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1. 发明授权

US09449265B1 RFID tags with port-dependent functionality 有权
标题翻译：具有端口相关功能的RFID标签
公开(公告)号：US09449265B1
公开(公告)日：2016-09-20
申请号：US13651109
申请日：2012-10-12
申请人： Impinj International Ltd.
发明人： Yael Maguire , Ronald A. Oliver , Christopher J. Diorio
IPC分类号： G05B11/01 , G08C19/16 , G08C19/02 , G08C19/12 , H03K17/62 , H03K19/018 , G06K19/07 , H01Q1/24 , G06K19/077 , H01Q1/22 , H01Q21/30
CPC分类号： G06K19/0724 , G06K19/0719 , G06K19/07767 , H01Q1/2225 , H01Q1/248 , H01Q21/30 , H04Q2213/095
摘要： An Integrated Circuit (IC) for an RFID tag includes at least two antenna ports for coupling to at least two antennas. The IC may be configured to determine the port from which it receives an input signal, and provide a first functionality if it receives the input from a first port and a second functionality if it receives the input from a second port. The IC may be configured to determine and/or offer a functionality based on the receiving port.
摘要翻译：用于RFID标签的集成电路（IC）包括用于耦合到至少两个天线的至少两个天线端口。 IC可以被配置为确定其从其接收输入信号的端口，并且如果其从第一端口接收到输入并且如果其从第二端口接收到输入则提供第二功能。 IC可以被配置为基于接收端口来确定和/或提供功能。

2. 发明授权

US09436902B1 RFID integrated circuits with large contact pads 有权
标题翻译： RFID集成电路与大接触垫
公开(公告)号：US09436902B1
公开(公告)日：2016-09-06
申请号：US14451416
申请日：2014-08-04
申请人： Impinj, International Ltd.
发明人： Ronald Lee Koepp , Tan Mau Wu , Ronald A. Oliver , Harley Heinrich , Jaideep Mavoori , Christopher J. Diorio
IPC分类号： H01Q1/38 , G06K19/077 , H01Q23/00
CPC分类号： G06K19/07752 , G06K19/07722 , G06K19/07754 , H01L2224/16225 , H01Q1/2283 , H01Q23/00
摘要： An RFID IC assembly having a repassivation layer and a conductive redistribution layer may be assembled onto a tag substrate with an additional layer. The additional layer includes one or more etchants for creating an opening in a nonconductive barrier layer between the assembly and the substrate, and may also include an adhesive for attaching the assembly to the substrate.
摘要翻译：具有再钝化层和导电再分配层的RFID IC组件可以用附加层组装到标签衬底上。附加层包括用于在组件和衬底之间的非导电阻挡层中形成开口的一个或多个蚀刻剂，并且还可以包括用于将组件附接到衬底的粘合剂。

3. 发明授权

US09460380B1 RFID integrated circuits with large contact pads 有权
标题翻译： RFID集成电路与大接触垫
公开(公告)号：US09460380B1
公开(公告)日：2016-10-04
申请号：US14451412
申请日：2014-08-04
申请人： Impinj, Inc.
发明人： Ronald Lee Koepp , Tan Mau Wu , Ronald A. Oliver , Harley Heinrich , Jaideep Mavoori , Christopher J. Diorio
IPC分类号： G06K19/07 , G06K19/077 , H01Q23/00
CPC分类号： G06K19/07752 , G06K19/07722 , G06K19/0775 , G06K19/07754 , H01P11/00 , H01Q1/2208 , H01Q23/00 , H05K3/321 , H05K2201/10098 , Y10T29/49002 , Y10T29/49016
摘要： Technologies are generally directed to assembly of a Radio Frequency Identification (RFID) tag precursor. An assembly may be provided, the assembly having an RFID integrated circuit (IC), a nonconductive repassivation layer on a surface of the IC and confined within a perimeter of the surface, and a conductive redistribution layer on the repassivation layer and confined within the perimeter of the surface, in which a first portion of the redistribution layer is electrically connected to the IC through a first electrical connection. A substrate having a first antenna terminal to the assembly may be attached with an adhesive, and at least a first portion of a nonconductive barrier present on at least one of the first antenna terminal and the first portion of the redistribution layer may be reacted with a reactant to make the first portion of the nonconductive barrier conductive. A second electrical connection may then be formed between the first antenna terminal and the first portion of the redistribution layer through the first portion of the nonconductive barrier.
摘要翻译：技术通常涉及射频识别（RFID）标签前体的组装。可以提供一种组件，该组件具有RFID集成电路（IC），IC表面上的非导电再钝化层，并限制在表面的周边内，以及在再钝化层上并限制在周边内的导电再分配层其中再分布层的第一部分通过第一电连接与IC电连接。具有到组件的第一天线端子的衬底可以用粘合剂附着，并且存在于再分布层的第一天线端子和第一部分中的至少一个上的非导电屏障的至少第一部分可以与反应物以使非导电屏障的第一部分导电。然后可以在第一天线端子和再分配层的第一部分之间通过非导电屏障的第一部分形成第二电连接。

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