专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US08143770B2 LED bulb structure having insertion end, and/or heat dissipation element, and/or heat-and-electricity separated element 有权
标题翻译：具有插入端的LED灯泡结构和/或散热元件和/或热电分离元件
公开(公告)号：US08143770B2
公开(公告)日：2012-03-27
申请号：US12441214
申请日：2006-09-13
申请人： Cheng-Wei Chan , Ming-Hung Chen , Shih-Yi Wen , Chun-Che Lee
发明人： Cheng-Wei Chan , Ming-Hung Chen , Shih-Yi Wen , Chun-Che Lee
IPC分类号： H01J61/52 , H01J5/50
CPC分类号： H01L33/647 , F21K9/00 , F21V19/0025 , F21V29/773 , F21Y2115/10 , H01L33/62 , H01L33/642 , H01L2224/48091 , H01L2924/3011 , H01L2924/00014
摘要： An LED bulb structure having an insertion end includes a first electrically conducting pin, a second electrically conducting pin having a die pad at an end thereof, and an LED unit electrically connected to the first electrically conducting pin and the second electrically conducting pin through a first leading wire and a second leading wire, respectively, and a cap enclosing the above-mentioned components and leaving part of the first electrically conducting pin and the second electrically conducting pin exposed thereoutside. The first and second electrically conducting pins are adapted to form bayonet connections. An LED bulb structure having a heat dissipation element has the heat dissipation element attached to the pin portions of the electrically conducting pins. An LED bulb structure having a heat-and-electricity separated element further has a thermally conducting pin.
摘要翻译：具有插入端的LED灯泡结构包括第一导电销，在其一端具有芯片焊盘的第二导电销以及通过第一导电销与第一导电销和第二导电销电连接的LED单元引线和第二引线，以及封闭上述部件的盖，并使第一导电销和第二导电销的一部分露出在外侧。第一和第二导电销适于形成卡口连接。具有散热元件的LED灯泡结构具有安装在导电销的销部分上的散热元件。具有热电分离元件的LED灯泡结构还具有导热销。

2. 发明申请

US20100060131A1 LED BULB STRUCTURE HAVING INSERTION END, AND/OR HEAT DISSIPATION ELEMENT, AND/OR HEAT-AND-ELECTRICITY SEPARATED ELEMENT 有权
标题翻译：具有插入端和/或散热元件的LED泡罩结构和/或热电偶分隔元件
公开(公告)号：US20100060131A1
公开(公告)日：2010-03-11
申请号：US12441214
申请日：2006-09-13
申请人： Cheng-Wei Chan , Ming-Hung Chen , Shih-Yi Wen , Chun-Che Lee
发明人： Cheng-Wei Chan , Ming-Hung Chen , Shih-Yi Wen , Chun-Che Lee
IPC分类号： H01J61/52 , H01J5/50
CPC分类号： H01L33/647 , F21K9/00 , F21V19/0025 , F21V29/773 , F21Y2115/10 , H01L33/62 , H01L33/642 , H01L2224/48091 , H01L2924/3011 , H01L2924/00014
摘要： An LED bulb structure having an insertion end includes a first electrically conducting pin, a second electrically conducting pin having a die pad at an end thereof, and an LED unit electrically connected to the first electrically conducting pin and the second electrically conducting pin through a first leading wire and a second leading wire, respectively, and a cap enclosing the above-mentioned components and leaving part of the first electrically conducting pin and the second electrically conducting pin exposed thereoutside. The first and second electrically conducting pins are adapted to form bayonet connections. An LED bulb structure having a heat dissipation element has the heat dissipation element attached to the pin portions of the electrically conducting pins. An LED bulb structure having a heat-and-electricity separated element further has a thermally conducting pin.
摘要翻译：具有插入端的LED灯泡结构包括第一导电销，在其一端具有芯片焊盘的第二导电销以及通过第一导电销与第一导电销和第二导电销电连接的LED单元引线和第二引线，以及封闭上述部件的盖，并使第一导电销和第二导电销的一部分露出在外侧。第一和第二导电销适于形成卡口连接。具有散热元件的LED灯泡结构具有安装在导电销的销部分上的散热元件。具有热电分离元件的LED灯泡结构还具有导热销。

