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81. 发明授权

US08994046B2 Light emitting diode device for clamping electrically conductive element 有权
标题翻译：用于夹紧导电元件的发光二极管器件
公开(公告)号：US08994046B2
公开(公告)日：2015-03-31
申请号：US12275431
申请日：2008-11-21
申请人： Shang-Lin Chen , Chih-Hung Hsu
发明人： Shang-Lin Chen , Chih-Hung Hsu
IPC分类号： H01L33/00 , H01L33/62
CPC分类号： H01L33/62 , H01L2224/48091 , H01L2224/48247 , H01L2924/00014 , H01L2924/0002 , H01L2924/00
摘要： A light emitting diode (LED) device comprises a first lead frame, a second lead frame, a LED die and at least one bump. The LED die is fixed on and electrically connected to the first lead frame. The second lead frame separated from the first lead frame with a distance is connected to the LED die. The bump disposed on at least one of the first lead frame and the second lead frame to identify a gripping space for allowing an electronic element inserted or gripped therein.
摘要翻译：发光二极管（LED）装置包括第一引线框架，第二引线框架，LED管芯和至少一个凸块。 LED管芯固定在电连接到第一引线框架上。与第一引线框架隔开一定距离的第二引线框架连接到LED管芯。所述凸起设置在所述第一引线框架和所述第二引线框架中的至少一个上，以识别用于允许插入或夹持在其中的电子元件的夹持空间。

82. 发明申请

US20140239321A1 Lighting Device, Backlight Module And Illumination Module 有权
标题翻译：照明设备，背光模块和照明模块
公开(公告)号：US20140239321A1
公开(公告)日：2014-08-28
申请号：US14190604
申请日：2014-02-26
申请人： Everlight Electronics Co., Ltd.
发明人： Yi-Hsin Lu , Yi-Hsiang Lin , Po Yu Chen
IPC分类号： H01L27/15 , H01L25/16
CPC分类号： H01L25/167 , H01L25/0753 , H01L33/486 , H01L33/62 , H01L2224/48137
摘要： Various examples of a lighting device, backlight module and illumination module are described. A lighting device includes a carrier component, an LED chip, a thermistor, and a plurality of metal wires. The carrier component includes a plurality of electrodes. The LED chip and the thermistor are disposed on the carrier component and electrically coupled to each other. The plurality of metal wires form a circuit with the plurality of electrodes, the LED chip, and the thermistor. The thermistor has dimensions in chip-level scale when viewed from the top of the lighting device. A backlight module includes the aforementioned lighting device. An illumination module includes the aforementioned lighting device and a driver which is electrically coupled to the lighting device.
摘要翻译：描述照明装置，背光模块和照明模块的各种示例。照明装置包括载体部件，LED芯片，热敏电阻和多个金属线。载体部件包括多个电极。 LED芯片和热敏电阻设置在载体部件上并彼此电耦合。多个金属线与多个电极，LED芯片和热敏电阻形成电路。当从照明装置的顶部观察时，热敏电阻具有芯片级尺寸。背光模块包括上述照明装置。照明模块包括上述照明装置和电耦合到照明装置的驱动器。

83. 发明授权

US08796713B2 Light emitting diode package structure and manufacturing method thereof 有权
标题翻译：发光二极管封装结构及其制造方法
公开(公告)号：US08796713B2
公开(公告)日：2014-08-05
申请号：US13172175
申请日：2011-06-29
申请人： Hsien Chia Lin
发明人： Hsien Chia Lin
IPC分类号： H01L33/50 , H01L33/62 , H01L33/48 , H01L25/075
CPC分类号： H01L33/62 , H01L25/0753 , H01L33/486 , H01L33/504 , H01L33/507 , H01L2224/48091 , H01L2224/48227 , H01L2224/48465 , H01L2924/01322 , H01L2924/09701 , H01L2933/0066 , H01L2924/00014 , H01L2924/00
摘要： An LED package structure comprises a substrate, a first electrically conductive pattern, a second electrically conductive pattern, at least one electrically conductive element, and an LED chip. The substrate has a first surface and a second surface opposite to the first surface. The first electrically conductive pattern is disposed on the first surface. The second electrically conductive pattern is disposed on the second surface. The at least one electrically conductive element traverses the fluorescent substrate and connects the first and second electrically conductive patterns. The LED chip is disposed on the second surface and has a light extraction surface that connects the second electrically conductive pattern. The LED chip is electrically coupled to the first electrically conductive pattern via the at least one electrically conductive element.
摘要翻译： LED封装结构包括衬底，第一导电图案，第二导电图案，至少一个导电元件和LED芯片。基板具有与第一表面相对的第一表面和第二表面。第一导电图案设置在第一表面上。第二导电图案设置在第二表面上。所述至少一个导电元件横穿所述荧光基板并且连接所述第一和第二导电图案。 LED芯片设置在第二表面上并且具有连接第二导电图案的光提取表面。 LED芯片经由至少一个导电元件电耦合到第一导电图案。

