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1. 发明申请

US20140091330A1 LED PACKAGE STRUCTURE WITH TRANSPARENT ELECTRODES 审中-公开
标题翻译： LED包装结构与透明电极
公开(公告)号：US20140091330A1
公开(公告)日：2014-04-03
申请号：US13633671
申请日：2012-10-02
申请人： Ming-Hung CHEN , Ching-Jen Pan , Shih-Chang Shei
发明人： Ming-Hung CHEN , Ching-Jen Pan , Shih-Chang Shei
IPC分类号： H01L33/42
CPC分类号： H01L27/156 , H01L33/385 , H01L33/42 , H01L33/44 , H01L33/62 , H01L2924/0002 , H01L2924/00
摘要： The present invention discloses a LED package structure with transparent electrodes. The electrode layers the semiconductor layers inside the LED chip and the protection layer are all transparent to visible and invisible lights. With the adoption of the present invention, electrodes on the LED package no longer block any part of the light emission from inside the LED.
摘要翻译：本发明公开了一种具有透明电极的LED封装结构。 LED芯片内的半导体层的电极层和保护层对可见光和隐形灯都是透明的。采用本发明，LED封装上的电极不再阻挡来自LED内的发光的任何部分。

2. 发明申请

US20130126914A1 HIGH-VOLTAGE AC LIGHT-EMITTING DIODE STRUCTURE 有权
标题翻译：高电压交流发光二极管结构
公开(公告)号：US20130126914A1
公开(公告)日：2013-05-23
申请号：US13407028
申请日：2012-02-28
申请人： Ching-Jen PAN , Wei-Tai CHENG , Ming-Hung CHEN
发明人： Ching-Jen PAN , Wei-Tai CHENG , Ming-Hung CHEN
IPC分类号： H01L27/15
CPC分类号： H01L27/156 , H01L33/0079 , H01L33/08 , H01L33/46 , H01L33/62 , H01L2224/16
摘要： A high-voltage alternating current (AC) light-emitting diode (LED) structure is provided. The high-voltage AC LED structure includes a circuit substrate and a plurality of high-voltage LED (HV LED) chips. Each one of the HV LED chips includes a first substrate, an adhering layer, first ohmic contact layers, epi-layers, a first insulating layer, at least two first electrically conducting plates, at least two second electrically conducting plates, and a second substrate. The HV LED chips manufactured by a wafer-level process are coupled to the low-cost circuit substrate to produce the downsized high-voltage AC LED structure.
摘要翻译：提供了高压交流（AC）发光二极管（LED）结构。高压AC LED结构包括电路基板和多个高压LED（HV LED）芯片。每个HV LED芯片包括第一基板，粘合层，第一欧姆接触层，外延层，第一绝缘层，至少两个第一导电板，至少两个第二导电板和第二基板。通过晶片级工艺制造的HV LED芯片耦合到低成本电路基板以产生小型化的高压AC LED结构。

3. 发明申请

US20130095585A1 MULTI-FIELD ARRANGING METHOD OF LED CHIPS UNDER SINGLE LENS 审中-公开
标题翻译：单镜头下LED灯的多场布置方法
公开(公告)号：US20130095585A1
公开(公告)日：2013-04-18
申请号：US13708720
申请日：2012-12-07
申请人： Helio Optoelectronics Corporation
发明人： Ming-Hung CHEN , Po-Ming Tseng , Kun-Yang Hsieh , Shin-Chieh Lin
IPC分类号： H01L33/00
CPC分类号： H01L33/005 , H01L25/0753 , H01L33/58 , H01L2924/0002 , H01L2933/0033 , H01L2924/00
摘要： A multi-field arranging method of LED chips under a single lens includes the steps of: setting a first concentric circle on a bottom of a hemispherical lens, wherein the first concentric circle is centered at an axis of the hemispherical lens; equidistantly arranging plural first LED chips on the first concentric circle; setting a second concentric circle, which is also centered at the same axis as the first concentric circle, and the second concentric circle is larger than the first concentric circle in radius; and equidistantly arranging plural second LED chips and plural third LED chips on the second concentric circle. The present invention allows the LED chips to present symmetrical light patterns through the hemispherical lens, thereby obtaining a light field with evener color mixture and evener color temperature distribution in every illuminating direction.
摘要翻译：在单个透镜下的LED芯片的多场排列方法包括以下步骤：在半球形透镜的底部设置第一同心圆，其中第一同心圆以半球透镜的轴为中心; 在第一同心圆上等距地排列多个第一LED芯片; 设置第二同心圆，其中心于与第一同心圆相同的轴，并且第二同心圆大于半径的第一同心圆; 并且在第二同心圆上等距地布置多个第二LED芯片和多个第三LED芯片。本发明允许LED芯片通过半球形透镜呈现对称的光图案，从而在每个照明方向上获得具有更好的颜色混合和更好的色温分布的光场。

