15-1, and an n-type well 12-2 which is formed below the p−-type well 15-2 and which is connected to the n-type well 8-2. Thus, it is possible to provide a semiconductor integrated circuit device capable of suppressing the increase of the number of photolithography steps and reducing the manufacturing costs. Alternatively, low-voltage n-channel MOS transistors QN1, QN2 and low-voltage p-channel MOS transistors QP1, QP2 are formed in a p-type well 214 and n-type well 213 of a p−-type silicon substrate 211, respectively, and high-voltage n-channel MOS transistors QN3, QN4 are formed in the substrate 211. The p-type well 214, in which the transistors QN1, QN2 are formed, and the p-type element isolating layer 215 of the element isolating regions for the transistors QN3, QN4 are simultaneously formed by ion implantation using a resist mask by the lithography on a flat surface having no step. The p-type well 214 and the p-type element isolating layer 215 have the same depth from the substrate surface of the element regions and the same impurity density. Thus, it is possible to provide a semiconductor integrated circuit device capable of achieving good element isolation characteristics, and a method for producing the same.
    • 半导体集成电路器件包括形成在p型硅衬底1中的n型阱8-1,形成为围绕衬底1的一部分的n型阱8-2,其中p型 形成良好的p型阱15-1,形成在衬底1中的p型阱15-1,形成在衬底1的被n型阱包围的部分中的p型阱15-2,嵌入 n型阱12-1形成在p型阱15-1的下方,n型阱12-2形成在p型阱15-2的下方,并与n型阱15-1连接。 好8-2。 因此,可以提供能够抑制光刻步骤数量增加并降低制造成本的半导体集成电路器件。或者,低电压n沟道MOS晶体管QN1,QN2和低压p沟道MOS 晶体管QP1,QP2分别形成在p型硅衬底211的p型阱214和n型阱213中,并且高压n沟道MOS晶体管QN3,QN4形成在衬底211中。 其中形成晶体管QN1,QN2的p型阱214和用于晶体管QN3,QN4的元件隔离区的p型元件隔离层215同时通过使用光刻胶的抗蚀剂掩模的离子注入形成 在没有台阶的平坦表面上。 p型阱214和p型元件隔离层215具有与元件区域的衬底表面相同的深度和相同的杂质密度。 因此,可以提供能够实现良好元件隔离特性的半导体集成电路器件及其制造方法。