3. 发明授权

US07910395B2 LED structure 有权
标题翻译： LED结构
公开(公告)号：US07910395B2
公开(公告)日：2011-03-22
申请号：US12441204
申请日：2006-09-13
申请人： Shih-Chang Shei , Ming-Hung Chen , Shih-Yi Wen , Chun-Che Lee
发明人： Shih-Chang Shei , Ming-Hung Chen , Shih-Yi Wen , Chun-Che Lee
IPC分类号： H01L21/00
CPC分类号： H01L27/156 , H01L33/385 , H01L33/44 , H01L33/62 , H01L2224/05001 , H01L2224/05009 , H01L2224/0557 , H01L2224/05571 , H01L2224/16225 , H01L2924/00014 , H01L2224/05599 , H01L2224/05099
摘要： An LED structure includes a first substrate; an adhering layer formed on the first substrate; first ohmic contact layers formed on the adhering layer; epi-layers formed on the first ohmic contact layers; a first isolation layer covering the first ohmic contact layers and the epi-layers at exposed surfaces thereof; and first electrically conducting plates and second electrically conducting plates, both formed in the first isolation layer and electrically connected to the first ohmic contact layers and the epi-layers, respectively. The trenches allow the LED structure to facilitate complex serial/parallel connection so as to achieve easy and various applications of the LED structure in the form of single structures under a high-voltage environment.
摘要翻译： LED结构包括第一基板; 形成在所述第一基板上的粘附层; 形成在粘附层上的第一欧姆接触层; 形成在第一欧姆接触层上的外延层; 覆盖其暴露表面的第一欧姆接触层和外延层的第一隔离层; 以及第一导电板和第二导电板，两者分别形成在第一隔离层中并电连接到第一欧姆接触层和外延层。沟槽允许LED结构促进复杂的串联/并联连接，以便在高压环境下以单结构的形式实现LED结构的简单和多种应用。

4. 发明申请

US20100059733A1 LED Structure 有权
标题翻译： LED结构
公开(公告)号：US20100059733A1
公开(公告)日：2010-03-11
申请号：US12441204
申请日：2006-09-13
申请人： Shih-Chang Shei , Ming-Hung Chen , Shih-Yi Wen , Chun-Che Lee
发明人： Shih-Chang Shei , Ming-Hung Chen , Shih-Yi Wen , Chun-Che Lee
IPC分类号： H01L33/00
CPC分类号： H01L27/156 , H01L33/385 , H01L33/44 , H01L33/62 , H01L2224/05001 , H01L2224/05009 , H01L2224/0557 , H01L2224/05571 , H01L2224/16225 , H01L2924/00014 , H01L2224/05599 , H01L2224/05099
摘要： An LED structure includes a first substrate; an adhering layer formed on the first substrate; first ohmic contact layers formed on the adhering layer; epi-layers formed on the first ohmic contact layers; a first isolation layer covering the first ohmic contact layers and the epi-layers at exposed surfaces thereof; and first electrically conducting plates and second electrically conducting plates, both formed in the first isolation layer and electrically connected to the first ohmic contact layers and the epi-layers, respectively. The first trenches or the second trenches allow the LED structure to facilitate complex serial/parallel connection so as to achieve easy and various applications of the LED structure in the form of single structures under a high-voltage environment.
摘要翻译： LED结构包括第一基板; 形成在所述第一基板上的粘附层; 形成在粘附层上的第一欧姆接触层; 形成在第一欧姆接触层上的外延层; 覆盖其暴露表面的第一欧姆接触层和外延层的第一隔离层; 以及第一导电板和第二导电板，两者分别形成在第一隔离层中并电连接到第一欧姆接触层和外延层。第一沟槽或第二沟槽允许LED结构促进复杂的串联/并联连接，以便在高压环境下以单结构的形式实现LED结构的简单和多种应用。