4. 发明授权

US07910395B2 LED structure 有权
标题翻译： LED结构
公开(公告)号：US07910395B2
公开(公告)日：2011-03-22
申请号：US12441204
申请日：2006-09-13
申请人： Shih-Chang Shei , Ming-Hung Chen , Shih-Yi Wen , Chun-Che Lee
发明人： Shih-Chang Shei , Ming-Hung Chen , Shih-Yi Wen , Chun-Che Lee
IPC分类号： H01L21/00
CPC分类号： H01L27/156 , H01L33/385 , H01L33/44 , H01L33/62 , H01L2224/05001 , H01L2224/05009 , H01L2224/0557 , H01L2224/05571 , H01L2224/16225 , H01L2924/00014 , H01L2224/05599 , H01L2224/05099
摘要： An LED structure includes a first substrate; an adhering layer formed on the first substrate; first ohmic contact layers formed on the adhering layer; epi-layers formed on the first ohmic contact layers; a first isolation layer covering the first ohmic contact layers and the epi-layers at exposed surfaces thereof; and first electrically conducting plates and second electrically conducting plates, both formed in the first isolation layer and electrically connected to the first ohmic contact layers and the epi-layers, respectively. The trenches allow the LED structure to facilitate complex serial/parallel connection so as to achieve easy and various applications of the LED structure in the form of single structures under a high-voltage environment.
摘要翻译： LED结构包括第一基板; 形成在所述第一基板上的粘附层; 形成在粘附层上的第一欧姆接触层; 形成在第一欧姆接触层上的外延层; 覆盖其暴露表面的第一欧姆接触层和外延层的第一隔离层; 以及第一导电板和第二导电板，两者分别形成在第一隔离层中并电连接到第一欧姆接触层和外延层。沟槽允许LED结构促进复杂的串联/并联连接，以便在高压环境下以单结构的形式实现LED结构的简单和多种应用。

5. 发明申请

US20100059733A1 LED Structure 有权
标题翻译： LED结构
公开(公告)号：US20100059733A1
公开(公告)日：2010-03-11
申请号：US12441204
申请日：2006-09-13
申请人： Shih-Chang Shei , Ming-Hung Chen , Shih-Yi Wen , Chun-Che Lee
发明人： Shih-Chang Shei , Ming-Hung Chen , Shih-Yi Wen , Chun-Che Lee
IPC分类号： H01L33/00
CPC分类号： H01L27/156 , H01L33/385 , H01L33/44 , H01L33/62 , H01L2224/05001 , H01L2224/05009 , H01L2224/0557 , H01L2224/05571 , H01L2224/16225 , H01L2924/00014 , H01L2224/05599 , H01L2224/05099
摘要： An LED structure includes a first substrate; an adhering layer formed on the first substrate; first ohmic contact layers formed on the adhering layer; epi-layers formed on the first ohmic contact layers; a first isolation layer covering the first ohmic contact layers and the epi-layers at exposed surfaces thereof; and first electrically conducting plates and second electrically conducting plates, both formed in the first isolation layer and electrically connected to the first ohmic contact layers and the epi-layers, respectively. The first trenches or the second trenches allow the LED structure to facilitate complex serial/parallel connection so as to achieve easy and various applications of the LED structure in the form of single structures under a high-voltage environment.
摘要翻译： LED结构包括第一基板; 形成在所述第一基板上的粘附层; 形成在粘附层上的第一欧姆接触层; 形成在第一欧姆接触层上的外延层; 覆盖其暴露表面的第一欧姆接触层和外延层的第一隔离层; 以及第一导电板和第二导电板，两者分别形成在第一隔离层中并电连接到第一欧姆接触层和外延层。第一沟槽或第二沟槽允许LED结构促进复杂的串联/并联连接，以便在高压环境下以单结构的形式实现LED结构的简单和多种应用。

