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    • 86. 发明授权
    • Semiconductor device and method for forming using the same
    • 半导体装置及其制造方法
    • US08471318B2
    • 2013-06-25
    • US13176616
    • 2011-07-05
    • Byung Sub Nam
    • Byung Sub Nam
    • H01L27/108H01L29/94
    • H01L21/76802H01L21/76831H01L27/0207H01L27/10885
    • A semiconductor device and a method for forming the same are disclosed. The semiconductor device includes a plurality of bit lines having a uniform width on a semiconductor substrate, an active region obliquely arranged to have a predetermined angle with respect to the bit lines, a spacer arranged around the bit lines connected to a center part of the active region. A contact pad is connected to a lower part of the bit lines. The spacer is formed not only at an upper part of sidewalls of the contact pad but also at sidewalls of the bit lines. As a result, a CD of the bit line contact increases, so that a bit line contact patterning margin also increases. A bit line pattern having a uniform width is formed so that a patterning margin increases. A storage electrode contact self-alignment margin increases so that a line-type storage electrode contact margin increases.
    • 公开了半导体器件及其形成方法。 半导体器件包括在半导体衬底上具有均匀宽度的多个位线,相对于位线倾斜地布置成具有预定角度的有源区,围绕连接到活动的中心部分的位线布置的间隔件 地区。 接触焊盘连接到位线的下部。 间隔件不仅形成在接触垫的侧壁的上部,而且形成在位线的侧壁处。 结果,位线接触的CD增加,使得位线接触图案边缘也增加。 形成具有均匀宽度的位线图形,使得图案化边缘增加。 存储电极接触自对准边缘增加,使得线型存储电极接触边缘增加。
    • 89. 发明授权
    • Method for fabricating 3D-nonvolatile memory device
    • 制造3D非易失性存储器件的方法
    • US08461003B2
    • 2013-06-11
    • US13112767
    • 2011-05-20
    • Han-Soo JooSang-Hyun OhYu-Jin Park
    • Han-Soo JooSang-Hyun OhYu-Jin Park
    • H01L21/336
    • H01L27/11556H01L27/1203
    • A method for fabricating a 3D-nonvolatile memory device includes forming a sub-channel over a substrate, forming a stacked layer over the substrate, the stacked layer including a plurality of interlayer dielectric layers that are alternatively stacked with conductive layers, selectively etching the stacked layer to form a first open region exposing the sub-channel, forming a main-channel conductive layer to gap-fill the first open region, selectively etching the stacked layer and the main-channel conductive layer to form a second open region defining a plurality of main channels, and forming an isolation layer to gap-fill the second open region.
    • 一种用于制造3D非易失性存储器件的方法,包括在衬底上形成子沟道,在衬底上形成堆叠层,所述堆叠层包括交替层叠有导电层的多个层间电介质层,选择性地蚀刻堆叠 以形成暴露子通道的第一开放区域,形成主通道导电层以间隙填充第一开放区域,选择性地蚀刻堆叠层和主沟道导电层以形成限定多个的第二开口区域 的主通道,并且形成隔离层以间隙填充第二开口区域。