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61. 发明授权

US5560764A Electroless gold plating solution 失效
标题翻译：化学镀金液
公开(公告)号：US5560764A
公开(公告)日：1996-10-01
申请号：US514763
申请日：1995-08-14
申请人： Hiroshi Wachi , Yutaka Otani
发明人： Hiroshi Wachi , Yutaka Otani
IPC分类号： C23C18/44 , C23C18/52
CPC分类号： C23C18/44
摘要： The present invention provides an electroless gold plating solution which offers deposition layers exactly onto predetermined areas on the surface of the workpiece, without undesirable spread of prated areas. The electroless gold plating solution according to the invention contains 2-20 g/l of dimethylamine as amine group.
摘要翻译：本发明提供了一种无电镀金镀液，其将沉积层精确地提供到工件表面上的预定区域上，而不会不期望地涂覆区域。根据本发明的无电镀金液含有2-20g / l二胺作为胺基。

62. 发明授权

US5429672A Silica effect control during metal deposition 失效
标题翻译：金属沉积期间的二氧化硅效应控制
公开(公告)号：US5429672A
公开(公告)日：1995-07-04
申请号：US275266
申请日：1994-07-15
申请人： Ronald J. DeNuccio
发明人： Ronald J. DeNuccio
IPC分类号： C23C18/44 , C23C16/00 , C23C18/00
CPC分类号： C23C18/44
摘要： The harmful effects exhibited by excess silica (Si.sub.2 O) in electroless metal deposition solutions can be controlled by the use of certain amines. The amines can be prepared in separate solutions or can be incorporated into usual plating solutions to effectively control the effects of excess silica present. The amines can be shown to prevent voiding on glass substrates during silver deposition which often occurs with excess silica of amounts over 0.5 ppm.
摘要翻译：无电金属沉积溶液中过量二氧化硅（Si 2 O）表现的有害影响可以通过使用某些胺来控制。胺可以在单独的溶液中制备，或者可以掺入通常的电镀溶液中以有效地控制存在的过量二氧化硅的影响。可以显示胺，以防止在银沉积期间在玻璃基板上的空隙，其通常发生在超过0.5ppm的过量二氧化硅上。

63. 发明授权

US5370934A Electroless plated aramid surfaces 失效
标题翻译：无电镀芳族聚酰胺表面
公开(公告)号：US5370934A
公开(公告)日：1994-12-06
申请号：US988423
申请日：1992-12-14
申请人： Robert R. Burch , Richard Gould , Kiu-Seung Lee , Brian R. Phillips
发明人： Robert R. Burch , Richard Gould , Kiu-Seung Lee , Brian R. Phillips
IPC分类号： C08L77/00 , C08L77/10 , C23C18/16 , C23C18/30 , C23C18/34 , C23C18/40 , C23C18/44 , D06M11/00 , D06M11/83 , D06M101/00 , D06M101/16 , D06M101/18 , D06M101/34 , D06M101/36 , D06Q1/04
CPC分类号： D06M11/83 , C08L77/10 , C23C18/1641 , C23C18/1658 , C23C18/285 , C23C18/30 , Y10T428/2938 , Y10T428/294 , Y10T428/2958 , Y10T428/2969
摘要： Conductive fibers of a combination of aramid and polyvinyl pyrrolidone (PVP) are disclosed having a strongly bonded metal coating applied by electroless plating. PVP increases adhesion of the fiber surface to the electroless plating. The preferred aramid is poly(p-phenylene terephthalamide).
摘要翻译：公开了芳族聚酰胺和聚乙烯吡咯烷酮（PVP）的组合的导电纤维，其具有通过无电镀施加的强粘合金属涂层。 PVP增加了纤维表面与化学镀层的粘合力。优选的芳族聚酰胺是聚对苯二甲酰对苯二胺。

