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1. 发明申请

US20190259924A1 SEMICONDUCTOR PACKAGE STRUCTURE 审中-公开
公开(公告)号：US20190259924A1
公开(公告)日：2019-08-22
申请号：US16113116
申请日：2018-08-27
申请人： Everlight Electronics Co., Ltd.
发明人： Chih-Ming Ho , Chun-Chih Liang , Ding-Hwa Cherng , Kuang-Mao Lu , Wen-Chueh Lo , Hao-Yu Yang , Chieh-Yu Kang , Han-Chang Pan
IPC分类号： H01L33/54 , H01L33/62 , H01L31/02 , H01L31/0203 , H01L33/56 , H01S5/022
摘要： A semiconductor package structure is disclosed. The package structure includes a first substrate, a second substrate on which the first substrate is disposed, and a semiconductor chip which is disposed on the first substrate. The two substrates can include two notches or two solder receiving portions. Therefore, when the package structure is disposed on the printed circuit board (PCB), the package structure will protrude less on the surface of the printed circuit board (PCB); or, the solders on the printed circuit board (PCB) will not be shifted by the package structure.

2. 发明授权

US10337689B2 Light emitting apparatus and lighting module 有权
公开(公告)号：US10337689B2
公开(公告)日：2019-07-02
申请号：US15892010
申请日：2018-02-08
申请人： EVERLIGHT ELECTRONICS CO., LTD.
发明人： Yi-Hui Liao , Chung-Wei Wang , Shun-Chang Li
IPC分类号： F21S43/14 , F21S43/20 , F21S43/19 , F21S43/15 , B60Q1/00 , B60Q1/30 , F21V9/14 , H01L23/538 , H01L25/075 , H01L33/50 , H01L33/62 , F21S41/19 , F21S41/20 , F21W106/00 , F21S41/153 , F21S41/151 , F21Y115/10 , H05B33/08
摘要： The present invention provides a light emitting apparatus and a lighting module, comprising: a circuit substrate, a plurality of optical sources and an optical element; the optical element comprises a translucent element and an interference element; the plurality of light sources are arranged on the circuit substrate for lighting the optical element; the optical element is arranged above the plurality of light sources; and the interference element is arranged on the translucent element, which is used to make light emitted from each of the light sources offset interference in a first polarization direction, enhance interference in a second polarization direction, and emit through the translucent element. The light emitting apparatus and the lighting module of the present invention are employed to provide a more diversified optical pattern to the user and improve the user experience.

3. 发明申请

US20180309522A1 OPTOCOUPLER 审中-公开
公开(公告)号：US20180309522A1
公开(公告)日：2018-10-25
申请号：US15959102
申请日：2018-04-20
申请人： EVERLIGHT ELECTRONICS CO., LTD.
发明人： KUO-CHUN CHIANG , PO-CHIEH HUANG , MING-JING LEE
IPC分类号： H04B10/80 , H01L31/173 , H01L31/0203 , H01L31/0232 , G02B6/42
CPC分类号： H04B10/802 , G02B6/4295 , H01L31/0203 , H01L31/02327 , H01L31/173
摘要： An optocoupler is provided, including: at least one light-emitting chip disposed at a first connective region; at least one light-sensing chip disposed at a second connective region; an isolative structure disposed between at least one light-emitting chip and at least one light-sensing chip for isolating an electric field; a first encapsulant covering at least one light-emitting chip, at least one light-sensing chip, first connective region, second connective region and isolative structure; a second encapsulant covering first encapsulant; and a substrate having a recess; wherein first connective region and second connective region are disposed within substrate, at least one light-emitting chip is disposed within recess and electrically connected with first connective region, at least one light-sensing chip is disposed within recess and electrically connected with second connective region, and first encapsulant and second encapsulant are disposed within recess.

4. 发明申请

US20180294381A1 LIGHT EMITTING DIODE DEVICE 审中-公开
公开(公告)号：US20180294381A1
公开(公告)日：2018-10-11
申请号：US15979436
申请日：2018-05-14
申请人： Everlight Electronics Co., Ltd.
发明人： Wei-Ting Wu , Jun Yu Chen , Han-Hsiang Chiang , Hsien-Chia Lin , Tzu-Pin Lin
IPC分类号： H01L33/38 , H01L23/538 , H01L33/00 , H01L33/62 , H01L33/20 , H01L33/08 , H01L25/075 , H01L33/48
摘要： A light emitting diode device is provided. The light emitting diode device has a substrate, a plurality of metal pads, a plurality of LEDs and a first metal conductive wire. A plurality of first metal pads of the metal pads are disposed on a first surface of the substrate, and the LEDs are disposed on a part of the first metal pads. Each of the LEDs has at least one first electrode contact. The first electrode contact of each of the LEDs electrically connected to the first metal conductive wire has the same electrode contact polarity. Moreover, another light emitting diode device is also provided.