84. 发明授权

US08662950B2 White-light emitting device and preparation method and application of the same 有权
标题翻译：白光发射装置及其制备方法及应用相同
公开(公告)号：US08662950B2
公开(公告)日：2014-03-04
申请号：US13651069
申请日：2012-10-12
申请人： Yi-Jung Chen , Chih-Chieh Yang , Chin-Chang Shen , Ru-Shi Liu
发明人： Yi-Jung Chen , Chih-Chieh Yang , Chin-Chang Shen , Ru-Shi Liu
IPC分类号： H01L51/56 , H01L51/54
CPC分类号： C09K11/06 , C09K11/7733 , C09K11/7734 , C09K2211/1044 , C09K2211/188 , H01L33/502 , H01L33/504 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2224/49107 , H05B33/14 , Y02B20/181 , H01L2924/00014
摘要： A white-light emitting device and its preparation method are provided. The white-light emitting device comprises an ultraviolet (UV) light emitting diode (LED) chip, a first phosphor, and a second phosphor, wherein the UV LED chip generates a first radiation; the first phosphor is composed of Zn(C3N2H4)2 powder and is excited by the first radiation to generate a second radiation; and the second phosphor is excited by the first radiation and/or the second radiation to generate a third radiation. The third radiation is then mixed with the first radiation and/or the second radiation to generate a white light.
摘要翻译：提供了一种白光发射装置及其制备方法。白光发射装置包括紫外（UV）发光二极管（LED）芯片，第一荧光体和第二荧光体，其中UV LED芯片产生第一辐射; 第一荧光体由Zn（C 3 N 2 H 4）2粉末组成，并被第一辐射激发以产生第二辐射; 并且第二荧光体被第一辐射和/或第二辐射激发以产生第三辐射。然后将第三辐射与第一辐射和/或第二辐射混合以产生白光。

85. 发明申请

US20130272001A1 Recessed Lamp Housing With Adjustable Spring Clipping Device 有权
标题翻译：带可调弹簧夹装置的嵌入式灯座
公开(公告)号：US20130272001A1
公开(公告)日：2013-10-17
申请号：US13650450
申请日：2012-10-12
申请人： Li-Ciang Lyu , Chung Jung Chen
发明人： Li-Ciang Lyu , Chung Jung Chen
IPC分类号： F21V21/04
CPC分类号： F21V21/04 , F21S8/026 , F21V21/049
摘要： A downlight that can be easily installed into and dismounted from a ceiling is provided. The housing of the downlight includes an adjustable spring clipping device. Utilization of the adjustable spring clipping device saves a user from having to spend much effort on installation or dismounting of the downlight, and allows installation and dismounting of the downlight to be easily and conveniently performed.
摘要翻译：提供了可以轻松地安装在天花板上或从天花板上拆下的筒灯。筒灯的外壳包括一个可调弹簧夹持装置。可调节弹簧夹持装置的利用使得用户不必花费大量的精力来安装或拆卸筒灯，并且允许安装和拆卸筒灯以容易且方便地执行。

