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1. 发明授权

US10177124B1 Flexible micro-LED display module 有权
公开(公告)号：US10177124B1
公开(公告)日：2019-01-08
申请号：US15910148
申请日：2018-03-02
申请人： FLEX TEK CO., LTD.
发明人： Yao-Hsien Huang , Sheng-Hui Chen
IPC分类号： H01L25/075 , H01L23/538 , H01L33/06 , H01L33/12 , H01L33/32 , H01L33/40 , H01L33/58 , H01L33/62 , H01L33/50 , G09G3/32
摘要： The present invention discloses a flexible micro-LED display module, comprising: a flexible substrate, a substrate protection layer, a lattice matching layer, an LED array, a transparent conductive substrate, and a light conversion layer. The light conversion layer is constituted by a plurality of red light conversion units, a plurality of green light conversion units, and a plurality of blue light conversion units, such that one pixel is formed by one red light conversion unit, one green light conversion unit, one blue light conversion unit, and several light-emitting elements. In the case of some light-emitting elements failing to radiate light normally, the defective pixel correction circuit is used to apply luminous intensity adjusting process to other light-emitting elements working normally, so as to make the flexible micro-LED display module able to display video or images with the lowest number of defective pixels capable of meeting the requirements of pixel standards.

2. 发明授权

US10548222B1 Embedded passive device structure 有权
公开(公告)号：US10548222B1
公开(公告)日：2020-01-28
申请号：US16292625
申请日：2019-03-05
申请人： FLEX TEK CO., LTD.
发明人： Tsung-Her Yeh
IPC分类号： H05K1/16 , H05K1/03 , H05K3/46
摘要： Disclosures of the present invention mainly describe an embedded passive device structure, constituted by a first electrically conductive layer, a resistor layer, a dielectric layer, a support layer, a joint layer, and a second electrically conductive layer. Particularly, it is able to form an electronic circuit topology comprising at least one thin film resistor, at least one thin film capacitor and at least one thin film inductor on the embedded passive device structure by applying two times of photolithography processes to the embedded passive device structure. In addition, the resistor layer, formed on the first electrically conductive layer through sputter-coating process, is made of Ni, Cr, W, or compound thereof so as to show the lowest resistance less than or equal to 5 Ω/sq because of having good film continuity and surface densification. Moreover, the use of sputter-coating technology is helpful in reduction of industrial waste water.

3. 发明授权

US10468163B1 Copper film with buried film resistor and printed circuit board having the same 有权
公开(公告)号：US10468163B1
公开(公告)日：2019-11-05
申请号：US16292618
申请日：2019-03-05
申请人： FLEX TEK CO., LTD.
发明人： Tsung-Her Yeh
IPC分类号： H01C7/00 , H05K1/16 , H01C17/00 , H05K1/09 , H05K1/02
摘要： Disclosures of the present invention mainly describe a copper film with buried film resistor. In the present invention, Ni, Cr, W, Ni-based compound, W-based compound, Ni-based alloy, or W-based alloy are adopted for the manufacture of a resistor layer, and a copper layer is processed to the copper film 1 with buried film resistor by being integrated with the resistor layer. Particularly, the resistor layer, formed on the copper layer through sputter-coating process, is able to show the lowest resistance less than or equal to 5 Ω/sq. Moreover, the use of sputter-coating technology is helpful in reduction of industrial waste water. In addition, at least one electronic circuit having at least one film resistor can be formed on a printed circuit board comprising the above-mentioned copper film by just needing to complete two times of photolithography processes on the printed circuit board.

4. 发明授权

US10147858B1 Flexible LED device and flexible LED panel 有权
公开(公告)号：US10147858B1
公开(公告)日：2018-12-04
申请号：US15798536
申请日：2017-10-31
申请人： FLEX TEK CO., LTD.
发明人： Yao-Hsien Huang , Sheng-Hui Chen
IPC分类号： H01L33/06 , H01L33/12 , H01L33/32 , H01L33/40 , H01L33/42 , H01L33/48 , H01L33/50 , H01L33/58 , H01L33/62 , H01L25/075 , H01L33/64
摘要： The present invention discloses a flexible LED device and a flexible LED panel. Differing an approach for substrate lift-off and bonding is conventionally adopted to exchange a sapphire substrate of an LED die for a copper substrate having excellent thermal conductivity, this novel flexible LED device is constituted by a thin-metal-made substrate, a substrate protection layer, a lattice matching layer, a light-emitting structure, a first electrode, and a second electrode. It is worth explaining that, thanks to that the thin-metal-made substrate with a thickness in a range from 25 μm to 150 μm exhibits outstanding mechanical characteristics including flexibility, thermal conductivity and thermal resistance, engineers can adopt thin film deposition technologies such as PECVD and MOCVD as well as utilize roll-to-roll manufacturing systems to mass produce this flexible LED device. Besides, heat produced during the illumination of the flexible LED device can be effectively dissipated by the thin-metal-made substrate.

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