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71. 发明授权

US10855055B2 VCSEL array with common wafer level integrated optical device 有权
公开(公告)号：US10855055B2
公开(公告)日：2020-12-01
申请号：US16796959
申请日：2020-02-21
申请人： TRUMPF Photonic Components GmbH
发明人： Pascal Jean Henri Bloemen , Stephan Gronenborn
IPC分类号： H01S5/18 , H01S5/183 , G01S7/481 , H01S5/022 , H01S5/026 , H01S5/42
摘要： A VCSEL array has VCSELs on a semiconductor substrate and has a prismatic or Fresnel optical structure, which is arranged to transform laser light to provide a continuous illumination pattern in a reference plane. The optical structure increases a size of the illumination pattern in comparison to an untransformed illumination pattern. The optical structure is arranged such that each VCSEL illuminates a sector of the pattern. Sub-surfaces of the optical structure with different height above the semiconductor substrate are arranged next to each other. Each VCSEL is associated with a sub-surface. A distance between each VCSEL and a size of its sub-surface is arranged such that the VCSEL illuminates only a part of the sub-surface without illuminating one of the steps. The VCSEL array has an array of microlenses, each VCSEL being associated with a microlens arranged to collimate the laser light after traversing the optical structure.

72. 发明授权

US10833479B2 Light-emitting element and method for manufacturing the same 有权
公开(公告)号：US10833479B2
公开(公告)日：2020-11-10
申请号：US16173226
申请日：2018-10-29
申请人： Sony Corporation
发明人： Tomoyuki Oki , Yuji Masui , Yoshinori Yamauchi , Rintaro Koda , Takahiro Arakida
IPC分类号： H01S5/00 , H01S5/183 , H01S5/22 , H01S5/343 , H01S5/223 , H01S5/187 , H01S5/022 , B82Y20/00 , H01S5/042 , H01S5/18 , H01S5/125
摘要： A light-emitting element includes a mesa structure in which a first compound semiconductor layer of a first conductivity type, an active layer, and a second compound semiconductor layer of a second conductivity type are disposed in that order, wherein at least one of the first compound semiconductor layer and the second compound semiconductor layer has a current constriction region surrounded by an insulation region extending inward from a sidewall portion of the mesa structure; a wall structure disposed so as to surround the mesa structure; at least one bridge structure connecting the mesa structure and the wall structure, the wall structure and the bridge structure each having the same layer structure as the portion of the mesa structure in which the insulation region is provided; a first electrode; and a second electrode disposed on a top face of the wall structure.

73. 发明授权

US10814662B2 Laminate, personal verification medium, and method of producing the laminate 有权
公开(公告)号：US10814662B2
公开(公告)日：2020-10-27
申请号：US16154228
申请日：2018-10-08
申请人： TOPPAN PRINTING CO., LTD.
发明人： Naoki Minamikawa
IPC分类号： B32B3/00 , B42D25/328 , B32B7/02 , G02B5/18 , B42D25/45 , B23K26/00 , B32B27/08 , H01S5/18
摘要： A laminate includes a diffraction layer that is optically transmissive and includes a diffraction part with a plurality of diffraction units being repetition of a diffraction unit in a direction extending the diffraction layer, each diffraction unit including at least one diffraction element with a reflective diffraction grating; and an absorption layer that is optically transmissive with a plurality of absorption parts for at least part of visible light, the absorption layer facing the diffraction layer with light passing between the diffraction layer and the absorption layer. The laminate has an observation side opposite where the diffraction layer faces the absorption layer; the diffraction layer has a surface serving as a front surface opposite to the surface facing the absorption layer; and in plan view perpendicular to the front surface of the diffraction layer, each of the absorption parts aligns with one of the diffraction elements.

