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1. 发明申请

US20230139279A1 LIGHT EMITTING ELEMENT 有权
公开(公告)号：US20230139279A1
公开(公告)日：2023-05-04
申请号：US17789875
申请日：2020-12-07
申请人： Sony Group Corporation
发明人： Tatsushi HAMAGUCHI , Mikihiro YOKOZEKI , Rintaro KODA
IPC分类号： H01S5/06 , H01S5/183 , H01S5/024 , H01S5/42 , H01S5/343
摘要： A light emitting element (10A) of the present disclosure includes: a stacked structure (20) in which a first compound semiconductor layer (21) having a first surface (21a) and a second surface (21b), an active layer (23), and a second compound semiconductor layer (22) having a first surface (22a) and a second surface (22b) are stacked; a first light reflecting layer (41) formed on a first surface side of the first compound semiconductor layer (21) and having a convex shape in a direction away from the active layer (23); and a second light reflecting layer (42) formed on a second surface side of the second compound semiconductor layer (22) and having a flat shape, in which a partition wall (24) extending in a stacking direction of the stacked structure (20) is formed so as to surround the first light reflecting layer (41).

2. 发明授权

US11641092B2 High-power laser packaging utilizing carbon nanotubes between metallic bonding materials 有权
公开(公告)号：US11641092B2
公开(公告)日：2023-05-02
申请号：US17173337
申请日：2021-02-11
申请人： TERADIODE, INC.
发明人： Won Tae Lee , Michael Deutsch , Zhongyong Liu
IPC分类号： G02B5/18 , G02B7/18 , G02B27/44 , H01S5/0237 , H01S5/024 , H01S5/40 , H01S5/14 , H01S5/0236 , H01S5/02345
摘要： In various embodiments, laser devices include a thermal bonding layer featuring an array of carbon nanotubes and at least one metallic thermal bonding material.

3. 发明授权

US11631966B2 Beam combining device and beam combining method for Bragg grating external-cavity laser module 有权
公开(公告)号：US11631966B2
公开(公告)日：2023-04-18
申请号：US17622964
申请日：2020-05-29
申请人： Suzhou Everbright Photonics Co., Ltd. , Everbright Institute of Semiconductor Photonics Co., Ltd.
发明人： Hao Yu , Shujuan Sun , Jun Wang , Huadong Pan , Dayong Min
IPC分类号： H01S5/14 , H01S5/065 , H01S5/02251 , H01S5/024 , H01S5/40
摘要： A beam combining device and method for a Bragg grating external-cavity laser module has a plurality of side by side light-emitting modules that use a Bragg grating to perform wavelength locking. Output light of the modules is incident to a beam combining element after passing through a focusing optical element for beam combining, and light subjected to beam combining is reflected partially and transmitted partially under the effect of a light splitting element. A part is incident into a dispersion element at a diffraction angle of the element. Parallel light is formed under the effect of a conversion optical element. Spots of the light beams of corresponding wavelengths of the light-emitting modules are formed on an image acquisition mechanism. Whether the wavelengths of the corresponding light-emitting modules are locked is determined by whether there is a deviation between preset spots and spots formed by the module on the acquisition mechanism.

4. 发明授权

US11621540B2 High powered laser electronics 有权
公开(公告)号：US11621540B2
公开(公告)日：2023-04-04
申请号：US17197903
申请日：2021-03-10
申请人： IPG Photonics Corporation
发明人： Adam Pinard , Wolf Fuchs , Keith Millea , Oleg Shkurikhin
IPC分类号： H01S3/13 , H01S5/068 , H01S5/40 , H01S5/042 , H01S5/024 , H01S3/11 , H01S5/022
摘要： A laser system comprising high voltage AC-to-DC power converter and one or more current sources coupled to the high voltage AC-to-DC power converter without a DC-to-DC converter between the one or more current sources and the AC-to-DC power source. Each of the one or more current sources includes a high voltage switch and one or more independent safety shutoffs. A laser module is operably coupled to the one or more current source and configured to emit electromagnetic radiation wherein the one or more safety shutoffs are configured to disable emission of electromagnetic radiation from the laser module when triggered.

5. 发明申请

US20230102369A1 LASER MODULE 有权
公开(公告)号：US20230102369A1
公开(公告)日：2023-03-30
申请号：US18061498
申请日：2022-12-05
申请人： Panasonic Intellectual Property Management Co., Ltd.
发明人： Kouji OOMORI , Masahiro TADA , Takafumi UCHIDA , Ayako IWASAWA , Fumiya MURAO
IPC分类号： H01S5/024 , H01S5/02315
摘要： First block (10) includes internal flow path (15). A cooling medium flows inside internal flow path (15). Curved part (56) is provided at a corner between bottom surface (54) and side wall surface (55) of internal flow path (15). Curved part (56) is continuously connected to bottom surface (54) and side wall surface (55) of internal flow path (15) and has a curved shape.