5. 发明申请

US20180254381A1 LIGHT EMITTING DIODE CHIP 审中-公开
公开(公告)号：US20180254381A1
公开(公告)日：2018-09-06
申请号：US15967430
申请日：2018-04-30
申请人： Everlight Electronics Co., Ltd. , Southern Taiwan University of Science and Technology
发明人： Ming-Lun Lee
IPC分类号： H01L33/22 , H01L33/12 , H01L33/06 , H01L33/20 , H01L33/10 , H01L33/00 , H01L33/56 , H01L33/60 , H01L33/42
CPC分类号： H01L33/22 , H01L33/0075 , H01L33/06 , H01L33/10 , H01L33/12 , H01L33/20 , H01L33/42 , H01L33/56 , H01L33/60 , H01L2933/0016
摘要： A light emitting diode chip including a substrate and a light emitting diode element layer is provided. The substrate has a growth surface and a plurality of microstructures on the growth surface. An area of the growth surface occupied by the microstructures is A1 and an area of the growth surface not occupied by the micro-structures is A2, such that A1 and A2 satisfy the relation of 0.1≤A2/(A1+A2)≤0.5. The light emitting diode element layer is disposed on the growth surface of the substrate.

6. 发明申请

US20170358710A1 LIGHT EMITTING DIODE CHIP 审中-公开
公开(公告)号：US20170358710A1
公开(公告)日：2017-12-14
申请号：US15672179
申请日：2017-08-08
申请人： Everlight Electronics Co., Ltd. , Southern Taiwan University of Science and Technology
发明人： Ming-Lun Lee
IPC分类号： H01L33/22 , H01L33/06 , H01L33/20 , H01L33/56 , H01L33/00 , H01L33/60 , H01L33/10 , H01L33/42 , H01L33/12
CPC分类号： H01L33/22 , H01L33/0075 , H01L33/06 , H01L33/10 , H01L33/12 , H01L33/20 , H01L33/42 , H01L33/56 , H01L33/60 , H01L2933/0016
摘要： A light emitting diode chip including a substrate and a light emitting diode element layer is provided. The substrate has a growth surface and a plurality of microstructures on the growth surface. An area of the growth surface occupied by the microstructures is A1 and an area of the growth surface not occupied by the micro-structures is A2, such that A1 and A2 satisfy the relation of 0.1≦A2/(A1+A2)≦0.5. The light emitting diode element layer is disposed on the growth surface of the substrate.

7. 发明申请

US20170323871A1 LIGHT-EMITTING DIODE DISPLAY APPARATUS 审中-公开
公开(公告)号：US20170323871A1
公开(公告)日：2017-11-09
申请号：US15586304
申请日：2017-05-04
申请人： EVERLIGHT ELECTRONICS CO., LTD.
发明人： Yi-Ping Yeh , Chia-Fong Chou , Wei-Ting Wu
IPC分类号： H01L25/13 , G09G3/32 , H01L33/48
CPC分类号： H01L25/13 , G09G3/32 , G09G3/3216 , G09G2300/0408 , G09G2320/0233 , H01L33/483
摘要： A light-emitting diode display apparatus including a circuit substrate, a display matrix, a driving circuit, and an interface circuit is provided. The display matrix is disposed on the circuit substrate, and has a plurality of display pixels. The driving circuit is disposed on the circuit substrate, and has at least one driver. The driver has a programmable planning area. The interface circuit is disposed on the circuit substrate, and electrically coupled to the driving circuit. The interface circuit is configured to receive input information, and transports the input information to the driving circuit.