5. 发明授权

US07176457B2 MEMS differential actuated nano probe and method for fabrication 失效
标题翻译： MEMS微分致动纳米探针和制造方法
公开(公告)号：US07176457B2
公开(公告)日：2007-02-13
申请号：US11218425
申请日：2005-09-06
申请人： Shih-Yi Wen , Hsiao-Wen Lee , Jui-Ping Weng , Ming-Hung Chen
发明人： Shih-Yi Wen , Hsiao-Wen Lee , Jui-Ping Weng , Ming-Hung Chen
IPC分类号： G21K7/00
CPC分类号： G01Q10/045 , G01Q70/10 , Y10S977/872
摘要： A MEMS differential actuated nano probe includes four suspension beams arranged in parallel, a connecting base connecting to the suspension beams, a nano probe. Two of the suspension beams elongate due to thermal expansion to allow the deflection of the probe. By heating the suspension beams at different positions, the MEMS differential actuated nano probe can move in two directions with two degrees of freedom. The deflection of the MEMS differential actuated nano probe can be also achieved in piezoelectric or electrostatic way.
摘要翻译： MEMS差分致动纳米探针包括平行布置的四个悬架梁，连接到悬架梁的连接底座，纳米探针。悬挂梁中的两个由于热膨胀而伸长以允许探针的偏转。通过将悬架梁加热到不同位置，MEMS微分致动纳米探针可以在两个方向上以两个自由度移动。 MEMS差分致动纳米探针的偏转也可以以压电或静电方式实现。

6. 发明申请

US20100277932A1 Halation-Free Light-Emitting Diode Holder 审中-公开
标题翻译：无卤发光二极管座
公开(公告)号：US20100277932A1
公开(公告)日：2010-11-04
申请号：US12745974
申请日：2008-01-23
申请人： Ming-Hung Chen , Shih-Yi Wen , Hsin-Tai Lin , Jing-Yi Chen
发明人： Ming-Hung Chen , Shih-Yi Wen , Hsin-Tai Lin , Jing-Yi Chen
IPC分类号： F21V21/00
CPC分类号： H01L33/54 , H01L33/44 , H01L33/486 , H01L33/507 , H01L33/60 , H01L2924/0002 , H01L2924/00
摘要： A halation-free light-emitting diode holder includes a body and a retaining portion. The body has a die holder, which includes a first surface, a second surface, and an opened end. The retaining portion is provided on the second surface. By using the retaining portion, the optical gel in the die holder is blocked from capillary movement up along the second surface. Furthermore, having nano-material layers further formed on the second surface or having the area of the first surface made greater than the area of the opened-end also prevents the optical gel from climbing along the second surface. Thereby, a light halation circling a light pattern of the resultant light-emitting diode is avoided and the light-emitting diode is improved in luminance uniformity.
摘要翻译：无卤发光二极管保持器包括主体和保持部分。主体具有模具座，其包括第一表面，第二表面和开口端。保持部设置在第二表面上。通过使用保持部分，模具保持器中的光学凝胶被阻止毛细管沿着第二表面向上移动。此外，具有进一步形成在第二表面上或具有大于开口端面积的第一表面的面积的纳米材料层也防止光学凝胶沿着第二表面爬升。由此，避免了所产生的发光二极管的光图案的光晕，并且发光二极管的亮度均匀性得到改善。

7. 发明申请

US20060138436A1 Light emitting diode package and process of making the same 有权
公开(公告)号：US20060138436A1
公开(公告)日：2006-06-29
申请号：US11147185
申请日：2005-06-08
申请人： Ming-Hung Chen , Shih-Yi Wen , Wu-Cheng Kuo , Bing-Ru Chen , Jui-Ping Weng , Hsiao-Wen Lee
发明人： Ming-Hung Chen , Shih-Yi Wen , Wu-Cheng Kuo , Bing-Ru Chen , Jui-Ping Weng , Hsiao-Wen Lee
IPC分类号： H01L33/00 , H01L21/00
CPC分类号： H01L33/486 , H01L33/60 , H01L33/62 , H01L33/641 , H01L2224/16225 , H01L2224/48227 , H01L2924/00011 , H01L2924/00014 , H01L2924/3011 , H01L2924/3025 , H01L2224/48091 , H01L2924/00 , H01L2224/0401
摘要： A light emitting diode (LED) package and process of making the same includes a silicon-on-insulator (SOI) substrate that is composed of two silicon based materials and an insulation layer interposed therebetween. The two silicon based materials of silicon-on-insulator substrate are etched to form a reflective cavity and an insulation trench, respectively, for dividing the silicon-on-insulator substrate into contact surfaces of positive and negative electrodes. A plurality of metal lines are then formed to electrically connect the two silicon based materials such that the LED chip can be mounted on the reflective cavity and electrically connected to the corresponding electrodes of the silicon-on-insulator substrate by the metal lines. Thus the properties of heat resistance and heat dispersal can be improved and the process can be simplified.