74. 发明申请

US20200251887A1 SURFACE-EMITTING LASER AND METHOD FOR MANUFACTURING SURFACE-EMITTING LASER 审中-公开
公开(公告)号：US20200251887A1
公开(公告)日：2020-08-06
申请号：US16488595
申请日：2018-02-27
申请人： KYOTO UNIVERSITY , STANLEY ELECTRIC CO., LTD.
发明人： Susumu NODA , Yoshinori TANAKA , Menaka DE ZOYSA , Junichi SONODA , Tomoaki KOIZUMI , Kei EMOTO
IPC分类号： H01S5/22 , H01S5/18 , H01S5/32
摘要： A method for manufacturing a surface emitting laser made of a group-III nitride semiconductor by an MOVPE method includes: (a) of growing a first cladding layer of a first conductive type on a substrate; (b) of growing a first optical guide layer of the first conductive type on the first cladding layer; (c) of forming holes having a two-dimensional periodicity in a plane parallel to the first optical guide layer, in the first optical guide layer by etching; (d) supplying a gas containing a group-III material and a nitrogen source and performing growth to form recessed portions having a facet of a predetermined plane direction above openings of the holes, thereby closing the openings of the holes; and (e) of planarizing the recessed portions by mass transport, after the openings of the holes have been closed, wherein after said the planarizing, at least one side surface of the holes is a {10-10} facet.

75. 发明授权

US10714898B2 Semiconductor light emitting element 有权
公开(公告)号：US10714898B2
公开(公告)日：2020-07-14
申请号：US16377321
申请日：2019-04-08
申请人： HAMAMATSU PHOTONICS K.K.
发明人： Takeshi Kanzaki , Hiroki Miyachi , Ryoichi Kashiro
IPC分类号： H01S5/18 , H01S5/42
摘要： The present semiconductor light emitting element is a semiconductor light emitting element including an active layer, an upper cladding layer and a lower cladding layer that sandwich the active layer, and a phase modulation layer optically coupled to the active layer, in which the phase modulation layer includes a basic layer and a plurality of different refractive index regions that are different in refractive index from the basic layer, and the plurality of different refractive index regions are disposed so as to form a pattern in a region outside a light line on a reciprocal lattice space in the phase modulation layer.

76. 发明授权

US10680411B2 Laser sensor module 有权
公开(公告)号：US10680411B2
公开(公告)日：2020-06-09
申请号：US15536905
申请日：2015-12-11
申请人： PHILIPS PHOTONICS GMBH
发明人： Holger Moench , Alexander Marc Van Der Lee , Stephan Gronenborn
IPC分类号： H01S5/18 , H01S5/183 , H01S5/062 , H01S5/42 , G01S7/4865 , G01S17/10 , H01S5/024 , H01S5/042 , H01S5/14
摘要： The invention describes a laser sensor module comprising at least one Vertical Cavity Surface Emitting Laser (100) and at least one driving circuit (120). The driving circuit (120) is adapted to provide electrical energy to the Vertical Cavity Surface Emitting Laser (100) such that the Vertical Cavity Surface Emitting Laser (100) emits laser pulses (345) with a pulse length (356) of less than 100 ns and a duty cycle of less than 5% in comparison to a continuous laser emission. The driving circuit (120) is further adapted to provide additional energy to the Vertical Cavity Surface Emitting Laser (100) at least 100 ns prior to at least a part of the laser pulses (345) such that the part of the laser pulses (345) are emitted under defined optical conditions. The invention further describes a distance detection device comprising the laser sensor module and a method of driving the laser sensor module. The additional energy is preferably provided by means of a current pre-pulse (335) which is applied to the V(E)CSEL prior to preferably each laser pulse (345). The current pre-pulse is preferably arranged such that no laser light is emitted by means of the V(E)CSEL. The V(E)CSEL are enabled to emit the laser pulses (345) under defined optical conditions such that the time of emission and the pulse shape of the laser pulses (345) is well defined. Well defined time of emission and the pulse shape of the laser pulses (345) enable a reliable detection of reflected laser light (117) which corresponds to the emission of the respective laser pulse (345).

