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1. 发明授权

US10916676B2 Optoelectronic devices including heterojunction and intermediate layer 有权
公开(公告)号：US10916676B2
公开(公告)日：2021-02-09
申请号：US15958844
申请日：2018-04-20
申请人： Alta Devices, Inc.
发明人： Brendan M. Kayes , Hui Nie , Isik C. Kizilyalli
IPC分类号： H01L31/0735 , H01L31/0224 , H01L31/18
摘要： Embodiments generally relate to optoelectronic semiconductor devices such as solar cells. In one aspect, a device includes an absorber layer made of gallium arsenide (GaAs) and having only one type of doping. An emitter layer is located closer than the absorber layer to a back side of the device and is made of a different material and having a higher bandgap than the absorber layer. A heterojunction is formed between the emitter layer and the absorber layer, and a p-n junction is formed between the emitter layer and the absorber layer and at least partially within the different material at a location offset from the heterojunction. An intermediate layer is located between the absorber layer and the emitter layer and provides the offset of the p-n junction from the heterojunction, and includes a graded layer and an ungraded back window layer.

2. 发明授权

US10259206B2 Epitaxial lift off systems and methods 有权
公开(公告)号：US10259206B2
公开(公告)日：2019-04-16
申请号：US13039307
申请日：2011-03-02
申请人： Brian Brown , Brian Burrows , David Berkstressor , Gang He , Thomas J Gmitter
发明人： Brian Brown , Brian Burrows , David Berkstressor , Gang He , Thomas J Gmitter
IPC分类号： B32B38/10 , B32B37/14 , B32B43/00 , H01L21/67 , H01L21/677 , H01L21/78 , H01L31/18
摘要： Epitaxial lift off systems and methods are presented. In one embodiment a tape is disposed on the opposite side of the epitaxial material than the substrate is used to hold the epitaxial material during the etching and removal steps of the ELO process. In various embodiments, the apparatus for removing the ELO film from the substrates without damaging the ELO film may include an etchant reservoir, substrate handling and tape handling mechanisms, including mechanisms to manipulate (e.g., cause tension, peel, widen the etch gap, etc.) the lift off component during the lift off process.

3. 发明授权

US10204831B2 Tape-based epitaxial lift off apparatuses and methods 有权
公开(公告)号：US10204831B2
公开(公告)日：2019-02-12
申请号：US14861821
申请日：2015-09-22
申请人： ALTA DEVICES, Inc.
发明人： Thomas Gmitter , Gang He , Melissa Archer , Andreas Hegedus
IPC分类号： H01L21/683 , H01L21/78 , H01L21/67 , H01L21/306 , H01L31/18
摘要： Embodiments of the invention generally relate to apparatuses and methods for producing epitaxial thin films and devices by epitaxial lift off (ELO) processes. In one embodiment, a method for forming thin film devices during an ELO process is provided which includes coupling a plurality of substrates to an elongated support tape, wherein each substrate contains an epitaxial film disposed over a sacrificial layer disposed over a wafer, exposing the substrates to an etchant during an etching process while moving the elongated support tape, and etching the sacrificial layers and peeling the epitaxial films from the wafers while moving the elongated support tape. Embodiments also include several apparatuses, continuous-type as well as a batch-type apparatuses, for forming the epitaxial thin films and devices, including an apparatus for removing the support tape and epitaxial films from the wafers on which the epitaxial films were grown.

4. 发明授权

US10076896B2 Pressurized heated rolling press for manufacture and method of use 有权
公开(公告)号：US10076896B2
公开(公告)日：2018-09-18
申请号：US15191410
申请日：2016-06-23
申请人： Alta Devices, Inc.
发明人： Khurshed Sorabji
IPC分类号： B32B37/10 , H01L21/677 , H01L31/18 , B32B37/06 , B32B37/14 , B32B38/18
CPC分类号： B32B37/1018 , B32B37/06 , B32B37/1027 , B32B37/14 , B32B38/1858 , B32B2457/12 , H01L21/677 , H01L21/67706 , H01L21/67748 , H01L21/6776 , H01L31/043 , H01L31/1864 , H01L31/1876 , Y02E10/50 , Y02P70/521
摘要： A method and system for connecting a plurality of materials using pressure and curing is disclosed. The method provides for: a) receiving the plurality of materials on the vacuum conveyor; b) conveying the received plurality of materials from the first location to a second location along the vacuum conveyor; c) applying a predetermined vacuum pressure; and d) curing the compressed plurality of materials. The system comprises a vacuum conveyor for receiving the plurality of materials at a first location, a moving belt adaptively positioned above the vacuum conveyor at a second location and the vacuum conveyor and the moving belt are arranged to be driven in a predetermined relation to one another, a vacuum pressure source for applying a predetermined vacuum pressure creating a force compressing the plurality of materials; and a curing source at a second location for curing the compressed plurality of materials.