6. 发明申请

US20140183444A1 HIGH-VOLTAGE FLIP-CHIP LED STRUCTURE AND MANUFACTURING METHOD THEREOF 审中-公开
标题翻译：高压FLIP-CHIP LED结构及其制造方法
公开(公告)号：US20140183444A1
公开(公告)日：2014-07-03
申请号：US13781256
申请日：2013-02-28
申请人： HELIO OPTOELECTRONICS CORPORATION
发明人： Ming-Hung CHEN , Shih-Chang Shei
IPC分类号： H01L33/46 , H01L27/15
CPC分类号： H01L27/153 , H01L33/08 , H01L33/44 , H01L33/62 , H01L2224/13
摘要： A high-voltage flip-chip LED structure and a manufacturing method thereof are disclosed. The manufacturing method includes: providing a die substrate, depositing a first passivation layer, forming a co-electrical-connecting layer, depositing a second passivation layer, depositing a mirror layer, forming two conductive tunnels by etching, and providing two connecting metal layers. The die substrate includes a sapphire substrate and multiple LED chips thereon. The fully transparent co-electrical-connecting layer, formed after formation of the first passivation layer, electrically connects the LED chips in series. The outer surface of the deposited second passivation layer is a flat passivation surface that enables the mirror layer thereon to be level and reflect light without optical path difference. The two connecting metal layers are provided for electrical conduction. The high-voltage flip-chip LED structure thus formed has fully transparent electrodes and can output light without optical path difference.
摘要翻译：公开了一种高压倒装芯片LED结构及其制造方法。该制造方法包括：提供管芯基板，沉积第一钝化层，形成共电连接层，沉积第二钝化层，沉积镜层，通过蚀刻形成两个导电通道，以及提供两个连接金属层。裸片基板包括蓝宝石衬底和其上的多个LED芯片。在形成第一钝化层之后形成的完全透明的共电连接层将LED芯片串联电连接。沉积的第二钝化层的外表面是平坦钝化表面，其使得其上的镜层能够水平并且反射光而没有光程差。两个连接金属层被提供用于导电。这样形成的高电压倒装芯片LED结构具有完全透明的电极，可以输出光而不产生光程差。

7. 发明授权

US08710517B2 High-voltage AC light-emitting diode structure 有权
标题翻译：高压交流发光二极管结构
公开(公告)号：US08710517B2
公开(公告)日：2014-04-29
申请号：US13407028
申请日：2012-02-28
申请人： Ching-Jen Pan , Wei-Tai Cheng , Ming-Hung Chen
发明人： Ching-Jen Pan , Wei-Tai Cheng , Ming-Hung Chen
IPC分类号： H01L27/15
CPC分类号： H01L27/156 , H01L33/0079 , H01L33/08 , H01L33/46 , H01L33/62 , H01L2224/16
摘要： A high-voltage alternating current (AC) light-emitting diode (LED) structure is provided. The high-voltage AC LED structure includes a circuit substrate and a plurality of high-voltage LED (HV LED) chips. Each one of the HV LED chips includes a first substrate, an adhering layer, first ohmic contact layers, epi-layers, a first insulating layer, at least two first electrically conducting plates, at least two second electrically conducting plates, and a second substrate. The HV LED chips manufactured by a wafer-level process are coupled to the low-cost circuit substrate to produce the downsized high-voltage AC LED structure.
摘要翻译：提供了高压交流（AC）发光二极管（LED）结构。高压AC LED结构包括电路基板和多个高压LED（HV LED）芯片。每个HV LED芯片包括第一基板，粘合层，第一欧姆接触层，外延层，第一绝缘层，至少两个第一导电板，至少两个第二导电板和第二基板。通过晶片级工艺制造的HV LED芯片耦合到低成本电路基板以产生小型化的高压AC LED结构。

