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    • 81. 发明授权
    • Method for fabricating heterojunction interdigitated back contact photovoltaic cells
    • 异质结交叉反接触光伏电池的制造方法
    • US09337380B2
    • 2016-05-10
    • US14218416
    • 2014-03-18
    • IMEC VZW
    • Barry O'Sullivan
    • H01L31/20H01L31/0224H01L31/05H01L31/0443H01L31/0216H01L31/068H01L31/18H01L31/028H01L31/0352H01L31/0376H01L31/0747H01L21/762H01L21/02
    • H01L31/20H01L21/02592H01L21/76256H01L31/02167H01L31/022425H01L31/022441H01L31/022458H01L31/028H01L31/0352H01L31/03762H01L31/0443H01L31/0516H01L31/0682H01L31/0747H01L31/1804H01L31/202Y02E10/547Y02E10/548Y02P70/521
    • The disclosed technology generally relates photovoltaic devices, and more particularly to methods of fabricating heterojunction interdigitated back contact photovoltaic cells having interdigitated emitter regions and back surface field regions. In one aspect, a method of forming on a substrate a patterned n+ a-Si:H layer and a patterned p+ a-Si:H layer, the patterned n+ a-Si:H layer and the patterned p+ a-Si:H layer being interdigitated and electrically isolated from each other, the method comprising: forming a patterned p+ a-Si:H layer on the substrate, the patterned p+ a-Si:H layer covering first regions of the substrate surface and leaving second regions of the substrate surface exposed; depositing a first intrinsic a-Si:H layer on the substrate; depositing an n+ a-Si:H layer on the first intrinsic a-Si:H layer; providing a patterned masking layer covering the n+ a-Si:H layer at least in the second regions; and selectively removing the n+ a-Si:H layer and the first intrinsic a-Si:H layer in regions not covered by the masking layer and stopping at an underlying portion of the p+ a-Si:H layer substantially without removing a substantial amount of the underlying portion of the p+ a-Si:H layer, wherein selectively removing the n+ a-Si:H layer and the first intrinsic a-Si:H layer comprises etching in a solution comprising a diluted TMAH solution.
    • 所公开的技术通常涉及光伏器件,更具体地涉及制造具有交叉指示的发射极区域和背表面场区域的异质结交叉反接触光伏电池的方法。 在一个方面,一种在衬底上形成图案化的n + a-Si:H层和图案化的p + a-Si:H层,图案化的n + a-Si:H层和图案化的p + a-Si:H层 所述方法包括:在所述衬底上形成图案化的p + a-Si:H层,所述图案化的p + a-Si:H层覆盖所述衬底表面的第一区域并留下所述衬底的第二区域 表面暴露 在衬底上沉积第一本征a-Si:H层; 在第一固有a-Si:H层上沉积n + a-Si:H层; 提供至少在所述第二区域中覆盖所述n + a-Si:H层的图案化掩模层; 并且在未被掩模层覆盖的区域中并且在p + a-Si:H层的下面部分基本上没有除去大量的量的情况下选择性地除去n + a-Si:H层和第一固有a-Si:H层 的p + a-Si:H层的下面部分,其中选择性地除去n + a-Si:H层和第一固有a-Si:H层包括在包含稀释的TMAH溶液的溶液中进行蚀刻。
    • 82. 发明授权
    • Photovoltaic device
    • 光伏装置
    • US09331226B2
    • 2016-05-03
    • US14134743
    • 2013-12-19
    • Panasonic Intellectual Property Management Co., Ltd.
    • Ayumu YanoAkiyoshi Ogane
    • H01L31/0747H01L31/0687H01L31/0376
    • H01L31/0687H01L31/03762H01L31/0747Y02E10/548
    • A photovoltaic device is provided having a semiconductor substrate, an i-type amorphous layer formed over a front surface of the semiconductor substrate, a p-type amorphous layer formed over the i-type amorphous layer, an i-type amorphous layer formed over a back surface of the semiconductor substrate, and an n-type amorphous layer formed over the i-type amorphous layer. The i-type amorphous layer and the i-type amorphous layer have oxygen concentration profiles in which concentrations are reduced in a step-shape from regions near interfaces with the semiconductor substrate and along a thickness direction, and an oxygen concentration in the step-shape portion of the i-type amorphous layer is higher than an oxygen concentration in the step-shape portion of the i-type amorphous layer.