64. 发明授权

US5338343A Catalytic electroless gold plating baths 失效
标题翻译：催化无电镀金浴
公开(公告)号：US5338343A
公开(公告)日：1994-08-16
申请号：US96558
申请日：1993-07-23
申请人： Harry H. Kroll , Jean Chevalier
发明人： Harry H. Kroll , Jean Chevalier
IPC分类号： C23C18/44
CPC分类号： C23C18/44
摘要： An electroless catalytic gold plating solution is disclosed comprising a water soluble organic thiol gold (I) complex, an alkali metal cyanide, an alkali metal hydroxide, a borohydride reducing agent, and may also contain a stabilizing agent. The electroless gold plating solution will deposit gold on a gold surface several times faster than the conventional electroless gold baths based on potassium aurous cyanide. The use of an organic thiol gold (I) complex eliminates the buildup of inhibitory cyanide ions as a result of replenishment.
摘要翻译：公开了一种无电催化镀金液，其包含水溶性有机硫醇金（I）配合物，碱金属氰化物，碱金属氢氧化物，硼氢化物还原剂，并且还可以含有稳定剂。化学镀金镀液将黄金表面沉积在基于氰化亚铁氰化物的常规化学镀金浴上几倍。使用有机硫醇金（I）配合物可以消除由于补充而导致的抑制氰离子的积累。

65. 发明授权

US4925491A Solutions and creams for silver plating and polishing 失效
标题翻译：镀银和抛光的解决方案和霜
公开(公告)号：US4925491A
公开(公告)日：1990-05-15
申请号：US24307
申请日：1987-03-10
申请人： Lawrence M. Perovetz , Jack Pickthall, deceased , Terence Pickthall, executor
发明人： Lawrence M. Perovetz , Jack Pickthall, deceased , Terence Pickthall, executor
IPC分类号： C23C18/42 , C23C18/44 , C23F3/00
CPC分类号： C23C18/44 , C23F3/00
摘要： Non-toxic solutions are provided to silver plate metallic items and previously silver plated items. Solutions and creams are also provided which simultaneously silver plate and polish such items. The amount of silver generating compound is selected to either maintain or replenish the amount of silver plating on the items. Solutions are also provided to prevent staining during the silver plating and polishing.

66. 发明授权

US4919720A Electroless gold plating solutions 失效
标题翻译：化学镀金解决方案
公开(公告)号：US4919720A
公开(公告)日：1990-04-24
申请号：US213382
申请日：1988-06-30
申请人： Robert Stavitsky
发明人： Robert Stavitsky
IPC分类号： C23C18/44
CPC分类号： C23C18/44
摘要： Electroless or autocatalytic gold plating solutions having increased stability through the use of a non-aqueous solvent, preferably ethylene glycol, in an amount of between 50 and 100% of the base solution. Also, the excess free cyanide content of this solution can be controlled at optimum levels by periodic additions of a strong inorganic oxidant such as sodium hypochlorite without adversely affecting the other solution components.
摘要翻译：化学镀或自催化金电镀溶液通过使用基础溶液的50至100％之间的非水溶剂，优选乙二醇而具有增加的稳定性。此外，通过定期添加强无机氧化剂如次氯酸钠，可以将该溶液的过量游离氰化物含量控制在最佳水平，而不会对其他溶液成分产生不利影响。

67. 发明授权

US4880464A Electroless gold plating solution 失效
标题翻译：化学镀金液
公开(公告)号：US4880464A
公开(公告)日：1989-11-14
申请号：US143959
申请日：1988-01-14
申请人： Jiro Ushio , Osamu Miyazawa , Hitoshi Yokono , Akira Tomizawa
发明人： Jiro Ushio , Osamu Miyazawa , Hitoshi Yokono , Akira Tomizawa
IPC分类号： C23C18/44
CPC分类号： C23C18/44 , H01L2224/45015 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/73265 , H01L2924/01047 , H01L2924/10253 , Y10T428/12396 , Y10T428/12528 , Y10T428/12611 , Y10T428/12826 , Y10T428/1284 , Y10T428/12889
摘要： An electroless gold plating solution comprising a thiosulfato gold(I) complex, a thiosulfate, thiourea, a pH regulator and a stabilizer. The electroless gold plating solution shows a plating rate and a plating solution stability comparable to those of conventional gold plating solutions containing cyanide ions, and requires a smaller amount of reducing agent to be used therein. Further, the electroless gold plating solution is safe because it does not contain cyanide ions.