86. 发明授权

US08513820B2 Package substrate structure and chip package structure and manufacturing process thereof 有权
标题翻译：封装衬底结构及芯片封装结构及其制造工艺
公开(公告)号：US08513820B2
公开(公告)日：2013-08-20
申请号：US12691722
申请日：2010-01-21
申请人： Wen-Chieh Tsou
发明人： Wen-Chieh Tsou
IPC分类号： H01L23/28
CPC分类号： H01L21/565 , H01L21/561 , H01L23/3121 , H01L24/48 , H01L24/97 , H01L2224/48227 , H01L2224/97 , H01L2924/00014 , H01L2924/14 , H01L2924/181 , H01L2924/00 , H01L2224/85 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A chip package structure includes a substrate, chips and an elastic element. The substrate has a first surface, a second surface, a first patterned metal layer on the first surface and a second patterned metal layer on the second surface, wherein the substrate is suitable for being clipped between an upper mold chase and a lower mold chase of a package mold. The chips are disposed on the first surface, wherein the chips are suitable for being contained in containing spaces defined by the upper mold chase and the substrate. The elastic element is disposed on the second surface and surrounds the second patterned metal layer, wherein the elastic element is suitable for contacting the lower mold chase and is located between the lower mold chase and the substrate. In addition, a manufacturing process of the chip package and a package substrate structure are also provided.
摘要翻译：芯片封装结构包括衬底，芯片和弹性元件。衬底具有第一表面，第二表面，第一表面上的第一图案化金属层和第二表面上的第二图案化金属层，其中所述基底适于被夹在上模追逐和下模追逐之间包装模具。芯片设置在第一表面上，其中芯片适于容纳在由上模具和基板限定的容纳空间中。弹性元件设置在第二表面上并且围绕第二图案化金属层，其中弹性元件适于接触下模具追逐并且位于下模具走向与基板之间。此外，还提供了芯片封装的制造工艺和封装衬底结构。

87. 发明授权

US08497523B2 Light emitting diode package 有权
标题翻译：发光二极管封装
公开(公告)号：US08497523B2
公开(公告)日：2013-07-30
申请号：US13545000
申请日：2012-07-10
申请人： Yi-Wen Chen
发明人： Yi-Wen Chen
IPC分类号： H01L33/00
CPC分类号： H01L25/167 , H01L23/60 , H01L33/483 , H01L2224/48091 , H01L2224/48227 , H01L2224/49107 , H01L2924/12032 , H01L2924/3025 , H01L2924/00014 , H01L2924/00
摘要： A light emitting diode (LED) package including a carrier, a housing, at least one LED chip and at least one electrostatic discharge protector (ESD protector) is provided. The housing encapsulating a portion of the carrier has at least one first opening, at least one second opening and a barricade. The barricade separates the first opening from the second opening. The first opening and the second opening expose a first surface of the carrier. The LED chip is disposed on the first surface of the carrier, located in the first opening, and electrically connected to the carrier. The ESD protector is disposed on the first surface of the carrier, located in the second opening, and electrically connected to the carrier.
摘要翻译：提供了包括载体，壳体，至少一个LED芯片和至少一个静电放电保护器（ESD保护器）的发光二极管（LED）封装。封装载体的一部分的壳体具有至少一个第一开口，至少一个第二开口和路障。路障将第一个开口与第二个开口分开。第一开口和第二开口暴露载体的第一表面。 LED芯片设置在载体的第一表面上，位于第一开口中，并与载体电连接。 ESD保护器设置在载体的位于第二开口中的第一表面上，并电连接到载体上。

88. 发明授权

US08492777B2 Light emitting diode package, lighting device and light emitting diode package substrate 有权
标题翻译：发光二极管封装，照明器件和发光二极管封装衬底
公开(公告)号：US08492777B2
公开(公告)日：2013-07-23
申请号：US13078933
申请日：2011-04-02
申请人： Chung-Chuan Hsieh , Yi-Chun Chen , Yi-Ting Chiu
发明人： Chung-Chuan Hsieh , Yi-Chun Chen , Yi-Ting Chiu
IPC分类号： H01L33/00
CPC分类号： H01L25/0753 , H01L33/486 , H01L33/62 , H01L2224/48091 , H01L2924/00014 , H01L2924/00
摘要： A light emitting diode (LED) package includes a LED package substrate, first LED chips and second LED chips. The LED package substrate includes a substrate, a first bonding pad, second bonding pads and a third bonding pad. The first, second and third bonding pads are disposed on the substrate. The second bonding pads are arranged in an array. The first and third bonding pads are located adjacent respectively to first and last column of the array. The first LED chips are die-bonded on the first bonding pad and wire-bonded respectively to the second bonding pads arranged in first column of the array. The second LED chips are die-bonded on the second bonding pads respectively. In each row except last column, each second LED chip is wire-bonded to the second bonding pad arranged in next column. The second LED chips located in last column are wire-bonded to the third bonding pad.
摘要翻译：发光二极管（LED）封装包括LED封装基板，第一LED芯片和第二LED芯片。 LED封装衬底包括衬底，第一焊盘，第二接合焊盘和第三接合焊盘。第一，第二和第三接合焊盘设置在基板上。第二接合焊盘被布置成阵列。第一和第三接合焊盘分别位于阵列的第一列和最后一列。第一LED芯片在第一焊盘上被芯片焊接并分别引线接合到布置在阵列的第一列中的第二焊盘。第二LED芯片分别在第二焊盘上进行裸片焊接。在除了最后一列之外的每行中，每个第二LED芯片被引线键合到布置在下一列中的第二焊盘。位于最后一列的第二LED芯片被引线接合到第三焊盘。

