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    • 77. 发明申请
    • HIGH THERMAL CONDUCTIVITY RESIN COMPOSITION
    • 高热导率树脂组合物
    • US20150252242A1
    • 2015-09-10
    • US14629947
    • 2015-02-24
    • DUPONT MITSUI FLUOROCHEMICALS CO LTD
    • HOAI-NAM PHAMMineyuki NodaOsamu Hayakawa
    • C09K5/14C08K3/38
    • C09K5/14C08K3/38C08K7/00C08K7/18C08K2003/385C08K2201/005C08K2201/014C08K2201/016
    • Provided is a thermoplastic resin composition having excellent thermal conductivity and high electrical insulating properties, and having excellent flexibility in comparison to ceramic molded bodies and thermoset resin compositions. The resin composition contains 20-60 volume percent of thermoplastic resin and 40-80 volume percent of boron nitride. The boron nitride is made up of spherical boron nitride particles and flat boron nitride particles. The spherical boron nitride particles have average particle size of 50-300 μm and aspect ratio or 1-2. The flat boron nitride particles have average particle size of 8-100 μm and aspect ratio of 30-300. The volume ratio of the spherical boron nitride particles with respect to the total amount of boron nitride is 75 vol %-99 vol %. Further provided are melt molded products of this thermoplastic resin composition and a method for the manufacture of such melt molded products.
    • 本发明提供一种热塑性树脂组合物,其具有优异的导热性和高的电绝缘性,与陶瓷成型体和热固性树脂组合物相比具有优异的柔韧性。 树脂组合物含有20-60体积%的热塑性树脂和40-80体积%的氮化硼。 氮化硼由球形氮化硼颗粒和平坦氮化硼颗粒组成。 球形氮化硼颗粒的平均粒径为50-300μm,纵横比为1-2。 平的氮化硼颗粒的平均粒径为8-100μm,纵横比为30-300。 球形氮化硼颗粒相对于氮化硼总量的体积比为75体积%-99体积%。 此外还提供了该热塑性树脂组合物的熔融模制产品和这种熔融模制产品的制造方法。