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    • 72. 发明申请
    • Direct Current Superposition Curing for Resist Reflow Temperature Enhancement
    • 直流电流叠加固化抵抗回流温度增强
    • US20160023238A1
    • 2016-01-28
    • US14340721
    • 2014-07-25
    • Tokyo Electron Limited
    • Nihar MohantyAkiteru KoChi-Chun Liu
    • B05D1/32B05D3/02B05D1/00B05D3/06H01J37/32
    • H01J37/32091B81C1/00428B81C2201/0149G03F7/0002G03F7/40H01L21/0273H01L21/3065H01L21/3086H01L21/31058
    • Techniques herein include methods for curing a layer of material (such as a resist) on a substrate to enable relatively greater heat reflow resistance. Increasing reflow resistance enables successful directed self-assembly of block copolymers. Techniques include receiving a substrate having a patterned photoresist layer and positioning this substrate in a processing chamber of a capacitively coupled plasma system. The patterned photoresist layer is treated with a flux of electrons by coupling negative polarity direct current power to a top electrode of the plasma processing system during plasma processing. The flux of electrons is accelerated from the top electrode with sufficient energy to pass through a plasma and its sheath, and strike the substrate such that the patterned photoresist layer changes in physical properties, which can include an increased glass-liquid transition temperature.
    • 本文的技术包括用于固化衬底上的材料层(例如抗蚀剂)的方法,以使得能够相对更大的耐热回流性。 增加回流电阻使嵌段共聚物成功引导自组装。 技术包括接收具有图案化光致抗蚀剂层的衬底并将该衬底定位在电容耦合等离子体系统的处理室中。 通过在等离子体处理期间将负极性直流电力耦合到等离子体处理系统的顶部电极,用电子束来处理图案化的光致抗蚀剂层。 电子通量从顶部电极以足够的能量被加速以通过等离子体及其鞘,并撞击基板,使得图案化的光致抗蚀剂层的物理性质发生变化,这可能包括玻璃 - 液体转变温度升高。
    • 78. 发明申请
    • METHODS FOR PATTERNING COATINGS
    • 涂料涂抹方法
    • US20150118457A1
    • 2015-04-30
    • US14407480
    • 2013-06-10
    • 3M INNOVATIVE PROPERTIES COMPANY
    • Ranjith DivigalpitiyaMikhail L. PekurovskyShawn C. Dodds
    • B05D1/32G06F3/044H01B13/00
    • B05D1/327G06F3/044G06F2203/04102G06F2203/04103H01B13/0036H01L29/1606Y10T428/24802Y10T428/24893
    • A method of forming an article is provided. The method can include providing a substrate comprising a surface. The method can further include forming a solvent soluble layer on or over the surface of the substrate in a pattern, the pattern defining one or more first portions of the surface that are overlaid by the solvent soluble layer, and one or more second portions of the surface that are free of the solvent soluble layer. The method can further include forming a second layer on or over at least one of the first portions and at least one of the second portions, wherein the step of forming the second layer includes buffing an exfoliatable material on or over at least one of the first portions and at least one of the second portions. The method can further include removing the solvent soluble layer by applying a solvent to the substrate.
    • 提供了一种形成物品的方法。 该方法可以包括提供包括表面的基底。 所述方法还可以包括以图案形式在基材表面上或上方形成溶剂可溶层,所述图案限定由溶剂可溶层覆盖的表面的一个或多个第一部分,以及所述表面的一个或多个第二部分 表面没有溶剂可溶层。 该方法还可以包括在第一部分和第二部分中的至少一个上至少一个上形成第二层,其中形成第二层的步骤包括在第一部分和/或第二部分中的至少一个上或之上抛光可剥离材料 部分和至少一个第二部分。 该方法还可以包括通过向基材施加溶剂来除去溶剂可溶层。