89. 发明授权

US08431948B2 Light emitting diode package and fabrication method thereof 有权
标题翻译：发光二极管封装及其制造方法
公开(公告)号：US08431948B2
公开(公告)日：2013-04-30
申请号：US13414555
申请日：2012-03-07
申请人： Yu-Huan Liu
发明人： Yu-Huan Liu
IPC分类号： H01L33/00
CPC分类号： H01L33/486 , H01L33/62 , H01L33/642 , H01L2224/48091 , H01L2224/48247 , H01L2924/00014
摘要： A light emitting diode package and a fabrication method thereof are provided. The light emitting diode package comprises a lead frame, having a frame body and a conductive layer covering the frame body. A reflector has a first portion and a second portion sandwiching the lead frame, wherein the first portion has a depression to expose the lead frame, and a light emitting diode chip is disposed on the lead frame in the depression. The fabrication method comprises forming a frame body and forming a conductive layer covering the frame body to form a lead frame. A first portion and a second portion of a reflector are formed to sandwich the lead frame, wherein the first portion has a depression to expose the lead frame. A light emitting diode chip is disposed on the lead frame in the depression.
摘要翻译：提供一种发光二极管封装及其制造方法。发光二极管封装包括引线框架，其具有框体和覆盖框体的导电层。反射器具有夹着引线框架的第一部分和第二部分，其中第一部分具有凹陷以暴露引线框架，并且发光二极管芯片设置在凹陷中的引线框架上。该制造方法包括：形成框体并形成覆盖框体的导电层，以形成引线框架。形成反射器的第一部分和第二部分以夹住引线框架，其中第一部分具有凹陷以暴露引线框架。发光二极管芯片设置在凹陷中的引线框架上。

90. 发明授权

US08378358B2 Light emitting device 有权
标题翻译：发光装置
公开(公告)号：US08378358B2
公开(公告)日：2013-02-19
申请号：US12851556
申请日：2010-08-06
申请人： Hsin-Chang Tsai , Chia-Hao Liang , Jen-Ta Chiang
发明人： Hsin-Chang Tsai , Chia-Hao Liang , Jen-Ta Chiang
IPC分类号： H01L27/15 , H01L31/12 , H01L33/00
CPC分类号： F21V5/04 , F21K9/69 , F21V5/007 , F21V7/0083 , F21V31/03 , F21Y2105/10 , F21Y2115/10 , G02B19/0028 , G02B19/0061
摘要： A light emitting device includes a carrier, a light emitting element electrically connected to the carrier, a transparent plate having at least one through hole formed therein and including a flat-portion and a lens-portion and a permeable membrane structure disposed on a surface of the transparent plate. The lens-portion covers the light emitting element and has a light incident surface, a light emitting surface, a first and a second side surfaces. A first partial beam of the light beam passes through the light incident surface and leaves from the light emitting surface. A second partial beam of the light beam passes through the light incident surface and is transmitted to the first or the second side surface. The first or the second side surface reflects at least a part of the second partial beam of the light beam to be passed through the light emitting surface.
摘要翻译：发光装置包括载体，与载体电连接的发光元件，具有形成在其中的至少一个通孔的透明板，并且包括平坦部分和透镜部分和透液膜结构，透明板。透镜部分覆盖发光元件并且具有光入射表面，发光表面，第一和第二侧表面。光束的第一部分光束通过光入射表面并从发光表面离开。光束的第二部分光束通过光入射表面并被透射到第一或第二侧表面。第一或第二侧表面反射待通过光发射表面的光束的第二部分光束的至少一部分。

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