77. 发明授权

US10657994B1 Horizontal cavity surface emitting laser integration features for heat assisted magnetic recording 有权
公开(公告)号：US10657994B1
公开(公告)日：2020-05-19
申请号：US16220453
申请日：2018-12-14
申请人： Seagate Technology LLC
发明人： Roger L. Hipwell, Jr. , Scott Eugene Olson
IPC分类号： G11B11/105 , G11B5/48 , G11B5/105 , G11B5/10 , H01S5/022 , H01S5/024 , H01S5/18 , H01S5/10 , H01S5/00 , G11B5/00 , G11B5/60
摘要： A folded lasing cavity comprises at least one bend. The folded lasing cavity is disposed on and configured to emit light along a substrate-parallel plane. An etched facet is on an emitting end of the folded lasing cavity and an etched mirror is on another end of the folding lasing cavity. An etched shaping mirror redirects light received from the etched facet in a direction normal to the substrate-parallel plane.

78. 发明申请

US20200021081A1 OPTICAL MODULE 审中-公开
公开(公告)号：US20200021081A1
公开(公告)日：2020-01-16
申请号：US16539285
申请日：2019-08-13
申请人： Hisense Broadband Multimedia Technologies Co., Ltd.
发明人： Xuxia LIU , Yan ZHONG
IPC分类号： H01S5/022 , H04B10/40 , H04B10/50 , H01S5/18 , H04B10/25 , G02B6/42 , G02B6/32
摘要： An optical module includes a circuit board, an optical fiber, an optical fiber monitoring chip, a laser chip, a laser driving chip and a lens assembly. A bottom surface of the lens assembly is covered above the laser chip and the optical monitoring chip. A groove is on a top surface of the lens assembly. A bottom of the groove protrudes to form a first interface and a second interface. The laser chip is configured to emit light. The first interface is configured to reflect the emitted light to obtain first reflected light. The second interface is configured to reflect a portion of the first reflected light to obtain a second reflected light and refract another portion of the first reflected light to obtain a first refracted light. The second reflected light is transmitted to the optical monitoring chip. The first refracted light is transmitted to the optical fiber.

79. 发明授权

US10461502B2 Two-dimensional photonic crystal surface emitting laser and method of manufacturing the same 有权
公开(公告)号：US10461502B2
公开(公告)日：2019-10-29
申请号：US16080480
申请日：2017-02-24
申请人： KYOTO UNIVERSITY , ROHM CO., LTD. , HAMAMATSU PHOTONICS K.K. , MITSUBISHI ELECTRIC CORPORATION
发明人： Susumu Noda , Yoshinori Tanaka , Menaka De Zoysa
IPC分类号： H01S5/00 , H01S5/10 , H01S5/18 , H01S5/20 , H01S5/183 , H01S5/042 , H01S5/343 , H01S5/323
摘要： A two-dimensional photonic crystal surface emitting laser has, in a plate-shaped base body, a two-dimensional photonic crystal layer in which modified refractive index region pairs are periodically arranged and an active layer provided on one side of the base body, each of the modified refractive index region pairs including a first modified refractive index region and a second modified refractive index region having refractive indexes different from a refractive index of the base body, wherein an area of a planar shape of the first modified refractive index region is larger than or equal to an area of a planar shape of the second modified refractive index region, and a thickness of the first modified refractive index region is smaller than a thickness of the second modified refractive index region.

80. 发明授权

US10459163B2 Photonic chip with folding of optical path and integrated collimation structure 有权
公开(公告)号：US10459163B2
公开(公告)日：2019-10-29
申请号：US16202682
申请日：2018-11-28
申请人： COMMISSARIAT À L'ÉNERGIE ATOMIQUE ET AUX ÉNERGIES ALTERNATIVES
发明人： Sylvie Menezo , Salim Boutami , Bruno Mourey
IPC分类号： G02B6/13 , H01S5/18 , G02B6/124 , G02B6/30 , G02B6/42 , G02B6/12 , G02B6/136
摘要： A photonic chip comprising a light guiding layer supported by a substrate and covered with an encapsulation layer. The chip has a front face on the side of the encapsulation layer and a back face on the side of the substrate. The light guiding layer includes a light guiding structure optically coupled to a vertical coupler configured to receive light from the waveguide and to form a light beam directed towards either the front face or the back face. The chip also comprises a collimation structure formed at least partly in the light guiding layer and an arrangement of one or several reflecting structures each on either the front face or on the back face. This arrangement is made so as to assure propagation of light between the vertical coupler and the collimation structure along an optical path with at least one fold.

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