8. 发明授权

US06995368B2 MEMS differential actuated nano probe and method for fabrication 失效
标题翻译： MEMS微分致动纳米探针和制造方法
公开(公告)号：US06995368B2
公开(公告)日：2006-02-07
申请号：US10795407
申请日：2004-03-09
申请人： Shih-Yi Wen , Hsiao-Wen Lee , Jui-Ping Weng , Ming-Hung Chen
发明人： Shih-Yi Wen , Hsiao-Wen Lee , Jui-Ping Weng , Ming-Hung Chen
IPC分类号： G21K7/00
CPC分类号： G01Q10/045 , G01Q70/10 , Y10S977/872
摘要： A MEMS differential actuated nano probe includes four suspension beams arranged in parallel, a connecting base connecting to the suspension beams, a nano probe. Two of the suspension beams elongate due to thermal expansion to allow the deflection of the probe. By heating the suspension beams at different positions, the MEMS differential actuated nano probe can move in two directions with two degrees of freedom. The deflection of the MEMS differential actuated nano probe can be also achieved in piezoelectric or electrostatic way.
摘要翻译： MEMS差分致动纳米探针包括平行布置的四个悬架梁，连接到悬架梁的连接底座，纳米探针。悬挂梁中的两个由于热膨胀而伸长以允许探针的偏转。通过将悬架梁加热到不同位置，MEMS微分致动纳米探针可以在两个方向上以两个自由度移动。 MEMS差分致动纳米探针的偏转也可以以压电或静电方式实现。

9. 发明申请

US20060016986A1 MEMS differential actuated nano probe and method for fabrication 失效
公开(公告)号：US20060016986A1
公开(公告)日：2006-01-26
申请号：US11218425
申请日：2005-09-06
申请人： Shih-Yi Wen , Hsiao-Wen Lee , Jui-Ping Weng , Ming-Hung Chen
发明人： Shih-Yi Wen , Hsiao-Wen Lee , Jui-Ping Weng , Ming-Hung Chen
IPC分类号： G01N23/00 , G21K7/00
CPC分类号： G01Q10/045 , G01Q70/10 , Y10S977/872
摘要： A MEMS differential actuated nano probe includes four suspension beams arranged in parallel, a connecting base connecting to the suspension beams, a nano probe. Two of the suspension beams elongate due to thermal expansion to allow the deflection of the probe. By heating the suspension beams at different positions, the MEMS differential actuated nano probe can move in two directions with two degrees of freedom. The deflection of the MEMS differential actuated nano probe can be also achieved in piezoelectric or electrostatic way.

10. 发明授权

US08269408B2 LED base structure with embedded capacitor 失效
标题翻译： LED基座结构，带嵌入式电容器
公开(公告)号：US08269408B2
公开(公告)日：2012-09-18
申请号：US13003702
申请日：2008-08-12
申请人： Ming-Hung Chen , Shih-Yi Wen , Jing-Yi Chen
发明人： Ming-Hung Chen , Shih-Yi Wen , Jing-Yi Chen
IPC分类号： H01L33/62 , H01L33/36 , H01L33/00
CPC分类号： H01L33/486 , H01L25/0753 , H01L25/167 , H01L33/62 , H01L2924/0002 , H05B33/0821 , H01L2924/00
摘要： An LED base structure with an embedded capacitor includes a body, at least one pair of metal layers, at least one dielectric layer, and at least two conductive channels. The body is an insulating base. The metal layers are disposed in the body, and the dielectric layer is disposed between the metal layers, so as to form an embedded capacitor. The conductive channels are electrically connected to the metal layers, respectively. The LED base structure is further electrically connected to a resistor for forming a resistor-capacitor delay circuit whereby a phase delay is effectuated whenever AC power is supplied to the LED base structure, so as to control the time for switching on one of two parallel-connected LEDs and, as a result, prevent the LEDs from flashing which might otherwise arise when the LEDs are supplied with AC power.
摘要翻译：具有嵌入式电容器的LED基座结构包括主体，至少一对金属层，至少一个电介质层和至少两个导电沟道。身体是绝缘基座。金属层设置在主体中，并且电介质层设置在金属层之间，以便形成嵌入式电容器。导电通道分别电连接到金属层。 LED基座结构进一步电连接到用于形成电阻器 - 电容器延迟电路的电阻器，由此每当向LED基座结构提供AC电力时，实现相位延迟，以便控制用于切换两个并联电路中的一个的时间，连接的LED，从而防止LED闪烁，否则当LED被提供交流电源时可能会发生。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式