5. 发明授权

US09954131B2 Optoelectronic devices including heterojunction and intermediate layer 有权
公开(公告)号：US09954131B2
公开(公告)日：2018-04-24
申请号：US14692647
申请日：2015-04-21
申请人： Alta Devices, Inc.
发明人： Brendan M. Kayes , Hui Nie , Isik C. Kizilyalli
IPC分类号： H01L31/0735 , H01L31/0224 , H01L31/18
CPC分类号： H01L31/0735 , H01L31/022441 , H01L31/1896 , Y02E10/52 , Y02E10/544
摘要： Embodiments generally relate to optoelectronic semiconductor devices such as solar cells. In one aspect, a device includes an absorber layer made of gallium arsenide (GaAs) and having only one type of doping. An emitter layer is located closer than the absorber layer to a back side of the device and is made of a different material and having a higher bandgap than the absorber layer. A heterojunction is formed between the emitter layer and the absorber layer, and a p-n junction is formed between the emitter layer and the absorber layer and at least partially within the different material at a location offset from the heterojunction. An intermediate layer is located between the absorber layer and the emitter layer and provides the offset of the p-n junction from the heterojunction, and includes a graded layer and an ungraded back window layer.

6. 发明授权

US09711671B2 Via structures for solar cell interconnection in solar module 有权
公开(公告)号：US09711671B2
公开(公告)日：2017-07-18
申请号：US14858808
申请日：2015-09-18
申请人： ALTA DEVICES, Inc.
发明人： Linlin Yang , Gang He , Dan Patterson , Paul Goddu , Liguang Lan , Gregg Higashi
IPC分类号： H01L31/00 , H01L31/05
CPC分类号： H01L31/0508 , H01L31/0445 , H01L31/05 , H01L31/0504 , Y02E10/50
摘要： System and method of providing a photovoltaic (PV) cell with a complex via structure in the substrate that has a primary via for containing a conductive material and an overflow capture region for capturing an overflow of the conductive material from the primary via. The conductive filling in the primary via may serve as an electrical contact between the PV cell and another PV cell. The overflow capture region includes one or more recesses formed on the substrate back surface. When the conductive material overflows from the primary via, the one or more recesses can capture and confine the overflow within the boundary of the complex via structure. A recess may be a rectangular or circular trench proximate to or overlaying the primary via. The recesses may also be depressions formed by roughening the substrate back surface.

7. 发明授权

US09698284B2 Individual finger isolation through spot application of a dielectric in an optoelectronic device 有权
公开(公告)号：US09698284B2
公开(公告)日：2017-07-04
申请号：US13222393
申请日：2011-08-31
申请人： Andreas Hegedus
发明人： Andreas Hegedus
IPC分类号： H01L31/02 , H02S50/10 , H01L21/66 , H01L31/0224 , H01L31/05 , H01L31/0216
CPC分类号： H01L31/022433 , H01L22/22 , H01L31/02168 , H01L31/0508 , H02S50/10 , Y02E10/50
摘要： An optoelectronic device including at least one of a solar device, a semiconductor device, and an electronic device. The device includes a semiconductor unit. A plurality of metal fingers is disposed on a surface of the semiconductor unit for electrical conduction. Each of the metal fingers corresponds to a section of the optoelectronic device. A plurality of pad areas is available for connection to a bus bar, wherein each of the metal fingers is connected to a corresponding pad area for forming an electrical contact. The optoelectronic device includes a bad section, wherein the bad section is associated with a compromised metal finger and a compromised pad area. A dielectric spot coating is disposed above the compromised pad area to electrically isolate the bad section.