    • 提供一种光电器件,其具有半导体衬底,形成在半导体衬底的前表面上的i型非晶层,在i型非晶层上形成的p型非晶层,形成在i型非晶层上的i型非晶层, 半导体衬底的背表面以及形成在i型非晶层之上的n型非晶层。 i型非晶层和i型非晶层具有氧浓度分布,其浓度从半导体衬底的界面附近和沿着厚度方向的区域以阶梯形减小,并且阶梯形状中的氧浓度 i型非晶层的部分高于i型非晶层的阶梯形部分中的氧浓度。
    • 86. 发明申请
    • PHOTOELECTRIC CONVERSION ELEMENT
    • 光电转换元件
    • US20150372172A1
    • 2015-12-24
    • US14762880
    • 2014-03-03
    • SHARP KABUSHIKI KAISHA
    • Kenji KIMOTO
    • H01L31/0224H01L31/075H01L31/0376
    • H01L31/022441H01L31/03529H01L31/03762H01L31/0682H01L31/0747H01L31/075Y02E10/547
    • A photoelectric conversion element includes a semiconductor, an intrinsic layer disposed on the semiconductor and containing hydrogenated amorphous silicon, a first-conductivity-type layer that covers a part of the intrinsic layer and contains hydrogenated amorphous silicon of a first conductivity type, a second-conductivity-type layer that covers a part of the intrinsic layer and contains hydrogenated amorphous silicon of a second conductivity type, an insulating film covering an end region of the first-conductivity-type layer, a first electrode disposed on the first-conductivity-type layer, and a second electrode disposed on the second-conductivity-type layer. An end portion of the second-conductivity-type layer is located on the insulating film or above the insulating film.
    • 光电转换元件包括半导体,设置在半导体上并包含氢化非晶硅的本征层,覆盖本征层的一部分并且包含第一导电类型的氢化非晶硅的第一导电型层, 导电型层,其覆盖本征层的一部分并且包含第二导电类型的氢化非晶硅,覆盖第一导电型层的端部区域的绝缘膜,设置在第一导电型 层和设置在第二导电型层上的第二电极。 第二导电型层的端部位于绝缘膜上或绝缘膜的上方。
    • 89. 发明授权
    • Light sensor and manufacturing method thereof
    • 光传感器及其制造方法
    • US09130086B2
    • 2015-09-08
    • US14305043
    • 2014-06-16
    • uPI semiconductor corp.
    • Ping-Yuan Lin
    • H01L31/20H01L31/0376H01L31/105
    • H01L31/03762H01L31/02005H01L31/02327H01L31/1055H01L31/202Y02E10/50Y02P70/521
    • A light sensor and a manufacturing method thereof are disclosed. The light sensor is capable of being coupled to a carry object and includes a sensing chip and a plurality of conductive connecting elements. The sensing chip includes a first surface and a second surface opposite to each other. The sensing chip also includes a sensing unit disposed between the first surface and the second surface and at least partially exposed by a window formed on the second surface. The first surface faces the carry object when the light sensor is coupled to a carry object. The conductive connecting elements are disposed on the first surface and coupled to the sensing unit in order to couple the light sensor to the carry object.
    • 公开了一种光传感器及其制造方法。 光传感器能够耦合到携带物体并且包括感测芯片和多个导电连接元件。 感测芯片包括彼此相对的第一表面和第二表面。 感测芯片还包括设置在第一表面和第二表面之间并且由形成在第二表面上的窗口至少部分地暴露的感测单元。 当光传感器耦合到携带物体时,第一表面面向携带物体。 导电连接元件设置在第一表面上并且耦合到感测单元,以将光传感器耦合到携带物体。