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    • 1. 发明授权
    • Packages for high power operation of optical fiber components
    • 光纤组件大功率运行的封装
    • US08542971B2
    • 2013-09-24
    • US13001335
    • 2009-06-25
    • Stéphane Chatigny
    • Stéphane Chatigny
    • G02B6/00
    • H01S3/06704G02B6/0218G02B6/14G02B6/243G02B6/2558G02B6/3636G02B6/4296H01S3/042
    • A package for dissipating heat power and/or optical power from an optical fiber component of a device is provided. The package includes a heat sink packaging receptacle for accommodating the optical fiber component having a cavity for receiving a temperature sensitive portion of the optical fiber component. According to one aspect, the package may include a power-dissipative material for dissipating heat power or optical power, the power-dissipative material extending within the cavity and surrounding the temperature-sensitive portion of the optical fiber component. According to another aspect, the package may include at least one channel extending between the cavity and an end of the heat sink packaging receptacle, the channel being in intimate contact with the cladding of the optical fiber component for dissipating heat power and/or optical power from the optical fiber component.
    • 提供了用于从装置的光纤部件散发热功率和/或光功率的封装。 该包装包括用于容纳具有用于接收光纤部件的温度敏感部分的空腔的光纤部件的散热器包装容器。 根据一个方面,封装可以包括用于耗散热功率或光功率的功率耗散材料,所述功率消耗材料在腔内延伸并且围绕光纤部件的温度敏感部分。 根据另一方面,封装可以包括在空腔和散热器封装容器的端部之间延伸的至少一个通道,该通道与光纤部件的包层紧密接触以消散热功率和/或光功率 从光纤部件。
    • 2. 发明申请
    • PACKAGES FOR HIGH POWER OPERATION OF OPTICAL FIBER COMPONENTS
    • 光纤组件高功率运行的包装
    • US20110110625A1
    • 2011-05-12
    • US13001335
    • 2009-06-25
    • Stéphane Chatigny
    • Stéphane Chatigny
    • G02B6/46G02B6/26B32B37/12B32B37/14B23P11/00
    • H01S3/06704G02B6/0218G02B6/14G02B6/243G02B6/2558G02B6/3636G02B6/4296H01S3/042
    • A package for dissipating heat power and/or optical power from an optical fiber component of a device is provided. The package includes a heat sink packaging receptacle for accommodating the optical fiber component having a cavity for receiving a temperature sensitive portion of the optical fiber component. According to one aspect, the package may include a power-dissipative material for dissipating heat power or optical power, the power-dissipative material extending within the cavity and surrounding the temperature-sensitive portion of the optical fiber component. According to another aspect, the package may include at least one channel extending between the cavity and an end of the heat sink packaging receptacle, the channel being in intimate contact with the cladding of the optical fiber component for dissipating heat power and/or optical power from the optical fiber component.
    • 提供了用于从装置的光纤部件散发热功率和/或光功率的封装。 该包装包括用于容纳具有用于接收光纤部件的温度敏感部分的空腔的光纤部件的散热器包装容器。 根据一个方面,封装可以包括用于耗散热功率或光功率的功率耗散材料,所述功率消耗材料在腔内延伸并且围绕光纤部件的温度敏感部分。 根据另一方面,封装可以包括在空腔和散热器封装容器的端部之间延伸的至少一个通道,该通道与光纤部件的包层紧密接触以消散热功率和/或光功率 从光纤部件。