8. 发明授权

US09127364B2 Reactor clean 有权
标题翻译：电抗器清洁
公开(公告)号：US09127364B2
公开(公告)日：2015-09-08
申请号：US12913688
申请日：2010-10-27
申请人： David P. Bour
发明人： David P. Bour
IPC分类号： C23C16/00 , C23C16/54 , C23C16/30 , C23C16/455 , H01L21/67 , H01L21/677
CPC分类号： C23C16/54 , C23C16/301 , C23C16/45519 , H01L21/67173 , H01L21/6719 , H01L21/6776
摘要： A method and apparatus for performing chemical vapor deposition (CVD) processes is provided. In one embodiment, the apparatus comprises a reactor body having a processing region, comprising a wafer carrier track having a wafer carrier disposed thereon, at least one sidewall having an exhaust assembly for exhausting gases from the processing region, a lid assembly disposed on the reactor body, comprising a lid support comprising a first showerhead assembly for supplying reactant gases to the processing region, a first isolator assembly for supplying isolation gases to the processing region, a second showerhead assembly for supplying reactant gases to the processing region, and a second isolator assembly for supplying isolation gases to the processing region, wherein the first showerhead assembly, the first isolator assembly, the second showerhead assembly, and the second isolator assembly are consecutively and linearly disposed next to each other.
摘要翻译：提供了一种用于进行化学气相沉积（CVD）工艺的方法和装置。在一个实施例中，该装置包括具有处理区域的反应器主体，该反应器主体包括具有设置在其上的晶片载体的晶片载体轨道，至少一个侧壁，具有用于从处理区域排出气体的排气组件，设置在反应器主体，包括盖支撑件，其包括用于将反应气体供应到处理区域的第一喷淋头组件，用于向处理区域供应隔离气体的第一隔离器组件，用于将反应气体供应到处理区域的第二喷头组件和第二隔离器用于向处理区域供应隔离气体的组件，其中第一喷淋头组件，第一隔离器组件，第二淋浴头组件和第二隔离器组件彼此相邻并线性地设置。

9. 发明授权

US09121096B2 Concentric showerhead for vapor deposition 有权
标题翻译：用于气相沉积的同心花洒
公开(公告)号：US09121096B2
公开(公告)日：2015-09-01
申请号：US12576797
申请日：2009-10-09
申请人： Andreas Hegedus
发明人： Andreas Hegedus
IPC分类号： C23C16/00 , C23C16/30 , C23C16/455 , C23C16/458 , C23C16/48 , C23C16/54
CPC分类号： C23C16/301 , C23C16/45519 , C23C16/45576 , C23C16/4583 , C23C16/481 , C23C16/54 , Y10T137/87571
摘要： Embodiments of the invention generally relate to a concentric gas manifold assembly used in deposition reactor or system during a vapor deposition process. In one embodiment, the manifold assembly has an upper section coupled to a middle section coupled to a lower section. The middle section contains an inlet, a manifold extending from the inlet to a passageway, and a tube extending along a central axis and containing a channel along the central axis and in fluid communication with the passageway. The lower section of the manifold assembly contains a second manifold extending from a second inlet to a second passageway and an opening concentric with the central axis. The tube extends to the opening to form a second channel between the tube and an edge of the opening. The second channel is concentric with the central axis and is in fluid communication with the second passageway.
摘要翻译：本发明的实施例一般涉及在气相沉积过程中用于沉积反应器或系统中的同心气体歧管组件。在一个实施例中，歧管组件具有联接到联接到下部的中部的上部。中间部分包含入口，从入口延伸到通道的歧管以及沿着中心轴延伸并且沿着中心轴线包含通道并与通道流体连通的管。歧管组件的下部包含从第二入口延伸到第二通道的第二歧管和与中心轴线同心的开口。管延伸到开口以在管和开口的边缘之间形成第二通道。第二通道与中心轴线同心并且与第二通道流体连通。

10. 发明授权

US09114464B1 Fixture for substrate cutting 有权
标题翻译：基板切割夹具
公开(公告)号：US09114464B1
公开(公告)日：2015-08-25
申请号：US13420414
申请日：2012-03-14
申请人： David Ishikawa , Laila Mattos
发明人： David Ishikawa , Laila Mattos
IPC分类号： B26F1/02 , B21D22/00 , H05K13/02 , B23D23/00 , B26D7/32
CPC分类号： B23D23/00 , B26D1/095 , B26D7/26 , B26D7/32 , B26D2007/2607
摘要： A fixture for cutting thin substrates, such as films, wafers, semiconductor layers and the like, using a blade holder assembly joined to a substrate clamp assembly. Each assembly has a plurality of members with the substrate clamp having a base plate that introduces a vacuum environment and a substrate support plate that uses the vacuum to secure the substrate in place. The blade holder assembly has interlocking projections in interleaving sheet members sandwiched between two bracket members that define slots for supporting a knife. Multiple slots allow the blade to be positioned in different positions and different orientations for cutting thin substrates held with vacuum pressure in the substrate clamp assembly.
摘要翻译：一种用于切割诸如薄膜，晶片，半导体层等的薄基板的固定装置，其使用连接到基板夹具组件的刀片保持器组件。每个组件具有多个构件，其中衬底夹具具有引入真空环境的基板和使用真空的衬底支撑板，以将衬底固定就位。刀片保持器组件具有互锁的突出部，该互锁突起插入夹在两个支架部件之间的片材部件，这两个支架部件限定用于支撑刀具的槽。多个插槽允许刀片定位在不同的位置和不同的取向，用于切割在衬底夹具组件中以真空压力保持的薄衬底。

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