68. 发明授权

US4851081A Process for preparing conductive plastic articles 失效
标题翻译：制备导电塑料制品的工艺
公开(公告)号：US4851081A
公开(公告)日：1989-07-25
申请号：US213909
申请日：1988-06-30
申请人： Alex Forschirm
发明人： Alex Forschirm
IPC分类号： C23C18/28 , C08J3/22 , C23C18/16 , C23C18/22 , C23C18/30 , C23C18/36 , C23C18/38 , C23C18/44 , H01B1/22
CPC分类号： H01B1/22 , C08J3/226 , C23C18/1635 , C23C18/1692 , C23C18/208 , C23C18/285 , C23C18/30 , B65G2207/10
摘要： Conductive plastic articles are prepared by forming plastic pellets, etching the pellets in an etching bath, treating the pellets with a palladium-tin catalyst solution and an acidic accelerator, coating the pellets with metal, and heating the coated pellets.

69. 发明授权

US4752536A Metal coated potassium titanate fibers and method for manufacturing the same 失效
标题翻译：金属包覆的钛酸钾纤维及其制造方法
公开(公告)号：US4752536A
公开(公告)日：1988-06-21
申请号：US852737
申请日：1986-04-16
申请人： Tadao Shimizu , Noriyuki Simizu , Shouji Harada , Masami Miyamoto
发明人： Tadao Shimizu , Noriyuki Simizu , Shouji Harada , Masami Miyamoto
IPC分类号： C23C18/44 , C04B41/45 , B21C37/00 , B32B15/00
CPC分类号： C04B41/009 , C04B41/4584 , Y10T428/12424 , Y10T428/12438 , Y10T428/12486 , Y10T428/12611 , Y10T428/12882 , Y10T428/12896 , Y10T428/2933 , Y10T428/294 , Y10T428/2942 , Y10T428/2944 , Y10T428/2958
摘要： A process for producing silver-coated potassium titanate fibers comprises admixing the potassium titanate fibers with a silver ion solution containing a reducing agent. The resulting silver-coated potassium titanate fibers can, if desired, be provided with one or more additional metal coatings superimposed on the silver coat wherein the additional metal is other than silver.
摘要翻译：制备银包覆的钛酸钾纤维的方法包括将钛酸钾纤维与含有还原剂的银离子溶液混合。如果需要，所得到的银包覆的钛酸钾纤维可以具有叠加在银涂层上的一种或多种另外的金属涂层，其中附加金属不是银。

70. 发明授权

US4590115A Metallizing of plastic substrata 失效
标题翻译：金属化塑料基材
公开(公告)号：US4590115A
公开(公告)日：1986-05-20
申请号：US449183
申请日：1982-12-13
申请人： Robert Cassat
发明人： Robert Cassat
IPC分类号： C23C18/16 , C23C18/18 , C23C18/20 , C23C18/30 , C23C18/31 , C23C18/40 , C23C18/44 , C23C18/50 , C25D5/56 , H05K3/18
CPC分类号： C25D5/56 , C23C18/1641 , C23C18/2013 , C23C18/206 , H05K3/188 , Y10T428/24628
摘要： Plastic substrata are metallized, preferably by direct electrolytic metallization, by (i) providing a plastic shaped article comprising intimate admixture of a polymeric resin and a plurality of small metallic filler particles of a non-conductive oxide of a non-noble metal uniformly dispersed therethrough, at least one of the face surfaces of said shaped article having exposed thereon such high density of said metallic filler particles as to provide in step (ii) metallization growth nuclei adapted for direct electrolytic metallization; (ii) next subjecting said at least one face surface of said plastic shaped article to the action of a reducing agent to essentially quantitatively convert the non-conductive metal oxide filler particles to conductive free metal, metallization growth nuclei; and (iii) thence electrochemically and/or electrolytically metallizing the at least one reduced face surface of said plastic shaped article with a free metal deposit.
摘要翻译：通过（i）提供塑料成型制品，其包括聚合物树脂和非均匀分散在其中的非贵金属的非导电氧化物的多个小的金属填料颗粒，包括聚合物树脂的密集混合物，塑性基质金属化，优选通过直接电解金属化所述成形制品的至少一个表面在其上暴露有如此高密度的所述金属填料颗粒，以在步骤（ii）中提供适于直接电解金属化的金属化生长核; （ii）接下来经历所述塑料成型制品的所述至少一个表面表面的还原剂的作用以基本上定量地将非导电金属氧化物填料颗粒转化为导电的游离金属，金属化生长核; 和（iii）然后用游离金属沉积物电化学和/或电解金属化所述塑料成形制品的至少一个还原表面。

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