6. 发明申请

US20230099138A1 SEEBECK DEVICE IN A LASER SYSTEM 有权
公开(公告)号：US20230099138A1
公开(公告)日：2023-03-30
申请号：US17955130
申请日：2022-09-28
申请人： Applied Research Associates, Inc.
发明人： Joseph N. Paranto , Aaron Majdali
IPC分类号： H01S5/024
摘要： A thermoelectric device and method of use thereof are provided for cooling and powering a laser device. The thermoelectric device comprises a first side, a second side, and a plurality of thermoelectric elements disposed therebetween. The thermoelectric device engages a photodiode array of the laser device, such that when heat is generated by the photodiode array, the thermoelectric device passively cools the photodiode array by receiving the heat and converts the heat generated to electricity to power the laser device.

7. 发明授权

US11611192B2 Embedded microfluidic distribution apparatus for passively cooling optoelectronic devices 有权
公开(公告)号：US11611192B2
公开(公告)日：2023-03-21
申请号：US16844904
申请日：2020-04-09
申请人： Accelsius, LLC
发明人： Raffaele Luca Amalfi , Stefano Grillanda
IPC分类号： H01S5/024 , H01S3/106 , F28D15/04 , F28F3/12
摘要： A device and method are provided for more efficient thermal management of optoelectronic devices. A microfluidic distribution apparatus embedded with the optoelectronic device uses a working fluid in phase change to passively remove heat from an optoelectronic device. The working fluid undergoes phase change through various conversions between a liquid state and a two-phase liquid-vapor state to facilitate evaporation and condensation processes as the working fluid is distributed through micro-structures in the embedded microfluidic distribution apparatus. Passive two-phase cooling provides high thermal performance due to the use of the latent heat of a fluid in phase change, as well as the presence of favorable two-phase flow regimes at micro-scale dimensions.

8. 发明授权

US11605936B2 Light-emitting device, optical device, and information processing apparatus 有权
公开(公告)号：US11605936B2
公开(公告)日：2023-03-14
申请号：US16953297
申请日：2020-11-19
申请人： FUJIFILM Business Innovation Corp.
发明人： Daisuke Iguchi
IPC分类号： H01S5/00 , H01S5/42 , H01S5/183 , H01S5/042 , H01S5/02345 , H01S5/024 , H01S5/30
摘要： A light-emitting device includes an insulating base member having thermal conductivity of 10 W/m·K or more; a light-emitting element that has a cathode electrode and an anode electrode and is provided on a front surface side of the base member; a capacitive element that is provided on the base member and supplies an electric current to the light-emitting element; and a reference potential wire that is provided on a rear surface side of the base member and is connected to an external reference potential. The reference potential wire is connected to the capacitive element and is insulated from the cathode electrode and the anode electrode.

9. 发明授权

US11605933B2 Semiconductor lasers and processes for the planarization of semiconductor lasers 有权
公开(公告)号：US11605933B2
公开(公告)日：2023-03-14
申请号：US16678535
申请日：2019-11-08
申请人： MACOM Technology Solutions Holdings, Inc.
发明人： Ali Badar Alamin Dow , Jason Daniel Bowker , Malcolm R. Green
IPC分类号： H01S5/10 , H01S5/223 , H01L21/67 , H01S5/028 , H01L21/3105 , H01L21/68 , H01S5/22 , H01S5/024 , H01S5/042 , C23C14/30 , H01S5/00 , H01S5/02 , H01S5/343
摘要： A laser structure may include a substrate, an active region arranged on the substrate, and a waveguide arranged on the active region. The waveguide may include a first surface and a second surface that join to form a first angle relative to the active region. A material may be deposited on the first surface and the second surface of the waveguide.

10. 发明申请

US20230072275A1 LIGHT EMISSION MODULE 有权
公开(公告)号：US20230072275A1
公开(公告)日：2023-03-09
申请号：US17799255
申请日：2021-02-10
申请人： NICHIA CORPORATION
发明人： Takafumi SUGIYAMA , Kaname SAITO , Takashi NAMIE , Takuya SUZUKI
IPC分类号： H01S5/02315 , H01S5/024 , H01S5/02255 , H01S5/0239
摘要： A light emission module includes a first light emission unit that includes a first light emission device and emits first light. The first light emission device includes a plurality of first light emission portions, each including a light emission surface, where light from a plurality of first light emission elements is emitted, a heat dissipation surface provided opposite to the light emission surface, and a connection portion being positioned between the light emission surface and the heat dissipation surface and including a wiring mounting surface where the light emission elements are electrically connected. The light emission module further includes a first optical member that reflects the first light, a housing including a base member where the first light emission unit and the first optical member are disposed and a lid member surrounding the light emission device surrounding the first light emission unit and the first optical member that are disposed on the base member, and a heat sink being connected to the heat dissipation surface and including a mounting surface where the first light emission device is mounted. The wiring mounting surface extends upward upper than a first upper surface of the housing, and a portion of the wiring mounting surface is exposed to the outside of the housing.

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