8. 发明申请

US20140077710A1 LED LAMP STRUCTURE DRIVEN BY DOUBLE CURRENT AND DOUBLE CURRENT DRIVING METHOD THEREOF 审中-公开
标题翻译： LED灯结构由双电流和双电流驱动方式驱动
公开(公告)号：US20140077710A1
公开(公告)日：2014-03-20
申请号：US13671216
申请日：2012-11-07
申请人： HELIO OPTOELECTRONICS CORPORATION
发明人： Ming-Hung CHEN , Ching-Jen PAN
IPC分类号： H05B37/02
CPC分类号： H05B33/089 , H05B33/0866
摘要： Disclosed are an LED lamp structure driven by double current and a double current driving method thereof. The LED lamp structure driven by double current includes a COB package, a temperature sensor, and a controller. The COB package is provided therein with a blue LED chipset to be driven by a first current and a red LED chipset to be driven by a second current. The temperature sensor detects the working temperature of the red LED chipset, and the controller performs dynamic adjustment on the second current according to the working temperature so as to stabilize the color temperature of the LED lamp structure. Thus, as soon as the LED lamp structure is activated, its color temperature will be stabilized to ensure user comfort, which may otherwise be disturbed by variation of the color temperature.
摘要翻译：公开了由双电流驱动的LED灯结构及其双电流驱动方法。由双电流驱动的LED灯结构包括COB封装，温度传感器和控制器。 COB封装在其中设置有由第一电流驱动的蓝色LED芯片组和由第二电流驱动的红色LED芯片组。温度传感器检测红色LED芯片组的工作温度，控制器根据工作温度对第二电流进行动态调整，以稳定LED灯泡结构的色温。因此，一旦LED灯结构被激活，其色温将被稳定以确保用户的舒适度，否则可能由于色温的变化而受到干扰。

9. 发明授权

US08143770B2 LED bulb structure having insertion end, and/or heat dissipation element, and/or heat-and-electricity separated element 有权
标题翻译：具有插入端的LED灯泡结构和/或散热元件和/或热电分离元件
公开(公告)号：US08143770B2
公开(公告)日：2012-03-27
申请号：US12441214
申请日：2006-09-13
申请人： Cheng-Wei Chan , Ming-Hung Chen , Shih-Yi Wen , Chun-Che Lee
发明人： Cheng-Wei Chan , Ming-Hung Chen , Shih-Yi Wen , Chun-Che Lee
IPC分类号： H01J61/52 , H01J5/50
CPC分类号： H01L33/647 , F21K9/00 , F21V19/0025 , F21V29/773 , F21Y2115/10 , H01L33/62 , H01L33/642 , H01L2224/48091 , H01L2924/3011 , H01L2924/00014
摘要： An LED bulb structure having an insertion end includes a first electrically conducting pin, a second electrically conducting pin having a die pad at an end thereof, and an LED unit electrically connected to the first electrically conducting pin and the second electrically conducting pin through a first leading wire and a second leading wire, respectively, and a cap enclosing the above-mentioned components and leaving part of the first electrically conducting pin and the second electrically conducting pin exposed thereoutside. The first and second electrically conducting pins are adapted to form bayonet connections. An LED bulb structure having a heat dissipation element has the heat dissipation element attached to the pin portions of the electrically conducting pins. An LED bulb structure having a heat-and-electricity separated element further has a thermally conducting pin.
摘要翻译：具有插入端的LED灯泡结构包括第一导电销，在其一端具有芯片焊盘的第二导电销以及通过第一导电销与第一导电销和第二导电销电连接的LED单元引线和第二引线，以及封闭上述部件的盖，并使第一导电销和第二导电销的一部分露出在外侧。第一和第二导电销适于形成卡口连接。具有散热元件的LED灯泡结构具有安装在导电销的销部分上的散热元件。具有热电分离元件的LED灯泡结构还具有导热销。

10. 发明申请

US20140145221A1 LED LAMP STRUCTURE WITH HEAT SINK 审中-公开
标题翻译： LED灯泡结构与散热
公开(公告)号：US20140145221A1
公开(公告)日：2014-05-29
申请号：US13737616
申请日：2013-01-09
申请人： HELIO OPTOELECTRONICS CORPORATION
发明人： Ming-Hung Chen , Kun-Yang Hsieh , Shin-Chieh Lin
IPC分类号： H01L33/64 , H01L33/60
CPC分类号： H01L33/64 , H01L25/0753 , H01L33/507 , H01L33/58 , H01L33/60 , H01L33/642 , H01L33/644 , H01L2924/0002 , H01L2924/00
摘要： An LED lamp structure with a heat sink includes a reflection cup, an LED module, and a cover, in addition to the heat sink. The reflection cup has an inside bottom surface, a reflection surface, an outside bottom surface, and a light exit. The LED module is thermally conductively and fixedly provided on the inside bottom surface. The cover covers the LED module. The heat sink is thermally conductively connected to the outside bottom surface. The LED lamp structure is efficient in not only light extraction but also heat dissipation.
摘要翻译：具有散热器的LED灯结构除了散热器之外还包括反射杯，LED模块和盖。反射杯具有内底面，反射面，外底面和光出口。 LED模块是导热且固定地设置在内侧底面上。盖子覆盖了LED模块。散热片与外部底面热传导连接。 LED灯结构不仅具有光提取而且散热效率高。

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