8. 发明授权

US09559084B2 Light-emitting device with multi-color temperature and multi-loop configuration 有权
标题翻译：具有多色温度和多回路配置的发光装置
公开(公告)号：US09559084B2
公开(公告)日：2017-01-31
申请号：US15070329
申请日：2016-03-15
申请人： Everlight Electronics Co., Ltd.
发明人： Chung-kai Chang , Shih-Hua Pan
IPC分类号： H01L25/075 , H05B33/14 , H01L33/62 , H01L33/50
CPC分类号： H01L25/0753 , H01L33/502 , H01L33/504 , H01L33/505 , H01L33/62 , H01L2224/48137 , H01L2933/0091 , H05B33/14
摘要： A light-emitting device with multi-color temperature and multi-loop configuration is provided. The light-emitting device may include a substrate, multiple light sources disposed on the substrate, a light-emitting unit covering the light sources, a first circuit and a second circuit. Each light source may be configured to emit a respective primary radiation. The light-emitting unit may include multiple loops, each of which covering at least one of the light sources. Each loop may be adjacent to and in contact with at least another loop. A first number of the light sources covered by one or more odd-numbered loops of the loops may be electrically connected to the first circuit. A second number of the light sources covered by one or more even-numbered loops of the loops may be electrically connected to the second circuit.
摘要翻译：提供具有多色温度和多环配置的发光装置。发光装置可以包括基板，设置在基板上的多个光源，覆盖光源的发光单元，第一电路和第二电路。每个光源可以被配置为发射相应的一次辐射。发光单元可以包括多个环，每个环覆盖至少一个光源。每个环可以与至少另一个环相邻并且与其接触。由环路的一个或多个奇数环路覆盖的第一数量的光源可以电连接到第一电路。由环的一个或多个偶数圈环覆盖的第二数量的光源可以电连接到第二电路。

9. 发明申请

US20170025395A1 Light Emitting Device 审中-公开
标题翻译：发光装置
公开(公告)号：US20170025395A1
公开(公告)日：2017-01-26
申请号：US15216839
申请日：2016-07-22
申请人： Everlight Electronics Co., Ltd.
发明人： Chien-Chih Chen , Ya Chin Tu , Chun Min Lin , Chieh-Yu Kang
IPC分类号： H01L25/075 , H01L33/60 , H01L33/48 , H01L33/62 , H01L33/50
CPC分类号： H01L25/0753 , H01L33/483 , H01L33/505 , H01L33/60 , H01L33/62 , H01L2224/73265
摘要： A light emitting device including a first work circuit and a second work circuit is provided. The first work circuit includes a first LED chip and a first bonding adhesive. The first LED chip and the first bonding adhesive are electrically connected in series. The second work circuit includes a second LED chip. When an operation current of the first work circuit and an operation current of the second work circuit are the same, the first work circuit has a first voltage VW1 and the second work circuit has a second voltage VW2, wherein VW1≈VW2.
摘要翻译：提供了包括第一工作电路和第二工作电路的发光器件。第一工作电路包括第一LED芯片和第一粘合剂。第一LED芯片和第一粘合剂被串联电连接。第二工作电路包括第二LED芯片。当第一工作电路的工作电流和第二工作电路的工作电流相同时，第一工作电路具有第一电压VW1，第二工作电路具有第二电压VW2，其中VW1≈VW2。

10. 发明申请

US20140369047A1 Frame and Light Apparatus 审中-公开
标题翻译：框架和灯具
公开(公告)号：US20140369047A1
公开(公告)日：2014-12-18
申请号：US14306803
申请日：2014-06-17
申请人： Everlight Electronics Co., Ltd.
发明人： Yung Chieh Chen , Jung Chiuan Lin , Feng-Ting Hsu , Chien-Chang Pei
IPC分类号： F21V21/30 , F21V23/00
CPC分类号： H01L33/62 , H01L25/0753 , H01L2224/48091 , H01L2224/48247 , H01L2924/00014
摘要： A frame for a light apparatus and the light apparatus are provided. The light apparatus has at least one light-emitting diode chip. The frame includes an electrode portion, a first body and a second body. The frame has a first portion, a second portion and a bendable connecting portion which is located between the first portion and the second portion. An angle is formed between the first portion and the second portion by the connecting portion. The first body is disposed on the first portion. The first body has a first recess exposing a portion of a first electrode surface of the first portion. The light-emitting diode chip is disposed in the first recess and connected with the first electrode surface electrically. The second body is disposed on the second portion and exposes a portion of the connection surface of the second portion.
摘要翻译：提供了一种用于照明装置的框架和灯装置。光装置具有至少一个发光二极管芯片。框架包括电极部分，第一主体和第二主体。框架具有位于第一部分和第二部分之间的第一部分，第二部分和可弯曲连接部分。通过连接部在第一部分和第二部分之间形成角度。第一主体设置在第一部分上。第一主体具有暴露第一部分的第一电极表面的一部分的第一凹部。发光二极管芯片设置在第一凹部中并与第一电极表面电连接。第二主体设置在第二部分上并暴露第二部分的连接表面的一部分。

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